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公开(公告)号：DE69838327T2
公开(公告)日：2008-05-21
申请号：DE69838327
申请日：1998-10-30
Applicant: IBM
Inventor： HAEBERLE WALTER , LUTWYCHE MARK I , VETTIGER PETER
IPC: G05D3/00 , H02K41/03 , H02K41/035 , H02N11/00
Abstract: A scanning or positioning system with at least two degrees of freedom is provided comprising a supporting base (6) equipped with magnets (7.1), a movable platform (1) equipped with at least two electrical coils (2) and suspension elements (4) providing an elastic connection between the movable platform and the supporting base. The electrical coils (2) are positioned flat on the movable platform (1), thereby forming an essentially flat arrangement with the movable platform. Combining the flat arrangement with the flat supporting base yields a scanning or positioning system which is potentially compact, lightweight and flat and which features fast response, low power consumption and a relatively large range of motion, e.g. up to 10mm. The scanning or positioning system with at least two degrees of freedom can be used in the field of scanning probe microscopy or in the field of data storage or imaging.
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公开(公告)号：DE60209333T2
公开(公告)日：2006-11-09
申请号：DE60209333
申请日：2002-03-15
Applicant: IBM
Inventor： BINNIG K , HAEBERLE WALTER , VETTIGER PETER
Abstract: A method for writing data to and/or reading data from locations on a surface via a tip comprises moving the tip between the locations on the surface. At each location, energy is selectively applied to the surface via the tip and the tip and the surface are selectively forced together in synchronization with the application of energy.
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公开(公告)号：DE60115272D1
公开(公告)日：2005-12-29
申请号：DE60115272
申请日：2001-09-13
Applicant: IBM
Inventor： BINNIG K , HAEBERLE WALTER , VETTIGER PETER
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公开(公告)号：AU2002309106A1
公开(公告)日：2003-02-24
申请号：AU2002309106
申请日：2002-06-07
Applicant: IBM
Inventor： ROTHUIZEN HUGO E , DESPONT MICHEL , DRECHSLER UTE , VETTIGER PETER , WIDMER ROLAND W
Abstract: A microsystem switch ( 1, 20, 25, 30, 33 ) has a support ( 2 ) defining a recess ( 3 ), and a flexible bridge ( 6 ) is mounted on the support ( 2 ) bridging the recess ( 3 ). The bridge ( 6 ) is shaped so as to hold selectively a concave stable state, in which the bridge bulges into the recess ( 3 ), and a convex stable state in which the bridge bulges out of the recess ( 3 ). The switch includes an actuator ( 8, 9; 26, 27 ) for effecting flexing of the bridge ( 6 ) between the stable states, and a switching element ( 7, 31, 34 ) is mounted on the bridge ( 6 ) such that movement of the bridge between the stable states moves the switching element between an on position and an off position. According to another design, a microsystem switch ( 40, 55 ) has a support ( 41 ) defining a recess ( 42 ), and an elongate torsion member ( 44 ) is mounted on the support ( 41 ) bridging the recess ( 42 ). A flexible bridge ( 43, 56 ) is mounted on the support ( 41 ) bridging the recess ( 42 ) in a direction substantially perpendicular to the torsion member ( 44 ). The bridge ( 43, 56 ) is connected to the torsion member ( 44 ) at the cross-point thereof so that a first section of the bridge extends between the cross-point and one side of the recess ( 42 ) and a second section of the bridge extends between the cross-point and the opposite side of the recess ( 42 ). The bridge ( 43, 56 ) is shaped so as to hold selectively a first stable state, in which the first section of the bridge bulges into the recess and the second section of the bridge bulges out of the recess, and a second stable state in which this configuration is reversed. A switching element ( 45 ) is mounted at the cross-point of the bridge ( 43, 56 ) and torsion member ( 44 ), and an actuator ( 46 a, 46 b; 58 a, 58 b) is again provided for effecting flexing of the bridge ( 43, 56 ) between the stable states. Here, movement of the bridge ( 43, 56 ) between the stable states effects twisting of the torsion member ( 44 ) and rotation of the switching element ( 45 ) between an on position and an off position. Switching devices incorporating these switches, and switching apparatus comprising arrays of such switching devices, are also provided.
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公开(公告)号：AU8001301A
公开(公告)日：2002-03-26
申请号：AU8001301
申请日：2001-08-29
Applicant: IBM
Inventor： BINNING GERD K , BONA GIAN-LUCA , HABERLE WALTER , VETTIGER PETER
Abstract: An optical device comprises a substrate having a plane surface. An optical path is disposed on the substrate and extends in a plane parallel to the surface of the substrate. A recess intercepts the optical path. An optical element is provided for modifying light incident thereon. The optical element is moveable within the recess between a first position in which the optical element is located in the path and a second position in which optical element is remote from the path. A cantilever suspends the optical element for movement within the recess between the second and first positions in a direction normal to the surface of the substrate.
