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公开(公告)号：KR101340544B1
公开(公告)日：2013-12-11
申请号：KR1020100131856
申请日：2010-12-21
Applicant: 제일모직주식회사
IPC: C09J133/04 , C09J163/00 , C09J7/02 , C09J9/00
Abstract: 본 발명은 아크릴계 수지, 에폭시계 수지, 방향족 아민계 경화제, 실란 커플링제 및 충진제를 특정 함량으로 포함시켜, 경화 속도를 늦춤으로써 경화 후에도 낮은 용융 점도와 높은 잔존 경화율을 유지하여 EMC 몰딩 과정에서도 보이드를 제거함으로써 높은 신뢰성을 확보하도록 하는 반도체 접착 필름용 조성물에 관한 것이다.
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公开(公告)号：KR1020130070964A
公开(公告)日：2013-06-28
申请号：KR1020110138245
申请日：2011-12-20
Applicant: 제일모직주식회사
IPC: C09J7/02 , C09J133/04 , C08F20/10 , H01L21/58
CPC classification number: C08F20/10 , C08L33/10 , H01L21/6836 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L2221/68327 , H01L2221/68386 , H01L2224/2919 , H01L2224/32225 , H01L2224/8385 , H01L2224/92 , H01L2224/94 , H01L2224/27 , H01L21/78 , H01L2224/83 , C08L33/066 , C08L33/14 , C09J7/38 , C09J7/22 , C09J7/385 , C09J133/04 , C09J2201/606 , C09J2201/622 , C09J2203/326 , C09J2205/30
Abstract: PURPOSE: A non-UV type dicing die bonding film is provided to show an excellent pick-up characteristic, and to be able to maintain the adhesiveness to a ring frame without separation from the ring frame and the water leaching. CONSTITUTION: A non-UV type dicing die-bonding film comprises acrylic copolymer and a thermosetting material. The acrylic copolymer comprises (a) 55-99 parts by weight of alkyl acrylate monomer; (b) 5-30 parts by weight of acrylate monomer having hydroxyl group; and (c) 1-15 parts by weight of polyethyleneglycol (meth)acrylate to 100.0 parts by weight of the acrylic copolymer. The total content of the acrylate monomer having hydroxyl group and polyethyleneglycol (meth)acrylate to 100.0 parts by weight of the acrylic copolymer is 20-40 parts by weight.
Abstract translation: 目的：提供非UV型切割芯片接合膜，以显示出优良的拾取特性，并且能够保持与环形框架的粘合性而不会与环形框架分离和水浸。 构成：非UV型切割芯片接合薄膜包括丙烯酸共聚物和热固性材料。 丙烯酸共聚物包含（a）55-99重量份的丙烯酸烷基酯单体; （b）5-30重量份具有羟基的丙烯酸酯单体; 和（c）1-15重量份聚乙二醇（甲基）丙烯酸酯与100.0重量份的丙烯酸共聚物。 具有羟基的丙烯酸酯单体和聚乙二醇（甲基）丙烯酸酯与丙烯酸共聚物100.0重量份的总含量为20-40重量份。
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公开(公告)号：KR1020130063155A
公开(公告)日：2013-06-14
申请号：KR1020110129522
申请日：2011-12-06
Applicant: 제일모직주식회사
IPC: C09J201/00 , C09J11/00 , C09J7/02 , H01L21/02
CPC classification number: C08L63/00 , C08G59/5033 , C08G59/56 , C08G59/621 , C09J163/00 , H01L21/56 , H01L21/6836 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L2224/2929 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2224/83101 , H01L2224/92247 , H01L2225/06506 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , C09J201/00 , C09J7/22 , C09J7/30 , C09J7/35 , C09J11/00 , C09J2203/326 , H01L21/02002
Abstract: PURPOSE: An adhesive composition is provided to reduce process time by not generating reliability loss due to a quick curing rate even when reducing or excluding a semi-curing process after adhesion. CONSTITUTION: An adhesive composition comprises 60-80 wt% of a thermoplastic resin, based on total solid weight of the adhesive composition, and comprises a phenol hardener and an amine hardener. The storage elasticity after 20 minutes at 150 °C is 2 MPa or more. The reaction curing rate of the adhesive composition is 50% or more. The void after 120 seconds molding at 175 °C is 10% or less. The weight ratio of the phenol hardener and amine curing agent is 3:1-1:11. The adhesive composition additionally includes the adhesive composition.
