公开(公告)号：WO2015023540A1

公开(公告)日：2015-02-19

申请号：PCT/US2014/050376

申请日：2014-08-08

Applicant: COOLEDGE LIGHTING INC. ,  TISCHLER, Michael, A. ,  PINNINGTON, Thomas ,  SCHICK, Philippe ,  JUNGWIRTH, Paul

Inventor： TISCHLER, Michael, A. ,  PINNINGTON, Thomas ,  SCHICK, Philippe ,  JUNGWIRTH, Paul

IPC: H01L33/00

CPC classification number: H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05B33/0893 ,  H05B37/036 ,  H05B37/04 ,  H05K1/0268 ,  H05K1/0269 ,  H05K1/0386 ,  H05K1/141 ,  H05K1/147 ,  H05K3/225 ,  H05K3/288 ,  H05K3/305 ,  H05K2201/049 ,  H05K2201/09045 ,  H05K2201/09063 ,  H05K2201/09918 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/10303 ,  H05K2201/10386 ,  H05K2201/10757 ,  H05K2201/10795 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K2201/2054 ,  H05K2203/1545 ,  H05K2203/162 ,  H05K2203/166 ,  H05K2203/175 ,  H05K2203/176 ,  H01L2924/00

Abstract: A method for repairing a lighting system comprises identifying a fault location; disposing over or under the substrate at the fault location a patch comprising (i) a patch substrate, (ii) two conductive traces disposed on the patch substrate, and (iii) a replacement light-emitting element electrically coupled to the two conductive traces of the patch; and electrically connecting the replacement light-emitting element across the fault location by electrically connecting each of the conductive traces of the patch to one of the conductive traces defining the fault location.

Abstract translation: 修理照明系统的方法包括识别故障位置; 在所述故障位置处布置在所述基底之上或之下的贴片，所述贴片包括（i）贴片衬底，（ii）布置在所述贴片衬底上的两个导电迹线，以及（iii）替代发光元件，电耦合到所述两个导电迹线 补丁; 以及通过将所述贴片的每个所述导电迹线电连接到限定所述故障位置的导电迹线之一来将所述替代发光元件电连接在所述故障位置上。

公开(公告)号：WO1998014039A1

公开(公告)日：1998-04-02

申请号：PCT/IB1997000888

申请日：1997-07-17

Applicant: PHILIPS ELECTRONICS N.V. ,  PHILIPS NORDEN AB

Inventor： PHILIPS ELECTRONICS N.V. ,  PHILIPS NORDEN AB ,  DIJKSTRA, Rinse

IPC: H05K07/10

CPC classification number: H01G4/228 ,  H01G2/06 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/094 ,  H05K2201/0979 ,  H05K2201/10651 ,  H05K2201/10856 ,  H05K2201/10863 ,  H05K2201/10878

Abstract: In this application, a description is given of a passive component comprising two electric connections with a plug-in portion for securing and electrically connecting the component to a printed circuit board, for example an electrolytic capacitor. In accordance with the invention, this component is so constructed that both plug-in portions are provided with two pins, with the plug-in portions being so positioned that the four pins do not extend in a flat plane. By virtue of the measure in accordance with the invention, resoldering of such components can be dispensed with. The use of pins whose length and width are different enables the manual installation of the components in accordance with the invention in the correct position to be simplified.

Abstract translation: 在本申请中，给出了一种无源元件的描述，该无源部件包括具有插入部分的两个电连接，用于固定和电连接该部件到印刷电路板，例如电解电容器。 根据本发明，该部件被构造成使得两个插入部分设置有两个销，插入部分被定位成使得四个销不在平面内延伸。 凭借根据本发明的措施，可以省去这些部件的分解。 使用长度和宽度不同的销可以将根据本发明的部件手动安装在正确的位置以被简化。

公开(公告)号：WO1996016440A1

公开(公告)日：1996-05-30

申请号：PCT/US1995014843

申请日：1995-11-13

Applicant: FORMFACTOR, INC.

Inventor： FORMFACTOR, INC. ,  KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L.

