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公开(公告)号：KR101377196B1
公开(公告)日：2014-03-25
申请号：KR1020090064964
申请日：2009-07-16
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/306
CPC classification number: H01L21/6708
Abstract: 본발명의액처리장치는피처리체(W)의하면과측면을처리한다. 액처리장치는피처리체(W)에처리액을공급하는처리액공급기구(37, 39)와, 피처리체(W)를처리한처리액을배출하는배출기구(20, 21)와, 피처리체(W)의둘레가장자리외측에마련되고, 피처리체(W)를처리한처리액을배출기구(20, 21)로유도하는회전컵(10)과, 회전컵(10)을회전시키는회전구동부(60)를포함하고있다. 회전컵(10)에는둘레가장자리내측으로돌출되어피처리체(W)의주연부를지지하는지지부(15)가마련되어있다.
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公开(公告)号：KR1020120089187A
公开(公告)日：2012-08-09
申请号：KR1020110135101
申请日：2011-12-15
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/67 , H01L21/02 , H01L21/687
CPC classification number: H01L21/68742 , H01L21/67017 , H01L21/67051 , H01L21/6719 , H01L21/68728 , Y10S134/902 , H01L21/02052
Abstract: PURPOSE: An apparatus and a method for processing liquid are provided to prevent the contamination of a wafer by cleaning a drain cup with the cleaning liquid. CONSTITUTION: A substrate holding unit and a cup(42) are installed in a process chamber. The substrate holding unit holds the substrate. The cup is arranged around the substrate holding unit. A nozzle supplies processing liquid to the substrate held by the substrate holding unit. A cup cleaning unit(49,49a) cleans the cup by supplying cleaning liquid on the upper part of the cup.
Abstract translation: 目的：提供一种用于处理液体的装置和方法，以通过用清洗液清洗排水杯来防止晶片的污染。 构成：衬底保持单元和杯（42）安装在处理室中。 基板保持单元保持基板。 杯子布置在基板保持单元周围。 喷嘴将处理液供给到由基板保持单元保持的基板。 杯子清洁单元（49,49a）通过在杯子的上部供应清洁液来清洁杯子。
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公开(公告)号：KR1020120075361A
公开(公告)日：2012-07-06
申请号：KR1020110128293
申请日：2011-12-02
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/302
CPC classification number: H01L21/6708 , H01L21/67051 , H01L21/68728
Abstract: PURPOSE: A liquid processing device and method are provided to uniformly discharge processing liquid to the bottom of a substrate by installing a plurality of first discharge ports from the location corresponding to a center portion of the substrate to the location corresponding to a peripheral portion of the substrate. CONSTITUTION: A substrate holding unit(30) maintains a substrate(W) with a horizontal state. A rotation driving unit(39) rotates the substrate holding unit. A first nozzle(60) is located at the lower side of the substrate maintained by the substrate holding unit. The first nozzle comprises a plurality of first liquid discharge paths and a plurality of first gas discharge paths. A liquid feed tool(70) supplies liquid to the plurality of first liquid discharge paths. A gas feed tool(80) supplies gas to the plurality of first gas discharge paths.
Abstract translation: 目的：提供一种液体处理装置和方法，用于通过从对应于基板的中心部分的位置到对应于基板的周边部分的位置安装多个第一排出口来将处理液均匀地排放到基板的底部 基质。 构成：基板保持单元（30）以水平状态维持基板（W）。 旋转驱动单元（39）使基板保持单元旋转。 第一喷嘴（60）位于由基板保持单元维持的基板的下侧。 第一喷嘴包括多个第一液体排出路径和多个第一气体排出路径。 液体供给工具（70）向多个第一液体排出路径供应液体。 气体供给工具（80）向多个第一气体排出路径供给气体。
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公开(公告)号：KR1020120075350A
公开(公告)日：2012-07-06
申请号：KR1020110124277
申请日：2011-11-25
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/302 , H01L21/3065
CPC classification number: H01L21/67051 , H01L21/68728 , H01L21/68785 , H01L21/68792
Abstract: PURPOSE: A liquid processing device and method are provide to effectively wash the bottom of a wafer by crashing fluid spray to the bottom of the wafer without the degradation of energy of the fluid spray. CONSTITUTION: A substrate holding unit(30) maintains a substrate(W) with a horizontal state. A rotation driving unit(39) rotates the substrate holding unit. A first nozzle(60) is located at the lower side of the substrate maintained by the substrate holding unit. The first nozzle comprises a plurality of first liquid discharge paths and a plurality of first gas discharge paths. A liquid feed tool(70) supplies liquid to the plurality of first liquid discharge paths. A gas feed tool(80) supplies gas to the plurality of first gas discharge paths.