Abstract translation: 目的：提供粘合剂组合物，以便即使在粘合后减少或排除半固化过程，也不会由于快速固化速率而产生可靠性损失，从而缩短加工时间。 构成：基于粘合剂组合物的总固体重量，粘合剂组合物包含60-80重量％的热塑性树脂，并且包含酚硬化剂和胺硬化剂。 150℃下20分钟后的储存弹性为2MPa以上。 粘合剂组合物的反应固化速度为50％以上。 在175℃下成型120秒后的空隙为10％以下。 酚类固化剂和胺类固化剂的重量比为3：1-1：11。 粘合剂组合物另外包括粘合剂组合物。
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公开(公告)号：KR101033045B1
公开(公告)日：2011-05-09
申请号：KR1020090134713
申请日：2009-12-30
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J7/02 , H01L21/58
CPC classification number: C09J163/00 , C08L33/04 , C08L61/06 , C08L2205/03 , Y10T428/31515 , C09J7/00 , C09J2203/326
Abstract: PURPOSE: A bonding film composition for a semiconductor assembly is provided to improve void removal ability and to enable stable wire bonding by controlling a curing reaction heat generation start temperature and the viscosity after curing. CONSTITUTION: A bonding film composition for a semiconductor assembly includes a polymer binder resin, epoxy-based resin, phenol type epoxy hardener, curing catalyst, silane coupling agent and inorganic filler. The curing reaction heat generation start temperature is 300 °C or greater. The melting point at 175 °C after curing at 150 °C for 1 hour and the melting point at 175 °C after curing at °C for 2 hours is 1.0×10^5 - 5.0×10^6 poise.
Abstract translation: 目的：提供一种用于半导体组件的接合膜组合物，以通过控制固化反应发热开始温度和固化后的粘度来提高空隙去除能力并实现稳定的引线接合。 构成：用于半导体组合物的接合膜组合物包括聚合物粘合剂树脂，环氧基树脂，酚型环氧固化剂，固化催化剂，硅烷偶联剂和无机填料。 固化反应发热开始温度为300℃以上。 在150℃下固化1小时后，175℃下的熔点为175℃，在2℃下固化2小时后的熔点为1.0×10 ^ 5〜5.0×10 ^ 6泊。
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公开(公告)号：KR1020100079038A
公开(公告)日：2010-07-08
申请号：KR1020080137444
申请日：2008-12-30
Applicant: 제일모직주식회사
Inventor： 최재원
Abstract: PURPOSE: A liquid epoxy resin composition and a semiconductor device using thereof are provided to effectively remove bubbles generated during an under-filling process by decreasing a contacting angle. CONSTITUTION: A liquid epoxy resin composition for under-filling a semiconductor device contains an epoxy resin, a hardener, a curing accelerator, and an additive. The additive is an acrylic additive marked with chemical formula 1. In the chemical formula 1, R` is either hydrogen or methyl. R`` is an alkyl group, polyester, polyether, or amine salt. The average value of n is 10~100.
Abstract translation: 目的：提供一种液体环氧树脂组合物及其使用的半导体装置，以通过减小接触角度来有效地除去在填充过程中产生的气泡。 构成：用于低填充半导体装置的液体环氧树脂组合物含有环氧树脂，硬化剂，固化促进剂和添加剂。 添加剂是用化学式1表示的丙烯酸添加剂。在化学式1中，R'是氢或甲基。 R'是烷基，聚酯，聚醚或胺盐。 n的平均值为10〜100。
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Patent Agency Ranking
公开(公告)号：KR1020150025991A
公开(公告)日：2015-03-11
申请号：KR1020130104242
申请日：2013-08-30
Applicant: 제일모직주식회사
IPC: C09J7/00 , C09J163/00 , H01L21/02
CPC classification number: C09J7/00 , C09J9/00 , C09J163/00 , C09J2203/326 , H01L21/02
Abstract: The purpose of the present invention is to provide an adhesive composition for a semiconductor and an adhesive film, which can achieve attach void free or cure void free and can inhibit expansion and generation of void according to control of hardening speed. The present invention relates to an adhesive film for a semiconductor comprising an adhesive layer, which includes: a binder resin; a polyfunctional first epoxy resin; a monofunctional second epoxy resin; a hardener; and a hardening accelerator, and to a semiconductor device connected by the film.
Abstract translation: 本发明的目的是提供一种用于半导体和粘合剂膜的粘合剂组合物，其可以实现无空隙或固化无空隙，并且可以根据硬化速度的控制来抑制空隙的膨胀和产生。 本发明涉及一种包含粘合剂层的半导体粘合膜，其包括：粘合剂树脂; 多官能第一环氧树脂; 单官能第二环氧树脂; 硬化剂 和硬化促进剂，以及通过该膜连接的半导体器件。
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公开(公告)号：KR101355853B1
公开(公告)日：2014-01-29
申请号：KR1020110079682
申请日：2011-08-10
Applicant: 제일모직주식회사
IPC: C09J11/08 , C09J163/00 , H01L21/60 , H01L21/02
Abstract: 본 발명은 반도체용 접착 조성물 및 이를 포함하는 접착 필름에 관한 것이다. 보다 구체적으로는 경화제로 수산기 150g/eq 이하의 페놀 경화제와 수산기 150g/eq 초과의 페놀 경화제를 배합하여 사용함으로써 EMC(epoxy molding compound) 몰딩 후 보이드가 5% 이하이고, 전단강도가 5 내지 20 kgf 인 반도체용 접착 조성물 및 이를 포함하는 접착 필름에 관한 것이다.