IPC: H01L23/02

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: Interconnection elements (210) for electronic components, exhibiting desirable mechanical characteristics (such as resiliency, for making pressure contacts) are formed by shaping an elongate element (core) (216) of a soft material (such as gold) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped elongate element with a hard material (220) (such as nickel and its alloys), to impart a desired spring (resilient) characteristic to the resulting composite interconnection element (210). A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element (210). The elongate element (216) may be formed from a wire, or from a sheet (e.g., metal foil). The resulting interconnection elements may be mounted to a variety of electronic components, including directly to semiconductor dies and wafers (in which case the overcoat material anchors the composite interconnection element (210) to a terminal (or the like) on the electronic component), may be mounted to support substrates for use as interposers and may be mounted to substrates for use as probe cards or probe card inserts.

Abstract translation: 通过将软材料（例如金）的细长元件（芯）（216）成形为具有弹性形状来形成用于电子部件的用于显示期望的机械特性（例如弹性，用于形成压力接触）的互连元件（210） （包括悬臂梁，S形，U形），并用硬质材料（220）（例如镍及其合金）涂覆成形的细长元件，以赋予所得复合互连件所需的弹簧（弹性）特性 元件（210）。 可以对复合互连元件（210）施加具有优异电气质量（例如导电性和/或可焊性）的材料的最终外涂层。 细长元件（216）可以由导线或从片材（例如，金属箔）形成。 所形成的互连元件可以安装到各种电子部件，包括直接连接到半导体管芯和晶片（在这种情况下，外涂层材料将复合互连元件（210）锚定到电子部件上的端子等）上， 可以安装到支撑基板上以用作插入件，并且可以安装到用作探针卡或探针卡插入件的基板。

公开(公告)号：WO1992022996A1

公开(公告)日：1992-12-23

申请号：PCT/DE1992000381

申请日：1992-05-12

Applicant: ROBERT BOSCH GMBH ,  MAYER, Rolf ,  SIEGEL, Heinz ,  DERINGER, Helmut ,  SCHURR, Volker

Inventor： ROBERT BOSCH GMBH

IPC: H05K03/34

CPC classification number: H01R12/67 ,  B60T8/3675 ,  H01R4/02 ,  H01R4/2404 ,  H05K1/118 ,  H05K3/0058 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3447 ,  H05K2201/091 ,  H05K2201/1003 ,  H05K2201/10303 ,  H05K2201/10878 ,  H05K2203/1189

Abstract: The aim of the invention is to produce a mechanically and electrically secure solder bond between a contact pin and a solder eyelet on a conductor track sheet. With respect to its end (29), the contact pin (14) has a reduced section, in the form of a constriction (32) for instance, in which lodge sheet sections (28) which protrude out from the plane of the conductor track sheet (18) and which are formed when the contact pin pierces the initially virgin solder eyelet (23). The solder (25) connects the conducting film (21) of the solder eyelet (23) and sheet sections (28) with the contact pin (14).

公开(公告)号：WO2016174715A1

公开(公告)日：2016-11-03

申请号：PCT/JP2015/062703

申请日：2015-04-27

Applicant: 富士機械製造株式会社

Inventor： 大坪　覚 ,  出蔵　和也

IPC: H05K3/34 ,  H05K13/04

CPC classification number: H05K13/043 ,  H05K3/306 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/3468 ,  H05K13/0069 ,  H05K13/04 ,  H05K2201/1059 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2203/0195 ,  H05K2203/044

Abstract: 本発明の作業機では、回路基材の下方から溶融はんだを噴流する噴流装置１００と、回路基材に形成された貫通穴にリード部品のリード線が挿入される際に、回路基材を下方から支持するバックアップピン１２４とが個別に、回路基材の下方において移動される。このため、回路基材を支持する必要がある場合には、バックアップピンを任意の位置に移動させ、はんだ付けを行う必要がある場合には、バックアップピンを、噴流装置の作動に邪魔にならない位置に移動させることが可能となる。これにより、噴流装置の作動を担保するとともに、必要に応じて、回路基材をバックアップピンにより支持することが可能となり、作業機の実用性が向上する。