Abstract translation: 目的：提供液体处理装置和方法，以通过将流体喷雾撞击到晶片的底部而有效地洗涤晶片的底部，而不会降低流体喷雾的能量。 构成：基板保持单元（30）以水平状态维持基板（W）。 旋转驱动单元（39）使基板保持单元旋转。 第一喷嘴（60）位于由基板保持单元维持的基板的下侧。 第一喷嘴包括多个第一液体排出路径和多个第一气体排出路径。 液体供给工具（70）向多个第一液体排出路径供应液体。 气体供给工具（80）向多个第一气体排出路径供给气体。
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公开(公告)号：KR1020120028212A
公开(公告)日：2012-03-22
申请号：KR1020110070476
申请日：2011-07-15
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/302
CPC classification number: H01L21/02087 , H01L21/6708 , H01L21/67115 , H01L21/6838 , H01L21/68735 , H01L21/68785 , H01L21/68792
Abstract: PURPOSE: A liquid processing apparatus, a liquid processing method, and a memory medium are provided to increase process efficiency due to chemical solutions by heating a substrate, gas, and chemical solutions with a lamp heater. CONSTITUTION: A chemical solution supply unit supplies chemical solutions to an edge of a substrate. A cover member(5) faces the upper side of a substrate held in a substrate holding unit with a preset space. A gas supply unit is formed on the cover member to supply gas to a space. A lamp heater is arranged around the substrate in the space to heat the edge of the substrate. A protrusion unit(55) is downwardly protruded around the cover member.
Abstract translation: 目的：提供液体处理装置，液体处理方法和存储介质，以通过用灯加热器加热基板，气体和化学溶液来提高由化学溶液引起的工艺效率。 构成：化学溶液供应单元向基材的边缘提供化学溶液。 盖构件（5）面向保持在具有预设空间的基板保持单元中的基板的上侧。 在盖构件上形成气体供给单元，以将气体供给到空间。 在该空间中的基板周围布置灯加热器以加热基板的边缘。 突出单元（55）围绕盖构件向下突出。
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Patent Agency Ranking
公开(公告)号：KR100979978B1
公开(公告)日：2010-09-03
申请号：KR1020087016891
申请日：2007-11-21
Applicant: 도쿄엘렉트론가부시키가이샤
Inventor： 히가시지마지로
IPC: H01L21/027 , H01L21/304 , H01L21/00 , H01L21/02
CPC classification number: H01L21/67126 , G03F7/42 , H01L21/31138 , H01L21/6719
Abstract: 본 발명은 처리 용기의 덮개를 간단한 구조로 유지하고, 처리 공간의 분위기가 처리 용기의 외부로 새는 것을 방지할 수 있도록 한다. 처리 용기(30)의 내부에 형성되는 처리 공간(83)의 외측에 저압 공간(84)을 형성한다. 또한, 처리 용기 본체(80)와 덮개(81)의 사이를 시일하여 저압 공간(84)을 처리 공간(83)으로부터 차단하는 제1 시일부(101)와, 제1 시일부(101)보다도 외측에서 저압 공간(84)을 처리 용기(30)의 외부로부터 차단하는 제2 시일부(102)를 구비한다. 이러한 구성에 있어서, 제1 시일부(101)와 제2 시일부(102)에서 시일이 행해지는 정상 시일 상태에서의 저압 공간(84)의 내압을 저압으로 함으로써 제2 시일부(102)에서 시일이 행해지는 상태에서 제1 시일부(101)에서 누설이 발생하는 내측 누설 상태가 된 경우에, 처리 공간(83)의 내압이 처리 용기(30)의 외부 압력에 대해 등압 이하가 되게 한다.
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公开(公告)号：KR1020100011909A
公开(公告)日：2010-02-03
申请号：KR1020090064964
申请日：2009-07-16
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/306
CPC classification number: H01L21/6708
Abstract: PURPOSE: A liquid treatment device is provided to suppress dispersion of process solution using a support unit of the rotation cup. CONSTITUTION: A liquid treatment device includes a process solution supply device(37,39), an exhaust device(20,21), a rotation cup(10), a support unit(15), and a rotation driver(60). The process solution supply device supplies the process solution to an object(W). An exhaust unit exhausts the process solution processing the object. The rotation cup is arranged around the object and induces the process solution processing the object to the exhaust device. A support unit is protruded to the object from the rotation cup. The support unit supports the peripheral part of the object. The rotation driver rotates the rotation cup.
Abstract translation: 目的：提供一种液体处理装置，以使用旋转杯的支撑单元抑制处理溶液的分散。 构成：液体处理装置包括处理液供给装置（37,39），排气装置（20,21），旋转杯（10），支撑单元（15）和旋转驱动器（60）。 过程解决方案供应设备将过程解决方案提供给对象（W）。 排气单元排出处理物体的处理溶液。 旋转杯设置在物体周围，并引导处理液将物体处理到排气装置。 支撑单元从旋转杯突出到物体。 支撑单元支撑物体的外围部分。 旋转驱动器旋转旋转杯。
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公开(公告)号：KR1020090126186A
公开(公告)日：2009-12-08
申请号：KR1020090046447
申请日：2009-05-27
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/68
CPC classification number: H01L21/67051 , B05D1/002 , B05D3/0486 , H01L21/68728 , H01L21/68742 , H01L21/68792
Abstract: PURPOSE: A substrate processing apparatus, substrate processing method and program storage medium are provided to keep stably the wafer on the table by using the protrusion member. CONSTITUTION: The protruding member has the base plate(20) is projected to the upper part and can rotate. The drivingly rotative mechanism(35) rotates the base plate. The conduit line(56) for absorption has one opened end at the gap. The pressure controlling device(55) comprises the absorption unit connected to the conduit line for absorption. The control device is connected to the drivingly rotative mechanism and pressure controlling device. The pressure monitor unit(50) comprises the pressure sensor(53) connected to the conduit line for the pressure measurement. The base plate is that the opening at the location facing the substrate.