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Patent Agency Ranking
公开(公告)号：DE69006353T2
公开(公告)日：1994-06-23
申请号：DE69006353
申请日：1990-05-25
Applicant: IBM
Inventor： BROOM RONALD F DR , GASSER MARCEL , HARDER CHRISTOPH DR , LATTA ERNST-EBERHARD DR , OOSENBRUG ALBERTUS , RICHARD HEINZ , VETTIGER PETER
IPC: B28D5/00 , H01L21/301 , H01S5/00 , H01S5/02 , H01L21/00
Abstract: A method for cleaving semiconductor wafers, or segments thereof, which comprises placing the wafer (11), provided with scribe lines (15) defining the planes where cleaving is to take place, inbetween a pair of flexible transport bands (12,13) and guiding it around a curved, large radius surface (21) thereby applying a bending moment. With a moment of sufficient magnitude, individual bars (22) are broken off the wafer as this is advanced, the bars having front- and rear-end facets. On cleaving, each bar, while still pressed against the curved surface, is automatically separated whereby mutual damage of the facets of neighbouring bars is prevented. For further handling, e.g. for the transport of the bars to an evaporation station for passivation layer deposition, provisions are made to keep the bars separated. Cleaving and the subsequent passivation coating can be carried out in-situ in a vacuum system to prevent facet contamination prior to applying the passivation.
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公开(公告)号：DE69006353D1
公开(公告)日：1994-03-10
申请号：DE69006353
申请日：1990-05-25
Applicant: IBM
Inventor： BROOM RONALD F DR , GASSER MARCEL , HARDER CHRISTOPH DR , LATTA ERNST-EBERHARD DR , OOSENBRUG ALBERTUS , RICHARD HEINZ , VETTIGER PETER
IPC: B28D5/00 , H01L21/301 , H01S5/00 , H01S5/02 , H01L21/00
Abstract: A method for cleaving semiconductor wafers, or segments thereof, which comprises placing the wafer (11), provided with scribe lines (15) defining the planes where cleaving is to take place, inbetween a pair of flexible transport bands (12,13) and guiding it around a curved, large radius surface (21) thereby applying a bending moment. With a moment of sufficient magnitude, individual bars (22) are broken off the wafer as this is advanced, the bars having front- and rear-end facets. On cleaving, each bar, while still pressed against the curved surface, is automatically separated whereby mutual damage of the facets of neighbouring bars is prevented. For further handling, e.g. for the transport of the bars to an evaporation station for passivation layer deposition, provisions are made to keep the bars separated. Cleaving and the subsequent passivation coating can be carried out in-situ in a vacuum system to prevent facet contamination prior to applying the passivation.
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公开(公告)号：DE3370697D1
公开(公告)日：1987-05-07
申请号：DE3370697
申请日：1983-04-05
Applicant: IBM
Inventor： VETTIGER PETER , WILSON ALAN DICKSON
IPC: G01N21/88 , G01B15/00 , G01N21/956 , H01J37/304 , H01L21/027 , H01L21/66 , G03B41/00
Abstract: An electron beam fabricated mask used in the production of integrated circuits is tested by a method that includes the steps of forming a print of the mask and then inspecting the print by writing the same electron beam pattern or complement thereof on the print and detecting pattern coincidence and non-coincidence with a vector scan system.The drawing shows apparatus for testing the print of the mask. The print is carried by substrate 14 mounted on XY table 24. The print is scanned by electron beam 28 under the control of pattern generator 30. Digital signals from the generator are changed to analogue signals by D/A converter 32, amplified at 34 and applied to deflection coil 35. Scattered electrons are received by detector 37, the video signal amplified in 36 and passed to compare unit 38. Unit 38 receives a correct input from the generator 30 and this is compared with the actual signal from video 36. The compare output is validated by being AND'ed with a further signal from the generator 30. The output of the AND gate is stored in defect catalog 42.
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公开(公告)号：CH638067A5
公开(公告)日：1983-08-31
申请号：CH1292378
申请日：1978-12-20
Applicant: IBM
Inventor： BAPST URS , GFELLER FRITZ DR , VETTIGER PETER
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公开(公告)号：CA1124798A
公开(公告)日：1982-06-01
申请号：CA339220
申请日：1979-11-06
Applicant: IBM
Inventor： BAPST URS H , GFELLER FRITZ , VETTIGER PETER
Abstract: ARRANGEMENT FOR SEPARATING AN OPTICAL SIGNAL FROM AMBIENT LIGHT An arrangement for separating ambient light from an optical data signal, comprising an interference filter having a passband which matches the wavelength of the optical data signal, and two photo diodes which are so arranged that one photo diode receives the light transmitted through the interference filter, and the other receives the light reflected from the filter. A variable aperture or an additional simple filter (5) is provided to adjust the transmitted and reflected portions of the ambient light to one another. Output signals of the photo diodes are subtracted from each other in a compensation circuit. This results in compensation of the ambient light components so that an output signal from the compensation circuit only depends on the actual data signal. SZ9-78-003
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