Abstract translation: 在根据本发明的工作机器中，使熔融焊料的射流从电路基板的下方流出的喷射装置100和从下方支承电路基板的备用销124， 引线被插入到形成在电路基板中的通孔中，分别在电路基板的下方移动。 因此，当电路基板需要被支撑时，备用引脚可以移动到任意限定的位置，并且当需要进行焊接时，备用引脚可以移动到不干扰喷射装置的操作的位置。 通过这种方式，可以确保喷射装置的操作，并且可以根据需要通过支撑销支撑电路基板，从而提高作业机器的实用性。

公开(公告)号：WO2014094584A1

公开(公告)日：2014-06-26

申请号：PCT/CN2013/089611

申请日：2013-12-16

Applicant: 厦门立达信照明有限公司 ,  王林华 ,  朱小磊 ,  周琳 ,  赵函

Inventor： 王林华 ,  朱小磊 ,  周琳 ,  赵函

IPC: F21V23/00 ,  F21Y101/02

CPC classification number: F21V23/06 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21V23/00 ,  F21V23/006 ,  F21Y2115/10 ,  H01R33/18 ,  H01R33/225 ,  H05K3/308 ,  H05K3/366 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10333 ,  H05K2201/10393 ,  H05K2201/1059 ,  H05K2201/10878

Abstract: 一种电连接件（30）及使用该电连接件（30）的LED灯（100）。电连接件（30）用于LED灯（100）的光源基板（20）与驱动板（40）之间的电连接，包括输入端子（32）和输出端子（34）。LED灯（100）包括驱动板（40）和光源基板（20）。输出端子（34）设置在LED灯（100）的驱动板（40）上，光源基板（20）对应输入端子（32）设有固定孔（22）。输入端子（32）固定在光源基板（20）的固定孔（22）内并与光源基板（20）电连接。输出端子（34）包括两个触头（342），两个触头（342）的一端分别与驱动板（40）电连接。输入端子（32）包括两个连接头，两个连接头分别对应两个触头（342）设置。两个连接头的一端分别与光源基板（20）电连接。组装时，输出端子（34）的两个触头（342）分别插设在输入端子（32）对应的两个连接头内，两个连接头分别弹性地抵接两个触头（342）。电连接件（30）具有便于自动化组装的优点。

公开(公告)号：WO00001208A1

公开(公告)日：2000-01-06

申请号：PCT/US1999/014924

申请日：1999-06-30

IPC: H05K1/18 ,  B23K1/00 ,  B23K20/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/01 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/04 ,  H01L23/12 ,  H01L23/13 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

CPC classification number: H01L25/16 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0408 ,  G01R1/0433 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/01 ,  G01R31/2863 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/49811 ,  H01L23/5385 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19043 ,  H05K1/141 ,  H05K3/20 ,  H05K3/325 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/09472 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48

Abstract: Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. A securing device such as a housing positions the electronic component securely to the socket substrate. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.

Abstract translation: 提供产品和组件用于可插拔地接收从电子部件（例如半导体器件）延伸的细长互连元件，例如弹簧接触元件。 插座基板设置有用于接收从电子部件延伸的细长互连元件的端部的捕获垫。 公开了各种捕获垫结构。 诸如壳体的固定装置将电子部件牢固地定位到插座基板。 通过邻近插座基板表面的导电迹线提供与外部设备的连接。 插座基板可以由支撑基板支撑。 在特别优选的实施例中，捕获垫直接形成在诸如印刷电路板的主要基底上。

公开(公告)号：WO1996017378A1

公开(公告)日：1996-06-06

申请号：PCT/US1995014909

申请日：1995-11-13

Applicant: FORMFACTOR, INC.

Inventor： FORMFACTOR, INC. ,  KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W.

IPC: H01L21/60

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire (502) to a substrate (508), configuring the wire (530) into a wire stem (530) having a springable shape, severing the wire stem (530), and overcoating the wire stem (530) with at least one layer of a material (522). In an exemplary embodiment, a free end of a wire stem (530) is bonded to a contact area on a substrate (508), the wire stem (530) is configured to have a springable shape, the wire stem (530) is severed to be free-standing by an electrical discharge, and the free-standing wire stem is overcoated by plating. A variety of materials for the wire stem (530) (which serves as a falsework) and for the overcoat (540) (which serves as a superstructure over the falsework) are disclosed. The resilient contact structures described herein are ideal for making a "temporary" (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing.