Abstract translation: 目的：提供基板处理装置，基板处理方法和程序存储介质，以通过使用突出部件将晶片稳定地保持在工作台上。 构成：突出构件具有基板（20）突出到上部并且可以旋转。 驱动旋转机构（35）使基板旋转。 用于吸收的导管（56）在间隙处具有一个开口端。 压力控制装置（55）包括连接到导管的吸收单元用于吸收。 控制装置连接到驱动旋转机构和压力控制装置。 压力监视器单元（50）包括连接到用于压力测量的导管线的压力传感器（53）。 基板是面向基板的位置处的开口。
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公开(公告)号：KR1020170143455A
公开(公告)日：2017-12-29
申请号：KR1020170078122
申请日：2017-06-20
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/67 , H01L21/02 , H01L21/683
CPC classification number: B08B13/00 , B08B3/041 , B08B3/08 , H01L21/67017 , H01L21/67051 , H01L21/67173
Abstract: 본발명은액 받이컵의컵체의돌출부를얼룩없이세정하는것을과제로한다. 제1 컵체(51)와제2 컵체(52) 중어느한쪽을승강시켜양자를근접상태로한다. 이때, 제1 돌출부(5102)의하면에형성된간극형성부(5106)와제2 돌출부(5202)의상면사이의제1 간극(G1)이, 제1 돌출부의간극형성부가없는부분과제2 돌출부의상면사이의제2 간극(G2)보다작다. 이상태로, 제2 간극에세정액을공급한다. 반경방향외향으로흐르고자하는세정액의움직임이좁은제1 간극에의해제한되기때문에, 제1 돌출부와제2 돌출부사이의공간의전역을세정액으로채울수 있어, 세정대상면을얼룩없이세정할수 있다.
Abstract translation: 本发明克服了清洗杯架的杯体的突出部分没有斑点的问题。 第一杯体51和第二杯体52中的一个升高和降低以使它们靠得很近。 此时，形成在根据第一突起5102间隙形成部（5106）沃赫第二突起5202是衣服侧之间的第一间隙（G1），任务的第一部分的顶表面2周之间的突起，而不形成在突起部的间隙 Ag 2比间隙G2小。 结果，清洁液体被供应到第二间隙。 由于清洗液的运动，以通过一个窄的第一间隙中，第一突出部和它的两个凸起之间chaeulsu用洗涤液的空间的整个区域流动径向向外椅子是有限的，它可以均匀地清洁清洁目标表面上。
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公开(公告)号：KR1020170015415A
公开(公告)日：2017-02-08
申请号：KR1020170011934
申请日：2017-01-25
Applicant: 도쿄엘렉트론가부시키가이샤
CPC classification number: H01L21/67017 , B05B14/00 , B05C11/08 , B08B3/04 , B08B3/08 , B08B15/02 , G03F7/40 , H01L21/67051 , H01L21/6708 , H01L21/6715 , H01L21/02052
Abstract: 본발명은기판을처리액으로처리하는기판액처리장치에관한것이다. 본발명의기판액처리장치는, 기판을보지하고, 또한보지한기판을회전시키기위한기판회전기구와, 기판으로복수종류의처리액을선택적으로공급하는처리액공급기구와, 기판으로공급한후의처리액을회수하기위한회수컵과, 처리액을회수하기위하여회수컵에형성한복수의액 회수부와, 액회수부로부터회수한처리액을배출하기위하여회수컵의저부에형성한배액구와, 회수컵의배액구보다상방측에형성한배기구와, 배기구의상방을소정의간격을두고덮기위하여회수컵에고정한고정커버와, 기판으로공급한후의처리액을액 회수부로안내하기위하여고정커버의상방에서승강가능하게설치된승강컵과, 처리액의종류에따라승강컵을고정커버에대하여승강시키기위한컵 승강기구를가지고, 승강컵에는구획벽에승강가능하게삽입관통된승강로드가접속되어있고, 승강로드는컵 승강기구와접속되어있으며, 승강컵이승강할때, 배기구와고정커버와의사이의상기소정의간격은일정하게유지되어, 배기압력의변동을방지한다.
Abstract translation: 提供了一种基板液体处理装置，其中处理溶液和气氛可以在收集杯内彼此分离。 基板液体处理装置包括：基板旋转单元; 处理液供应单元; 收集杯，其被配置为收集处理溶液; 在收集杯处形成的液体收集区域; 形成在收集杯的底部的液体排出口; 形成在排液口上方的排气口; 固定盖，其被构造成在其间具有空间覆盖所述排气口的上部; 提升杯，其设置在所述固定盖的上方并且被构造成将所述处理溶液引导到所述液体收集区域中; 以及杯升降单元，其配置为根据处理溶液的种类上下移动升降杯。
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