公开(公告)号：DE102009034370A1

公开(公告)日：2011-01-27

申请号：DE102009034370

申请日：2009-07-23

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： JAEGER HARALD ,  BRUNNER HERBERT ,  PREUS STEPHAN

IPC: H01L33/52 ,  H01L33/56 ,  H01S5/022

Abstract: In mindestens einer Ausführungsform des optoelektronischen Bauteils (1) umfasst dieses einen Träger (3) und mindestens einen optoelektronischen Halbleiterchip (2), der an dem Träger (3) angebracht ist. Ferner beinhaltet das optoelektronische Bauteil (1) wenigstens ein optisches Element (45), das ebenfalls an dem Träger (3) angebracht ist. Das optische Element (45) weist hierbei einen Grundkörper (5) mit einem strahlungsdurchlässigen Formmaterial auf. Das Formmaterial ist ein Silikon, ein Epoxid oder ein Silikon-Epoxid-Hybridmaterial. Weiterhin ist der Grundkörper (5) formgepresst, formgespritzt oder formgegossen. Außerdem umfasst das optische Element (45) eine Folie (4), die eine dem Halbleiterchip (2) abgewandte Begrenzungsfläche (7) des optischen Elements (45) bildet. Die Folie (4) ist verbindungsmittelfrei und unmittelbar mit dem Grundkörper (5) verbunden.

公开(公告)号：DE102008044847A1

公开(公告)日：2010-03-04

申请号：DE102008044847

申请日：2008-08-28

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： JAEGER HARALD ,  ZITZLSPERGER MICHAEL ,  SORG JOERG

IPC: H01L33/00 ,  H01S5/022

Abstract: The optoelectronic component has a support (1) with an electrically conductive lead frame (2), which has two elements (2a,2b), where an organic layer (3) is arranged on both the elements. An optoelectronic chip (4) is arranged in electrical contact with the former element of the frame. An outer layer (6) is arranged on a portion of the organic layer and optoelectronic chip. The organic layer consists of silicone and epoxides. An independent claim is included for a method for manufacturing an optoelectronic component.

公开(公告)号：DE102008011282A1

公开(公告)日：2009-06-25

申请号：DE102008011282

申请日：2008-02-27

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： ZITZLSPERGER MICHAEL ,  BRAUNE BERT ,  JAEGER HARALD ,  ZEILER THOMAS

IPC: H01L23/06 ,  H01L21/48 ,  H01L33/48 ,  H01L33/56

Abstract: The arrangement has a housing lower part (1) composed of an organic base material that contains inorganic filler particle. A cavity (102) of the lower part is open to an upper side (101) of the lower part. A housing upper part (2) is inserted into the cavity. A boundary layer (103) of the lower part is partially formed such that a mechanical holding strength is generated between the particle and the lower part. The strength is generated between the particle and a material of the upper part, where the material is selected from silicon and/or polysiloxane based material. An independent claim is also included for a method for production of a housing for a semiconductor component.

公开(公告)号：DE102007017855A1

公开(公告)日：2008-10-23

申请号：DE102007017855

申请日：2007-04-16

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： JAEGER HARALD ,  BRUNNER HERBERT ,  SCHNEIDER ALBERT

IPC: B81C1/00 ,  H01L33/52

公开(公告)号：DE102006032415A1

公开(公告)日：2007-04-05

申请号：DE102006032415

申请日：2006-07-13

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： JAEGER HARALD ,  WINTER MATTHIAS

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/64

公开(公告)号：DE102005041064A1

公开(公告)日：2007-03-01

申请号：DE102005041064

申请日：2005-08-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： JAEGER HARALD ,  HOEFER THOMAS ,  SCHWARZ RAIMUND ,  BRAUNE BERT ,  BRUNNER HERBERT

IPC: H01L31/02 ,  H01L31/18 ,  H01L33/48 ,  H01L33/62 ,  H01S5/022 ,  H01S5/028

Abstract: A surface-mounted optoelectronic component comprises an optoelecrtronic semiconductor chip (1), a molded body (2) that is shaped onto the chip, a mounting surface (3) that is formed at least positionwise through a surface of the shaped body, at least one connection point (4a,4b) and side surfaces (2a,2b) of the component produced by dicing. An independent claim is also included for a production process for the above.

公开(公告)号：DE10214208B9

公开(公告)日：2006-12-28

申请号：DE10214208

申请日：2002-03-28

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BRUNNER HERBERT ,  JAEGER HARALD ,  SCHMID JOSEF

IPC: H01L21/56 ,  H01L33/54

公开(公告)号：DE102004057804A1

公开(公告)日：2006-06-01

申请号：DE102004057804

申请日：2004-11-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： JAEGER HARALD ,  WINTER MATTHIAS

IPC: H01L23/08 ,  H01L31/0203 ,  H01L33/48 ,  H01L33/64

Abstract: The body has a poured ceramic material e.g. aluminum oxide or zirconium oxide, in which a lead frame (2) is partially embedded, and a particle (8) e.g. titanium oxide, with an inflectional action. The lead frame has a chip mounting surface (10), and an adhesive layer such as silicate, is applied on the lead frame. A recess (6) comprises a material e.g. epoxy resin, that partially surrounds a semiconductor chip arranged in the recess. An independent claim is also included for a method for manufacturing a housing body.

公开(公告)号：DE102004060358A1

公开(公告)日：2006-04-13

申请号：DE102004060358

申请日：2004-12-15

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WAITL GUENTER ,  KRAEUTER GERTRUD ,  HAHN BERTHOLD ,  BRUNNER HERBERT ,  HAERLE VOLKER ,  JAEGER HARALD ,  EISSLER DIETER

IPC: H01L33/50

Abstract: The invention relates to a method of making LED chips provided with a luminescence conversion material containing at least one phosphor. In the method, a layer composite is prepared that includes an LED layer sequence for a multiplicity of LED chips and comprises on a main surface at least one electrical contact surface for each LED chip, for electrically connecting said chip. A layer of adhesion promoter is applied to the main surface and selectively removed from at least portions of the contact surfaces. At least one phosphor is then applied to the main surface. Alternatively, a luminescence conversion material is applied to the main surface and selectively removed from at least portions of the contact surfaces. The invention also relates to an LED chip provided with a luminescence conversion material.

公开(公告)号：DE10258193A1

公开(公告)日：2004-07-15

申请号：DE10258193

申请日：2002-12-12

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BRUNNER HERBERT ,  JAEGER HARALD

IPC: B29C45/14 ,  H01L33/52 ,  H01L33/00

Abstract: The method involves forming trenches on a bonding layer adhered to a support substrate. The bonding layer is then inserted into a cavity of an injection mold (2). A pouring material (3) containing light-emission material and light-emission transformation material, is filled into the trenches of the bonding layer, after which the injection mold is removed.