43.
    发明专利
    未知

    公开(公告)号:DE102004029200B4

    公开(公告)日:2006-10-19

    申请号:DE102004029200

    申请日:2004-06-16

    Abstract: The invention relates a substrate for a package for an electronic circuit and methods for packaging an electronic circuit with a substrate. The substrate comprises at least one conduction region and an activation region arranged within the substrate. The activation region is generally in contact with the conduction region and is configured to change its electrical resistance when activation occurs.

    45.
    发明专利
    未知

    公开(公告)号:DE10233760A1

    公开(公告)日:2004-02-19

    申请号:DE10233760

    申请日:2002-07-25

    Inventor: SOMMER MICHAEL

    Abstract: A circuit structure has at least two etching trenches disposed at sidewalls of a silicon block left behind during the etching of the structure. The etching trenches are disposed at angles with respect to one another that are prescribed by the form of the silicon block left behind. Semiconductor layer structures which can interact with one another diagonally across are in each case accommodated in the etching trenches. In this case, the function of the entire circuit structure results from the interaction of the layer structures disposed in the various etching trenches.

    46.
    发明专利
    未知

    公开(公告)号:DE10226583A1

    公开(公告)日:2004-01-08

    申请号:DE10226583

    申请日:2002-06-14

    Abstract: The memory cell according to the invention has a vertical selection transistor, via whose channel region the inner electrode of the trench capacitor can be connected to a bit line. The large extent of the channel region in the bit line direction means that the trench capacitor can be rapidly charged and read. The channel region is led to the bit line through an associated word line, which completely or partially encloses the channel region. A conductive channel can be formed within the channel region depending on the potential of the word line.

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