-
公开(公告)号：KR101351622B1
公开(公告)日：2014-01-15
申请号：KR1020100138350
申请日：2010-12-29
Applicant: 제일모직주식회사
IPC: C09J7/02 , C09J9/00 , C09J133/04 , H01L21/58
CPC classification number: H01L24/27 , C09J7/22 , C09J7/38 , C09J133/04 , C09J2203/326 , H01L21/6836 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/27001 , H01L2224/27436 , H01L2224/29 , H01L2224/2919 , H01L2224/29298 , H01L2224/83191 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01025 , H01L2924/01033 , H01L2924/01072 , H01L2924/01073 , H01L2924/01077 , H01L2924/01082 , H01L2924/0665 , H01L2924/15788 , Y10T428/28 , Y10T428/2817 , Y10T428/2826 , Y10T428/287 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
Abstract: 본 발명의 다이싱 다이본딩 필름은 접착제층; 및 상기 접착제층에 접한 점착제층을 포함하며, 상기 점착제층은 25℃ 저장탄성율이 400~600 kPa이며, KS-A-01107 방법으로 측정한 접착제층에 대한 점착제층의 박리력이 200 내지 350 mN/25mm인 것을 특징으로 한다. 상기 다이싱 다이본딩 필름은 UV 공정이 필요 없으며, 다이싱 공정에서 공정성이 우수하다.
-
公开(公告)号：KR101309811B1
公开(公告)日：2013-10-14
申请号：KR1020100098504
申请日：2010-10-08
Applicant: 제일모직주식회사
IPC: C09J7/02 , C09J11/00 , C09J133/04 , H01L21/58
CPC classification number: H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014
Abstract: 본딩 와이어(bonding wire)가 본딩된 하부 칩 상에 상부 칩이 적층되는 적층형 패키지에서, 상부 칩 하면에 접착되고 본딩 와이어가 침투되어 수용되는 제1접착층, 및 제1접착층 하부에 접착되어 하부 칩 상에 접착되는 제 2 접착층을 포함하고, 경화전 점도는 제1접착층이 제2접착층보다 낮은 점도를 갖는 반도체 패키지용 접착 필름을 제시한다.
-
公开(公告)号：KR101309815B1
公开(公告)日：2013-09-23
申请号：KR1020100128660
申请日：2010-12-15
Applicant: 제일모직주식회사
IPC: H01L21/301
CPC classification number: H01L24/27 , H01L21/6836 , H01L24/29 , H01L24/83 , H01L2224/83191 , H01L2924/01012 , H01L2924/01029 , H01L2924/3512 , H01L2924/00
Abstract: 본 발명의 다이싱 다이본딩 필름은 기재필름에 접하는 제1면(A)과 반도체 웨이퍼에 접하는 제2면(B)을 가지며, 상기 제2면의 박리력은 제1면의 박리력보다 크고, 상기 제2면의 박리력은 0.2 N/25mm 이상인 것을 특징으로 한다. 상기 다이싱 다이본딩 필름은 기재필름 쪽에서는 박리가 잘 되고 웨이퍼 쪽에서는 다이싱 다이본딩 필름의 박리가 발생하지 않아 우수한 픽업 성능을 지니게 된다.
-
公开(公告)号：KR101266546B1
公开(公告)日：2013-05-27
申请号：KR1020100122967
申请日：2010-12-03
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J201/00 , C09J11/00 , C09J7/02
Abstract: 본발명의반도체용접착제조성물은고분자수지, 에폭시수지및 경화제를포함하며, 125℃에서 1시간, 150℃에서 10분의경화사이클 3회후 175℃에서의점도가 1.0×10내지 3.0×10poise인것을특징으로한다. 본발명의반도체용접착제조성물및 이를이용한반도체용접착필름은단계별경화시에도용융점도가낮아몰딩시보이드제거특성이우수하며, 픽업공정시근접다이의동시들림현상, 리플로우공정후 접착제의박리, 크랙등이발생하지않아고신뢰성을가질수 있다.
-
公开(公告)号：KR101170529B1
公开(公告)日：2012-08-01
申请号：KR1020080131611
申请日：2008-12-22
Applicant: 제일모직주식회사
IPC: C09J183/00 , C09J133/08
Abstract: 본 발명은 액상 실리콘 변성 아크릴레이트 수지를 포함하는 광경화형 점착 조성물에 관한 것으로, 더욱 상세하게는 아크릴계 점착바인더에 액상 실리콘 변성 아크릴레이트 수지를 포함시키고, 비닐기를 도입시킴으로써, 광경화전 기재부착력이 높고, 광경화후 현저하게 감소된 박리력을 나타내는 광경화형 점착 조성물 및 이를 이용한 점착테이프에 관한 것이다.
