42.
    发明专利
    未知

    公开(公告)号:DE50312210D1

    公开(公告)日:2010-01-21

    申请号:DE50312210

    申请日:2003-10-10

    Abstract: An integrated circuit arrangement and method of fabricating the integrated circuit arrangement is described. The integrated circuit arrangement contains an insulating region and a sequence of regions which forms a capacitor. The sequence contains a near electrode region near the insulating region, a dielectric region, and a remote electrode region remote from the insulating region. The insulating region is part of an insulating layer arranged in a plane. The capacitor and an active component are arranged on the same side of the insulating layer and form a memory cell. The near electrode region and an active region of the component are arranged in a plane which lies parallel to the plane in which the insulating layer is arranged. A processor is also contained in the integrated circuit arrangement.

    43.
    发明专利
    未知

    公开(公告)号:DE112006000241B4

    公开(公告)日:2010-01-21

    申请号:DE112006000241

    申请日:2006-02-17

    Inventor: SCHULZ THOMAS

    Abstract: A semiconductor device includes a source region, a drain region, and a fin that connects the source region to the drain region. A gate electrode having a substantially planar surface overlies the fin and is positioned between the drain region and the source region. A first set of spacers is positioned between a first sidewall of the gate electrode and the source region and between a second sidewall of the gate electrode and the drain region. A second set of spacers is positioned on at least a portion of a top surface of the source region and the drain region and alongside at least a portion of the first set of spacers. At least a portion of sidewalls of the second set of spacers contacts a portion of the first or second sidewall of the gate electrode.

    44.
    发明专利
    未知

    公开(公告)号:DE59814274D1

    公开(公告)日:2008-10-02

    申请号:DE59814274

    申请日:1998-11-19

    Abstract: The cell arrangement includes at least six transistors per memory cell. Four of the transistors form a flip-flop and are arranged at corners of a square. The flip-flop is controlled by two of the transistors which are respectively arranged adjacent on diagonally opposite corners of the square. Memory cells adjacent along a word conductor can be arranged in such a way, that a first bit conductor and a second bit conductor of the adjacent memory cells coincide. The transistors are arranged preferably vertically and in semiconductor structures which are produced by a layer sequence. Two of the transistors with n-endowed channel areas, are preferably formed in two separate semiconductor structures.

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