Abstract:
PURPOSE: A wafer processing method, a recording medium for executing the same, a wafer processing apparatus, and a wafer processing system are provided to regularly maintain a width size of an area from which a coating layer is eliminated in a peripheral portion of a wafer without need to install a position determination sensor for each module. CONSTITUTION: A rinse fluid supply part(80) supplies a rinse liquid on a surface of a peripheral portion of a wafer(W) held and supported by a spin chuck(61). A coating film on a location where the rinse liquid is provided is selectively removed. A detection part is installed in a wafer transfer part. A detection part detects the location of the peripheral portion of the wafer when the wafer is transferred by the wafer transfer part in advance. The detection part determines the location of the rinse fluid supply part based on the detected location.
Abstract:
PURPOSE: A coating and developing apparatus, a coating and developing method, and a storage medium are provided to reduce the installation area of an apparatus by being formed to convert a negative developing process and a positive developing process. CONSTITUTION: A substrate carried with a carrier(C) is delivered to a processing block(S20). A coating film including a resist film is formed in the processing block. The substrate is carried to an exposure apparatus through an interface block(S7). The substrate coming back through the interface block after exposure is developed in the processing block. The substrate is delivered to a carrier block(S1).
Abstract:
PURPOSE: A coating and developing apparatus, a method thereof, and a memory medium are provided to apply a unit block for a dual developing process, thereby suppressing the degradation of operation efficiency of the coating and developing apparatus. CONSTITUTION: A carrier block(S1) comprises a loading stand(11) which loads a carrier(C), an opening and closing part(12), and a transfer arm. The transfer arm comprises five wafer holding support parts in up and down directions. A processing block(S2) comprises unit blocks(B1-B6) which perform liquid processing process in a wafer. The unit block comprises a heating module, a main arm, and a return region. A liquid processing unit comprises an antireflection film formation module(BCT1, 2) and a resist film formation module(COT1,2).
Abstract:
본 발명의 과제는 천정판이 승강하지 않아도 면내 균일성이 높은 가열 처리를 행하는 가열 장치 및 가열 방법을 제공하는 것이다. 기판을 적재하여 가열하기 위한 열판과, 이 열판의 상방에 기판과 간격을 두고 대향하도록 설치되고, 기판의 피가열 처리 영역보다도 큰 정류용 천정판과, 천정판의 내부에 기판측으로부터의 열을 단열하기 위해 형성된 진공 영역과, 상기 열판에 적재된 기판과 상기 천정판 사이에 기류를 형성하기 위한 기류 형성 수단을 구비하도록 가열 장치를 구성한다. 내부에 진공 영역이 마련된 천정판을 이용하고 있으므로 열판측으로부터의 열이 도피되기 어렵고, 천정판과 열판 사이의 주위를 개방한 상태로 해도 천정판의 하면의 온도를 기판의 온도에 근접시킬 수 있어, 기판과 천정판의 하면의 온도차가 확대되는 것이 억제된다. 그 결과로서 상기 기류가 냉각됨으로써 난류가 되는 것을 막을 수 있으므로 기판에 대해 면내 균일성이 높은 가열 처리를 행할 수 있다.
Abstract:
A coating and developing system, a coating and developing method, and a storage medium are provided to adjust easily a processing speed by increasing or reducing the number of processing blocks arranged between a carrier block and an interface block. A processing station is installed between a carrier block(S1) and an interface block(S6) and includes at least two processing blocks of the same construction. Each of the processing blocks is built by stacking a plurality of unit blocks including a film forming unit block and a developing unit block, and is arranged longitudinally contiguously between the carrier block on a front side and the interface block on a back side along a substrate carrying passage of a substrate. A transfer unit group is installed at a position corresponding to each unit block in a front side within the processing blocks in order to transfer a substrate between the stacked unit blocks of the processing blocks. The transfer unit group includes a plurality of transfer units for transferring the substrate by using a substrate carrying unit of each unit block. Transfer arms(D1,D2,D3) are installed at the processing blocks, respectively. Inlet/outlet transfer units are installed to transfer the substrate between the carrier block and the processing block or between the adjacent processing blocks. Direct carrying unit is installed in each of the processing blocks in order to carry the substrate exclusively between the inlet and outlet transfer unit of the processing block and the inlet and outlet transfer unit of the processing block behind and adjacent to the prior processing block.