公开(公告)号：DE102005005750B4

公开(公告)日：2009-06-04

申请号：DE102005005750

申请日：2005-02-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MAHLER JOACHIM ,  HAIMERL ALFRED ,  SCHOBER WOLFGANG ,  BAUER MICHAEL ,  KESSLER ANGELA

IPC: C09J5/00 ,  B29C65/02 ,  B29C70/70 ,  B32B27/08 ,  C08J5/00

公开(公告)号：DE102006056363A1

公开(公告)日：2008-06-05

申请号：DE102006056363

申请日：2006-11-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  KESSLER ANGELA ,  SCHOBER WOLFGANG ,  HAIMERL ALFRED ,  MAHLER JOACHIM

IPC: H01L23/48 ,  H01L25/04

Abstract: A semiconductor module includes a module package including a first substrate having a first semiconductor device and a second substrate having a second semiconductor device. A first outer conductor extends from the module package and is connected to the first substrate and a second outer conductor extends from the module package and is connected to the second substrate. A method for producing the semiconductor module includes attaching first outer conductors of a leadframe to a first substrate, where the first substrate includes a first semiconductor device that is attached to the first substrate either before or after attaching the first outer conductors. A second substrate is provided including a signal processing circuit and the second substrate is fastening to second outer conductors of the leadframe.

公开(公告)号：DE102006053922A1

公开(公告)日：2008-05-29

申请号：DE102006053922

申请日：2006-11-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  STOECKL STEPHAN

IPC: H05K1/18 ,  H01L23/488 ,  H05K3/32

Abstract: The invention relates to a module comprising a carrier element having a lower stiffness or a different structure in a first region than in a second region, and also comprising a component applied to the carrier element. The component and the first region are connected to one another by a wire connection covered by a material.

公开(公告)号：DE102006045415A1

公开(公告)日：2008-04-03

申请号：DE102006045415

申请日：2006-09-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  HAIMERL ALFRED ,  KESSLER ANGELA ,  MAHLER JOACHIM ,  SCHOBER WOLFGANG

IPC: H01L23/28 ,  H01L23/12

Abstract: The assembly has a carrier (100) e.g. printed circuit board (PCB), and a component e.g. semiconductor component (200), in a housing. A molding material (400) completely surrounds the carrier and the component, and partially surrounds an electrical contact strip (300). The component is superimposed on the carrier that is provided with a hole (500). The electrical contact strip is directly connected with the carrier, and the holes are formed beneath the component. An independent claim is also included for a method for producing a component assembly.

公开(公告)号：DE102005043808B4

公开(公告)日：2007-11-29

申请号：DE102005043808

申请日：2005-09-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： JEREBIC SIMON ,  WOERNER HOLGER ,  FUERGUT EDWARD ,  BAUER MICHAEL ,  ESCHER-POEPPEL IRMGARD ,  STROBEL PETER ,  RAKOW BERND

IPC: H01L23/50 ,  H01L21/48 ,  H01L21/60

公开(公告)号：DE102006017115A1

公开(公告)日：2007-10-18

申请号：DE102006017115

申请日：2006-04-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BRUNNBAUER MARKUS ,  MAHLER JOACHIM ,  FUERGUT EDWARD ,  BAUER MICHAEL

IPC: H01L23/16 ,  H01L21/56

Abstract: A semiconductor device and a method for producing it is disclosed. In one embodiment, an adhesion-promoting layer having nanoparticles is arranged between a circuit carrier and a plastic housing composition for the purpose of enhanced adhesion.

公开(公告)号：DE102006001602A1

公开(公告)日：2007-05-24

申请号：DE102006001602

申请日：2006-01-11

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  STROBEL PETER ,  POHL JENS ,  STUEMPFL CHRISTIAN ,  HEITZER LUDWIG

IPC: H01L23/498 ,  H01L23/50

Abstract: Semiconductor component comprises a wiring substrate (2) with bond surfaces (5) and a chip on an island where there is a metal layer structure (15) comprises a copper base layer (10) facing the wiring substrate and a noble metal cover layer (12) facing the chip with an intermediate layer (11) of nickel or nickel alloy. The intermediate layer facing the cover layer has a surface roughness of 0.1-3 mu m : An independent claim is also included for a production process for the above.

公开(公告)号：DE102005025083B4

公开(公告)日：2007-05-24

申请号：DE102005025083

申请日：2005-05-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MAHLER JOACHIM ,  HAIMERL ALFRED ,  SCHOBER WOLFGANG ,  BAUER MICHAEL ,  KESSLER ANGELA

IPC: B32B27/08 ,  B29C70/70 ,  B32B7/04 ,  B32B27/06 ,  C08J5/12 ,  C09J5/10 ,  C09J11/04 ,  H01L23/28

Abstract: Composite with a first part composed of a thermoset material and with a second part composed of a thermoplastic material, and with an adhesion-promoter layer located between these, where the first part has been bonded by way of the adhesion-promoter layer to the second part, and where the adhesion-promoter layer comprises pyrolytically deposited semiconductor oxides and/or pyrolytically deposited metal oxides.

公开(公告)号：DE102005048153A1

公开(公告)日：2007-04-19

申请号：DE102005048153

申请日：2005-10-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  STROBEL PETER ,  HEITZER LUDWIG ,  KUERZEL ERIC

IPC: H01L21/301

Abstract: A semiconductor device includes a semiconductor chip and an adhesive film between the back side of the semiconductor chip and a chip pad of a leadframe. The adhesive film includes a film core and adhesive layers that cover both sides of the film core. The film core includes a brittle, fragile hard material.

公开(公告)号：DE102005051414B3

公开(公告)日：2007-04-12

申请号：DE102005051414

申请日：2005-10-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ESCHER-POEPPEL IRMGARD ,  POHL JENS ,  BRUNNBAUER MARKUS ,  BAUER MICHAEL ,  STUEMPFL CHRISTIAN

IPC: H01L23/50 ,  H01L21/50 ,  H01L23/498 ,  H01L25/065

Abstract: A semiconductor component with solder balls (2), plastic housing and a lower wiring substrate (4) of a base semiconductor component (5) comprises a central upper region of the wiring having a spatially limited plastic mass (3) and with solder balls on the upper side of the lower wiring substrate in edge regions (11) surrounded by a film template (15) having openings (16) in which the solder balls are arranged in a spatially limited manner. Independent claims are also included for production processes for the above.