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公开(公告)号：KR1020130075189A
公开(公告)日：2013-07-05
申请号：KR1020110143455
申请日：2011-12-27
Applicant: 제일모직주식회사
CPC classification number: H01L23/544 , C09J7/20 , C09J2201/28 , C09J2201/36 , C09J2203/326 , H01L21/6836 , H01L21/70 , H01L24/27 , H01L2221/68327 , H01L2224/83191 , C09J7/22 , C09J7/30 , C09J2205/10
Abstract: PURPOSE: A dicing die bonding film is provided to prevent the degradation of adhesion and separation between a film and a ring frame by removing water and/or air being put in during a semiconductor-manufacturing process through a groove formed on the adhesive part between the film and the ring frame. CONSTITUTION: A dicing die bonding film includes a substrate film; an adhesive film laminated on the substrate film; a viscous layer (110,120); an adhesive layer (130) laminated on the viscous layer; and a release film laminated on the adhesive film. A groove (300) is formed on the adhesive part between the viscous layer and a ring frame. A manufacturing method of the dicing die bonding film includes a step of forming the groove on the dicing die bonding film by inserting a blade, which penetrates through the substrate film and a part of the viscous layer, on which the adhesive layer is not laminated, up to a height not penetrating the release film.
Abstract translation: 目的：提供一种切割芯片接合薄膜，以通过除去在半导体制造过程中通过形成在粘合剂部分之间的凹槽中的水和/或空气而防止薄膜和环形框架之间的粘附和分离 电影和戒指框架。 构成：切割芯片接合膜包括基板膜; 层压在基材膜上的粘合膜; 粘性层（110,120）; 层压在粘性层上的粘合剂层（130）; 以及层压在粘合膜上的剥离膜。 在粘性层和环形框架之间的粘合部分上形成有凹槽（300）。 切割芯片接合薄膜的制造方法包括以下步骤：通过插入贯穿基片薄膜的粘合层和不粘合层的粘合层的一部分，形成切割晶片接合薄膜上的凹槽， 达到不渗透释放膜的高度。
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公开(公告)号：KR1020130075188A
公开(公告)日：2013-07-05
申请号：KR1020110143454
申请日：2011-12-27
Applicant: 제일모직주식회사
IPC: C09J7/00 , C09J201/00 , C09J163/00 , H01L21/02
CPC classification number: C09J163/00 , C08G59/50 , C08G59/621 , C08K5/0025 , C08K5/18 , C08L61/06 , C09J7/10 , C09J2201/622 , C09J2203/326 , C09J2205/102 , C09J2400/22 , C09J2461/00 , C09J2463/00 , H01L24/29 , H01L24/32 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/29387 , H01L2224/29388 , H01L2224/32145 , H01L2224/32225 , H01L2224/83851 , H01L2224/83862 , H01L2924/0665 , H01L2924/00014
Abstract: PURPOSE: An adhesive film is provided to remove a PCB baking process and a PCB plasma process by expressing proper adhesive force only with a chip adhering process. CONSTITUTION: A semiconductor adhesive film has die share intensity after adhering a chip greater than 4 kgf/chip at 120 deg. C for 5 seconds, and greater than 2×10^6dyne/cm^2 at 150 deg. C after more than 20 minutes. An adhesive composition for a semiconductor contains 51-80 parts of thermoplastic resin by weight, 5-20 parts of epoxy resin by weight, 2-10 parts of phenol type hardened resin by weight, 2-10 parts of amine-based hardened resin by weight, and 0.1-10 parts of hardening accelerator for 100 parts of solid portion by weight.
Abstract translation: 目的：提供粘合膜，通过仅通过芯片粘附工艺表达适当的粘合力来去除PCB烘烤工艺和PCB等离子体工艺。 构成：半导体粘合膜在120度附着大于4kgf /芯片的芯片后具有芯片共享强度。 在150度下大于2×10 ^ 6dyne / cm 2。 C超过20分钟。 半导体用粘合剂组合物含有51-80重量份热塑性树脂，5-20重量份环氧树脂，2-10重量份苯酚型硬化树脂，2-10份胺基硬化树脂， 重量和0.1-10份硬化促进剂，用于100份固体重量份。
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公开(公告)号：KR1020130073190A
公开(公告)日：2013-07-03
申请号：KR1020110140904
申请日：2011-12-23
Applicant: 제일모직주식회사
IPC: H01L21/48 , H01L21/301
CPC classification number: H01L21/6836 , C08K3/08 , C08K3/22 , C09J7/20 , C09J2203/326 , C09J2205/102 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/27436 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/32225 , H01L2224/83191
Abstract: PURPOSE: A dicing die-bonding film and a semiconductor device are provided to improve pick-up process, by suppressing twisting phenomenon of a wafer in the process. CONSTITUTION: A bonding layer is stacked on an adhesive layer. The adhesive layer contains filler of a heavy part. The heavy part is constituted with solid content 100 of the adhesive layer. The filler is constituted with 0.1 to 10. The filler includes silica phosphorus.
Abstract translation: 目的：通过抑制该工艺中晶片的扭转现象，提供切割芯片接合膜和半导体器件以改善拾取过程。 构成：粘合层层叠在粘合剂层上。 粘合剂层含有重部分的填料。 重部分由粘合剂层的固体成分100构成。 填料由0.1至10构成。填料包括二氧化硅磷。
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