Abstract:
It has been problematic that in a use environment of an image processing system in which temperature fluctuation or vibration occurs, it is highly probable that the subject of image recognition would not be imaged accurately because the relative position of an imaging device and a lens could be changed due to, for example, thermal stress resulting from a difference in the coefficient of linear expansion between a structural member that abuts on the imaging device and an adhesive and between the adhesive and the imaging device, stress resulting from vibration, or peeling of the adhesive resulting from deterioration of such adhesive. In a camera unit having a lens 6 and an imaging device 1, the imaging device 1 is fixed by means of a base plate 2, an elastic material 3, and a printed circuit board 4. The imaging device 1 abuts on a first plane of the base plate 2, and the elastic material 3 is sandwiched between the printed circuit board 4 and a second plane opposite to the first plane of the base plate 2.
Abstract:
L'invention a pour objet un dispositif support de diode électroluminescente de puissance pour système de signalisation ou d'éclairage automobile, comportant un support isolant (2) et des moyens de connexion électrique aux électrodes (1a, 1b) de la diode (1). Les moyens de connexion électrique comprennent, sur le support isolant (2), des pattes de raccordement électrique (17a, 17b); le corps de la diode électroluminescente (1) est fixé sur une zone d'un élément radiateur de chaleur (8); cet élément radiateur de chaleur (8) est rapporté sur le support isolant (2), et les électrodes (1a, 1b) de la diode sont isolées de l'élément radiateur de chaleur et reliées électriquement aux pattes de raccordement (17a, 17b) du support isolant par des languettes (12a, 12b) isolées de l'élément radiateur (8) après rupture d'attaches momentanées (13).
Abstract:
The proposal is for a multi-part housing (1, 2) for control devices, in which, to obtain resistance to interference radiation and good heat dissipation, a printed circuit board (6) bearing power (3) and control (4) components is fitted with a peripheral lamination of electrically and heat conducting material. The board, in the region of these laminations (10) which are electrically interconnected, is clamped between the halves of the housing (1, 2) and the power components are in contact with this lamination (10) in a heat conductive fashion, while control components which produce intensive interference radiation or are sensitive to interference radiation are enclosed inside connection pieces (19) projecting through the wall of the housing sections.
Abstract:
Es wird ein elektrisches Gerät und ein Verfahren zu dessen Herstellung vorgeschlagen, bei dem auf mindestens einer, teilweise aus flexiblem Material bestehenden, Leiterplatte (2) elektrische Bauelemente (9,11) angeordneten sind. Weiterhin sind flexible elektrische Leiterbahnen (3;13), eventuell mit Steckverbindern (16), vorhanden, die mit der Leiterplatte (2) verbunden oder in diese integriert sind. Um einen kompakten Aufbau und optimale Einsatzmöglichkeiten für das elektrische Gerät (1) zu schaffen sind die mindestens eine Leiterplatte (2) , die Gehäuseteile (4,5) und zumindest Teile der flexiblen Leiterbahnen (3;13) mit einer zunächst flüssigen, danach aushärtenden Schaumstoffmasse (6;17) derart umgeben, daß eine mechanisch haltbare Verbindung zwischen diesen Elementen hergestellt ist.
Abstract:
A copper supporting sheet (5) has holes (9) for connecting semiconductor chips (3) to surface mount components (27). A laminate of polyimide (7) has holes (13) corresponding to the supporting layer holes (9) with copper 15 covering those holes (13). In addition to crossing those holes (13), the copper 15 forms conventional circuit patterns. The side having circuit patterns is populated by surface mount techniques with components (27). The opposite side has silicon chips (3) attached to the copper sheet (5) adjacent to holes (9). Wires (17) are ultrasonically bonded to the chips (3) and extended to the inside of the holes (13) in the polyimide layer (7), where they are ultrasonically bonded to copper (15). Crossover connection of the circuit patterns (17a) are achieved using the same technique. The circuit board is densely populated and cost-effective, with good heat dissipation characteristics.