Abstract translation: 通过将线（502）的自由端接合到基底（508）上而形成表现出针对各种电子元件的弹性或顺应性的接触结构，将线（530）配置成具有弹性形状的线杆（530） 切断线杆（530），以及用至少一层材料（522）覆盖线杆（530）。 在示例性实施例中，线杆（530）的自由端结合到基底（508）上的接触区域，线杆（530）构造成具有弹性形状，线杆（530）被切断 通过放电自由地放置，独立的线杆通过电镀覆盖。 公开了用于线杆（530）（其用作脚手架）和外罩（540）（其用作脚手架上的上部结构）的各种材料。 本文所述的弹性接触结构对于进行诸如半导体管芯的电子部件的“临时”（探针）连接是理想的，用于老化和功能测试。

公开(公告)号：WO1996015551A1

公开(公告)日：1996-05-23

申请号：PCT/US1995014842

申请日：1995-11-13

Applicant: FORMFACTOR, INC.

Inventor： FORMFACTOR, INC. ,  KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W. ,  DOZIER, Thomas, H.

IPC: H01L21/60

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: Resilient contact structures extend from a top surface of a support substrate and solder-ball (or other suitable) contact structures are disposed on a bottom surface of the support substrate. Interconnection elements (110) are used as the resilient contact structures and are disposed atop the support substrate. Selected ones of the resilient contact structures atop the support substrate are connected, via the support substrate, to corresponding ones of the contact structures on the bottom surface of the support substrate. In an embodiment intended to receive an LGA-type semiconductor package (304), pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally normal to the top surface of the support substrate (302). In an embodiment intended to receive a BGA-type semiconductor package (404), pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally parallel to the top surface of the support substrate (402).

Abstract translation: 弹性接触结构从支撑衬底的顶表面延伸，并且焊球（或其它合适的）接触结构设置在支撑衬底的底表面上。 互连元件（110）用作弹性接触结构，并设置在支撑基板的顶部。 通过支撑衬底将支撑衬底上的弹性接触结构中的选定的一个连接到支撑衬底的底表面上的对应的接触结构。 在旨在接收LGA型半导体封装（304）的实施例中，在弹性接触结构和半导体封装的外部连接点之间以与支撑衬底的顶表面大致垂直的接触力进行压力接触（ 302）。 在旨在接收BGA型半导体封装（404）的实施例中，在弹性接触结构和半导体封装的外部连接点之间形成压力接触，该接触力通常平行于支撑衬底的顶表面 402）。

公开(公告)号：KR100269706B1

公开(公告)日：2000-10-16

申请号：KR1019970708456

申请日：1996-05-24

Applicant: 폼팩터, 인크.

Inventor： 엘드리지벤자민엔. ,  매튜개탄엘.

IPC: B23K9/067

CPC classification number: H05K3/4015 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/07314 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/45 ,  H01L24/72 ,  H01L24/78 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/1532 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/81205

Abstract: 본드 와이어(102, 202)를 전달하고 본드 와이어[다른 기구에 의해 이미 절단된 본드 와이어(202)를 포함함]의 단부에 볼(234, 236)을 형성하기 위한 전기 방전의 효능은 자외선(130)에 직면하여 전기 방전을 수행함으로써 개선된다. "스파크갭"은 EFO 전극(118, 232)과 와이어(102, 202) 사이에 형성되고, 이들 중 하나는 스파크 갭의 음극으로서 작용한다. 바람직하게, 자외선(130)은 스파크 갭의 음극으로서 작용하는 요소로 지향된다. 스파크 갭의 음극 요소에서의 광전 방출의 제공은 아크/플라즈마 형성을 안정화시키고 더욱 신뢰가능하고 예측가능한 결과를 형성한다. 이 기술은 네가티브 EFO 시스템 또는 포지티브 EFO 시스템과 함께 사용될 수 있고, 직접 또는 전계 보조 방출과 함께 유익하게 사용된다.