광경화형 점착 조성물, 아크릴계 점착 바인더, 액상 실리콘 변성 아크릴레이트, 다이싱, 점착테이프-
Patent Agency Ranking
公开(公告)号：KR1020120077648A
公开(公告)日：2012-07-10
申请号：KR1020100139686
申请日：2010-12-30
Applicant: 제일모직주식회사
IPC: C09J7/02 , C09J133/04 , H01L21/58 , B32B27/00
CPC classification number: C09J7/29 , B32B27/00 , C09J7/22 , C09J7/35 , C09J7/38 , C09J133/04 , C09J2201/16 , C09J2201/61 , C09J2203/326 , H01L21/6836 , H01L2221/68327
Abstract: PURPOSE: A semiconductor assembling adhesive tape is provided to maintain stability of winding form in the pre-cut roll winding method and to solve defects of imprint mark generated by a multi-laminated layer of an insulating adhesive layer. CONSTITUTION: A semiconductor assembling adhesive tape comprises a base film(1), a photo-crosslinkable adhesion layer(2), an insulating adhesive layer(3), a protection film(4) and a spacer base film(5). The base film, the photo-crosslinkable adhesion layer, the insulating adhesive layer, the protection film and the spacer base film are consecutively laminated. The storage modulus of the spacer base film at 25 deg. Celsius is 100-400 MPa. The spacer base film is one or more which are selected from polyethylene, polypropylene, copolymers of propylene and ethylene, poly-1-butene, copolymer of vinyl acetate and ethylene, a mixture of polyethylene and styrene-butadiene rubber and a polyvinyl chloride film. The thickness of the spacer base film is 5-100 micro meters. A thermosetting adhesive layer is additionally included between the protection film and the spacer base film.
Abstract translation: 目的：提供半导体组装胶带，以保持卷绕形式在预切割卷绕方法中的稳定性，并且解决由绝缘粘合剂层的多层叠层产生的压印标记的缺陷。 构成：半导体组装胶带包括基膜（1），光可交联粘合层（2），绝缘粘合剂层（3），保护膜（4）和间隔基底膜（5）。 基膜，光交联性粘合层，绝缘粘合剂层，保护膜和隔离基材层连续层叠。 间隔基底膜在25度时的储能模量。 摄氏100-400兆帕。 间隔基膜是选自聚乙烯，聚丙烯，丙烯和乙烯的共聚物，聚-1-丁烯，乙酸乙烯酯和乙烯的共聚物，聚乙烯和苯乙烯 - 丁二烯橡胶的混合物以及聚氯乙烯膜中的一种或多种。 间隔基膜的厚度为5-100微米。 在保护膜和间隔基底膜之间另外包含热固性粘合剂层。
-
公开(公告)号：KR1020120074110A
公开(公告)日：2012-07-05
申请号：KR1020100136069
申请日：2010-12-27
Applicant: 제일모직주식회사
IPC: C09J9/00 , C09J163/00 , C09J11/02 , C09J7/02
CPC classification number: C09J9/00 , C09J7/22 , C09J7/35 , C09J11/02 , C09J163/00 , C09J2201/61 , C09J2201/622 , C09J2203/326 , C09J2205/102 , H01L21/6836 , H01L2221/68327
Abstract: PURPOSE: An adhesive composition for semiconductor and an adhesive film including the same are provided to reduce or omit semi-cure process and to remove or minimize foamable void. CONSTITUTION: An adhesive composition for semiconductor has a compressive strength of 100-150 gf/mm^2 at 125 deg. Celsius after curing for 60 minutes and compressive strength of 500-1000 gf/mm^2 at 150 deg. Celsius after curing for 10 minutes, at 150 deg. Celsius after curing for 30 minutes, and at 175 deg. Celsius after mold 60 seconds, and the void thereof are all less than 10%. The adhesive compound comprises a thermoplastic resin, an epoxy resin, a hardener, and a curing catalyst. 30-70 weight% of the thermoplastic resin is included based on whole composition. The thermoplastic resin content amount is bigger than sum total of the epoxy resin and the hardener.
Abstract translation: 目的：提供用于半导体的粘合剂组合物和包含其的粘合剂膜以减少或省略半固化过程并除去或最小化可发泡空隙。 构成：半导体用粘合剂组合物在125度下的抗压强度为100-150gf / mm ^ 2。 固化60分钟后的摄氏度，150度时的抗压强度为500-1000gf / mm ^ 2。 固化10分钟后，摄氏150度。 固化30分钟后，摄氏175度。 模具60秒后的摄氏度，其空隙均小于10％。 粘合剂包括热塑性树脂，环氧树脂，硬化剂和固化催化剂。 基于全部组成包括30-70重量％的热塑性树脂。 热塑性树脂含量大于环氧树脂和固化剂的总和。
-
公开(公告)号：KR1020120070338A
公开(公告)日：2012-06-29
申请号：KR1020100131856
申请日：2010-12-21
Applicant: 제일모직주식회사
IPC: C09J133/04 , C09J163/00 , C09J7/02 , C09J9/00
CPC classification number: C09J133/04 , C09J7/22 , C09J7/30 , C09J7/35 , C09J163/00 , C09J2201/61 , C09J2201/622 , C09J2203/326 , C09J2205/102 , H01L21/6836 , H01L2221/68327
Abstract: PURPOSE: A composition for semiconductor adhesive film is provided to maintain low melting point and the high residual cure index after a pre-cure process, thereby effectively removing void in epoxy molding compound molding. CONSTITUTION: A composition for semiconductor adhesive film comprises 50-85 weight% of acrylic resin, 5-40 weight% of epoxy-based resin, 2-15 weight% of aromatic amine based hardener, 5-40 weight% of filler, and 0.05-5 weight% of silane coupling agent. The composition for semiconductor adhesive film has a melting point which is measured at 175 deg. Celsius after 2 cycles of curing cycle which consists of 60 minutes at 125 deg. Celsius and 10 minutes at 150 deg. Is 2.0 x 10^6 poise or less. The acrylic resin has a glass transition temperature of (-15)-50 deg. Celsius.
