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    OPTOELECTRONIC COMPONENT
    41.
    发明申请
    OPTOELECTRONIC COMPONENT 审中-公开
    光电组件

    公开(公告)号：WO03038912A2

    公开(公告)日：2003-05-08

    申请号：PCT/DE0204025

    申请日：2002-10-28

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  BOGNER GEORG ,  BRUNNER HERBERT ,  KRAEUTER GERTRUD ,  WAITL GUENTER

    Inventor： BOGNER GEORG ,  BRUNNER HERBERT ,  KRAEUTER GERTRUD ,  WAITL GUENTER

    IPC: H01L33/48 ,  H01L33/60 ,  H01L33/00

    CPC classification number: H01L33/486 ,  H01L33/483 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    Abstract: The invention concerns an optoelectronic component, in particular an optoelectronic component adapted to be surface-mounted, comprising a housing body (2), an optoelectronic semiconductor chip (3) arranged in particular in a recess (6) of the housing body, and electrical connections (1A, 1B), the semiconductor chip being in electroconductive connection with the electrical connections of the conductor network. The housing body (2) is made of a sheathing material, in particular a plastic material, filled with a filler material having a high degree of reflection in a wavelength range less than about 500 nm.

    Abstract translation: 光电子器件，特别是表面安装的光电器件具有一个壳体（2），特别是在凹部（6）的外壳主体设置光电子半导体芯片（3）和具有电端子（1A，1B），其中，半导体芯片与引线框架的电端子 导电连接。 壳体（2）由一包装材料，与具有高反射率的填料的波长区域低于约500nm形成特别是塑料材料制成。

    43.
    发明专利
    未知

    公开(公告)号：DE102005019115B4

    公开(公告)日：2010-04-08

    申请号：DE102005019115

    申请日：2005-04-25

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： BEHRINGER MARTIN ,  MOELLMER FRANK ,  HOEFER THOMAS ,  WAITL GUENTER

    IPC: H01S5/022 ,  H01S5/024 ,  H01S5/40

    Abstract: The component has a lead frame (4), a carrier (6) with a chip mounting surface and a base surface opposite to the chip mounting surface. A side surface runs from the chip mounting surface to the base surface. A laser bars chip (3) is arranged on the chip mounting surface of the carrier. The lead frame is connected to the side surface and is designed as a heat sink. The chip is bonded with hard solder e.g. gold-tin solder.

    44.
    发明专利
    未知

    公开(公告)号：DE59914949D1

    公开(公告)日：2009-03-05

    申请号：DE59914949

    申请日：1999-06-30

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： WAITL GUENTER ,  BRUNNER HERBERT

    IPC: H01L31/02 ,  H01L31/0203 ,  H01L33/48 ,  H01L33/62

    Abstract: A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas. By minimizing the area of the conductor exposed to the window, delamination brought about by the different thermal expansions of the window and conductor are minimized and/or eliminated. Likewise, with a reflective housing covering the base of the cavity that accommodates the window, internal radiation reflection is increased over that which was achieved with an exposed conductor.

    45.
    发明专利
    未知

    公开(公告)号：DE50210938D1

    公开(公告)日：2007-10-31

    申请号：DE50210938

    申请日：2002-10-28

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： BOGNER GEORG ,  BRUNNER HERBERT ,  KRAEUTER GERTRUD ,  WAITL GUENTER

    IPC: H01L31/0203 ,  H01L33/48 ,  H01L33/60

    Abstract: Optoelectronic component, having a housing body (2), an optoelectronic semiconductor chip (3) arranged in a recess (6) of the housing body, and having electrical terminals (1A, 1B), the semiconductor chip being electrically conductively connected to the electrical terminals of the leadframe. The housing body (2) is formed from an encapsulation material, with a filler which has a high degree of reflection in a wavelength range from the UV range.

    46.
    发明专利
    未知

    公开(公告)号：DE50014391D1

    公开(公告)日：2007-07-19

    申请号：DE50014391

    申请日：2000-08-04

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： HOEHN KLAUS ,  WAITL GUENTER ,  ARNDT KARLHEINZ

    IPC: C08G59/42 ,  C08G59/24 ,  C08G59/32 ,  C08G59/38 ,  C08L63/04 ,  H01L23/29 ,  H01L23/31 ,  H01L33/56

    Abstract: A casting resin compound as an assembly and encapsulation material for electronic and optoelectronic component parts, modules and components, for example for casting out optoelectronic components on the basis of acid anhydride-curable epoxy compounds, particularly bisphenol A-diglycidyl ether, contains multi-functional epoxy novolak resins, particularly an epoxy cresol novolak. This casting resin compound exhibits a clearly increased glass transition temperature, is suitable for mass-production, exhibits no health deteriorations, and supplies SMT-capable products that can be utilized in the automotive sector.

    47.
    发明专利
    未知

    公开(公告)号：DE10117890B4

    公开(公告)日：2007-06-28

    申请号：DE10117890

    申请日：2001-04-10

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： BOGNER GEORG ,  BRUNNER HERBERT ,  WAITL GUENTER

    IPC: H01L21/68 ,  H01L31/0203 ,  H01L31/0224 ,  H01L33/48 ,  H01L33/62 ,  H01S5/022 ,  H01S5/024

    Abstract: Production of a semiconductor component which emits and receives radiation comprises forming and preparing an electrical leadframe (2); mounting a chip (5) ; placing an injection mold on the lead frame so that the semiconductor chip lies in a chip cavity of a molding stamp of the mold for a radiation window (8); extruding the leadframe with a housing base body (1); and encapsulating the chip. Production of a semiconductor component which emits and receives radiation comprises forming and preparing an electrical leadframe (2) having a chip assembly region, a wire connecting region (10) and external electrical connecting strips (3a, 3b); mounting a chip (5) which emits and receives radiation on the chip assembly region using a thermally conducting connecting material having a melting temperature above the solder temperature of the subsequent component steps; placing an injection mold on the lead frame so that the semiconductor chip lies in a chip cavity of a molding stamp of the mold for a radiation window (8); extruding the leadframe with a housing base body (1) so that the semiconductor chip is arranged in the window; and encapsulating the chip. An Independent claim is also included for a semiconductor component produced. Preferred Features: The connecting material is a hard solder. The melting point of the connecting material is 260 deg C or more. The chip is surrounded by a plastic composition.

    49.
    发明专利
    未知

    公开(公告)号：DE102004045947A1

    公开(公告)日：2006-01-19

    申请号：DE102004045947

    申请日：2004-09-22

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： WAITL GUENTER ,  BOGNER GEORG ,  GROETSCH STEFAN ,  WANNINGER MARIO

    IPC: G02B7/00 ,  H01L33/58 ,  H01L33/60

    Abstract: The assembly has a light-emitting chip (1) with a radiation decoupling surface (2), via which the greater part of the electromagnetic radiation that is generated in the chip emerges in a primary emission direction. The chip is placed on a heat sink (4). A housing (5) laterally surrounds the chip and a reflective lens (6) is situated downstream of the surface (2) in the primary emission direction. An independent claim is also included for a utilization of the light emitting assembly in equipment such as camera mobile phone, digital camera or video camera.

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