公开(公告)号：GB2422720A

公开(公告)日：2006-08-02

申请号：GB0518966

申请日：2003-06-18

Applicant: INTEL CORP

Inventor： MA QING ,  CHOU TSUNG-KUAN ALLEN

IPC: B81C1/00 ,  H01L23/522 ,  B81B7/00 ,  B81B7/02 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/822 ,  H01L23/52 ,  H01L23/66 ,  H01L27/04

Abstract: A conductive bridge 16 in a second conductive layer electrically connects a pair of spaced apart conductive strips 12 in a first conductive layer. A gap (44, fig 4) between the conductive strips 12 is spanned by the bridge 16 while isolating the conductive strips and the bridge from a conducting line (46, fig 4) extending through the gap (44). Preferably the bridge is formed over a sacrificial polymeric material (48, fig 10) which is subsequently removed by heating to leave an airgap 58 between the bridge 16 and the conducting line (46). The system can be used to route a control voltage line (18a, fig 2) through gaps in multiple ground lines (12a, 12b, 12c fig 2) where each gap is spanned by a conductive bridge (20, 20a fig 2).

公开(公告)号：HK1060660A1

公开(公告)日：2004-08-13

申请号：HK04103550

申请日：2004-05-19

Applicant: INTEL CORP

Inventor： WANG LI-PENG ,  BAR-SADEH EYAL ,  RAO VALLURI ,  HECK JOHN ,  MA QING ,  TRAN QUAN ,  TALALYEVSKIY ALEXANDER ,  GINSBURG EYAL

IPC: H03H9/24 ,  H03H3/02 ,  H03H9/56 ,  H03H

Abstract: A film bulk acoustic resonator filter (10) may be formed with a plurality of interconnected series and shunt film bulk acoustic resonators (38) formed on the same membrane (35). Each of the film bulk acoustic resonators (38) may be formed from a common lower conductive layer which is defined to form the bottom electrode (32) of each film bulk acoustic resonator (38). A common top conductive layer may be defined to form each top electrode (36) of each film bulk acoustic resonator (38). A common piezoelectric film layer (34), that may or may not be patterned, forms a continuous or discontinuous film.

公开(公告)号：AU2003298535A8

公开(公告)日：2004-05-04

申请号：AU2003298535

申请日：2003-08-01

Applicant: INTEL CORP

Inventor： TRAN QUAN ,  GINSBURG EYAL ,  RAO VALLURI ,  WANG LI-PENG ,  TALALYEVSKY ALEXANDER ,  MA QING ,  BAR-SADEH EYAL ,  HECK JOHN

IPC: H03H9/24 ,  H03H3/02 ,  H03H9/56 ,  H03H9/205

Abstract: A film bulk acoustic resonator filter (10) may be formed with a plurality of interconnected series and shunt film bulk acoustic resonators (38) formed on the same membrane (35). Each of the film bulk acoustic resonators (38) may be formed from a common lower conductive layer which is defined to form the bottom electrode (32) of each film bulk acoustic resonator (38). A common top conductive layer may be defined to form each top electrode (36) of each film bulk acoustic resonator (38). A common piezoelectric film layer (34), that may or may not be patterned, forms a continuous or discontinuous film.

公开(公告)号：AU2003265874A1

公开(公告)日：2004-03-19

申请号：AU2003265874

申请日：2003-08-28

Applicant: INTEL CORP

Inventor： MA QING ,  RAVI KRAMADHATI ,  RAO VALLURI

IPC: H01H11/00 ,  H01H1/04 ,  H01H59/00 ,  H01P1/12

Abstract: A switch structure having multiple contact surfaces that may contact each other. One or more of the contact surfaces may be coated with a resilient material such as diamond.

公开(公告)号：AU2003269961A1

公开(公告)日：2004-03-03

申请号：AU2003269961

申请日：2003-08-13

Applicant: INTEL CORP

Inventor： MA QING

IPC: B81B3/00 ,  H01H59/00

Abstract: A microelectromechanical system (MEMS) switch that includes a signal contact, an actuation electrode and a beam that engages the signal contact when a voltage is applied to the actuation electrode. The signal contact includes a first portion and a second portion. The actuation electrode is positioned between the first and second portions of the signal contact.

公开(公告)号：DE10326555A1

公开(公告)日：2004-01-22

申请号：DE10326555

申请日：2003-06-12

Applicant: INTEL CORP

Inventor： MA QING ,  CHOU TSUNG-KUAN ALLEN

IPC: B81C1/00 ,  B81B7/00 ,  B81B7/02 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/822 ,  H01L23/52 ,  H01L23/522 ,  H01L23/66 ,  H01L27/04 ,  H01L23/535

Abstract: A conductive bridge (16) in a second conductive layer may be utilized to join a pair of spaced apart conductive strips (12) in a first conductive layer. A gap (44) between the first and second strips (12) may be bridged by the bridge (16) while isolating both the first and second strips (12) and the bridge (16) itself from another conductor (18) which extends through the gap (44) between the first and second strips (12).

公开(公告)号：HK1055844A1

公开(公告)日：2004-01-21

申请号：HK03108126

申请日：2003-11-10

Applicant: INTEL CORP

Inventor： MU XIAO-CHUN ,  MA QING ,  FUJIMOTO HARRY

IPC: H01L20090101 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/31 ,  H01L23/538 ,  H05K1/18 ,  H05K3/46

公开(公告)号：AU3274702A

公开(公告)日：2002-06-18

申请号：AU3274702

申请日：2001-11-09

Applicant: INTEL CORP

Inventor： HENAO MARIA V ,  MU XIAO-CHUN ,  MA QING ,  VU QUAT T ,  TOWLE STEVEN N

IPC: H01L23/12 ,  H01L21/56 ,  H01L23/16 ,  H01L23/31 ,  H01L23/433 ,  H01L23/538 ,  H01L25/04 ,  H01L25/18

Abstract: A microelectronic package fabrication technology that attaches at least one microelectronic die onto a heat spreader and encapsulates the microelectronic die/dice thereon which may further include a microelectronic packaging core abutting the heat spreader wherein the microelectronic die/dice reside within at least one opening in a microelectronic package core. After encapsulation, build-up layers may be fabricated to form electrical connections with the microelectronic die/dice.

公开(公告)号：AU8851001A

公开(公告)日：2002-03-22

申请号：AU8851001

申请日：2001-08-29

Applicant: INTEL CORP

Inventor： HENAO MARIA ,  MU XIAO-CHUN ,  MA QING ,  VU QUAT ,  LI JIAN

IPC: H01L23/532 ,  H01L23/538

公开(公告)号：AU3651001A

公开(公告)日：2001-08-07

申请号：AU3651001

申请日：2001-01-22

Applicant: INTEL CORP

Inventor： CHENG PENG ,  MA QING

IPC: H01G5/16

Abstract: The invention relates to a variable capacitor and method of making it. The variable capacitor comprises a fixed charge plate disposed in a substrate, a movable charge plate disposed above the fixed charge plate, and a stiffener affixed to the movable charge plate. The movable charge plate may be patterned to form a movable actuator plate where the fixed charge plate is elevated above a fixed actuator plate.