Abstract translation: 目的：提供一种用于半导体粘合剂膜的组合物，用于在预固化过程之后保持低熔点和高残留固化指数，从而有效地除去环氧模塑料成型中的空隙。 构成：半导体粘合膜用组合物含有50〜85重量％的丙烯酸树脂，5-40重量％的环氧类树脂，2-15重量％芳族胺类固化剂，5-40重量％填料和0.05重量％ -5重量％的硅烷偶联剂。 用于半导体粘合剂膜的组合物具有在175℃下测量的熔点。 2周期的固化循环后的摄氏度，其在125度下由60分钟组成。 摄氏150度，10分钟。 是2.0 x 10 ^ 6泊或更少。 丙烯酸树脂的玻璃化转变温度为（-15）-50℃。 摄氏度。
-
公开(公告)号：KR1020120065893A
公开(公告)日：2012-06-21
申请号：KR1020100127236
申请日：2010-12-13
Applicant: 제일모직주식회사
IPC: C09J7/02 , C09J11/00 , H01L21/683 , B32B37/00
CPC classification number: C09J7/40 , B32B37/156 , B32B37/187 , C09J7/22 , C09J7/30 , C09J7/38 , C09J7/403 , C09J11/00 , C09J2201/16 , C09J2203/326 , H01L21/6836
Abstract: PURPOSE: An adhesive sheet for semiconductor is provided to maintain shape stability as a roll shape, and to restrain film fracture at manufacturing to roll shape. CONSTITUTION: An adhesive sheet comprises a release substrate(1), an adhesive layer(2), a tackifying layer(3), and a substrate film(4) laminated in order. The release substrate comprises a first cutting portion(7) formed from the side of the adhesive layer along the circumference of an adhesive layer, and a second cutting portion(8) formed along the circumference of the adhesive layer and the substrate film. The thickness of the first cutting portion and the second cutting portion is thinner than the whole thickness of the release substrate. The rupture strength of the release substrate is 40-90 N/15mm.
Abstract translation: 目的：提供一种用于半导体的粘合片以保持作为卷状的形状稳定性，并且在制造时抑制膜断裂成卷。 构成：粘合片包括依次层压的剥离基材（1），粘合剂层（2），增粘层（3）和基材膜（4）。 剥离基板包括沿着粘合剂层的圆周从粘合剂层的侧面形成的第一切割部分（7）和沿着粘合剂层的圆周和基底膜形成的第二切割部分（8）。 第一切割部分和第二切割部分的厚度比剥离基底的整个厚度薄。 剥离基材的断裂强度为40〜90N / 15mm。
-
公开(公告)号：KR1020120061610A
公开(公告)日：2012-06-13
申请号：KR1020100122967
申请日：2010-12-03
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J201/00 , C09J11/00 , C09J7/02
CPC classification number: C09J163/00 , C09J7/22 , C09J7/35 , C09J7/38 , C09J11/00 , C09J201/005 , C09J2201/16 , C09J2201/36 , C09J2201/61 , C09J2201/622 , C09J2203/326
Abstract: PURPOSE: An adhesive composition for semiconductors and an adhesive film using thereof are provided to enhance void elimination property during molding and to prevent lifting of close die during a pick-up process. CONSTITUTION: An adhesive composition for semiconductors comprises 50-90 weight% of polymer resin, 5-30 weight% of epoxy resin, and 1-30 weight% of hardener. A melting point at 175 deg. Celsius after 3 times of curing cycles at 125 deg. Celsius for 1 hour is 1.0×10^5 - 3.0×10^6 poise. The adhesive film for semiconductors comprises a base film, a tackifier layer which is laminated on the base film, an adhesive layer which is laminated on the adhesion layer and is formed with the adhesive composition, and a protective film which is laminated on the bonding layer.
Abstract translation: 目的：提供用于半导体的粘合剂组合物和使用其的粘合剂膜，以增强模制期间的空隙消除性能，并且防止在拾取过程中关闭模具的提升。 构成：半导体用粘合剂组合物包含50-90重量％的聚合物树脂，5-30重量％的环氧树脂和1-30重量％的硬化剂。 熔点为175度 摄氏度为125度后3次固化循环。 摄氏1小时为1.0×10 ^ 5 - 3.0×10 ^ 6泊。 半导体用粘合膜包括基膜，层叠在基膜上的增粘层，层叠在粘合层上并形成有粘合剂组合物的粘合层和层叠在接合层上的保护膜 。
-
-
-
-
-
-
-
-
-
Search Results
76
records
(took 0.035 seconds)
