52.
    发明专利
    未知

    公开(公告)号:DE102007062044A1

    公开(公告)日:2009-06-25

    申请号:DE102007062044

    申请日:2007-12-21

    Abstract: The invention relates to a semiconductor laser device comprising a laser bar (2), a flexible conductor support (10), a supporting body (3) of a metal or a metal alloy and a heat sink (4), which is arranged between the supporting body (3) and the laser bar (2), the laser bar (2) being electrically contacted by the flexible conductor support (10) and the supporting body (3) having a thickness of at least 2 mm. The invention further relates to a method for producing the above-described semiconductor laser device, wherein a synchronous soldering process is used to solder the laser bar (2) to the heat sink (4) by means of a hard solder layer (30) and the heat sink (4) to the supporting body (3) by means of a further hard solder layer (31).

    Manufacture of precision optical components for e.g. color beam deflection, combination or extraction, edge-fastens parallel cut glass strips to silicon wafer

    公开(公告)号:DE102007032068A1

    公开(公告)日:2009-01-15

    申请号:DE102007032068

    申请日:2007-07-10

    Abstract: A transparent material, especially a 6 inch glass wafer, is divided into strips (2) by sawing. Cut surfaces are smoothed. The strips are bonded to a substrate (4), e.g. a silicon wafer. The substrate and bonded strips are divided, in order to make the optical components required. Opposite planar surfaces of the glass are parallel; at least one of them has an anti-reflective coating. At least one has a reflective coating. The cut strips are arranged so that two or more cut surfaces are smoothed together, before bonding. The smoothed strips are bonded to the substrate by their smoothed, cut sides. The substrate is made of silicon. Anodic bonding, or alternatively low-temperature bonding, is used. Strips are fastened at right angles to the surface of the substrate, and are mutually-parallel. Spacers are used to align the strips on the substrate. These are removed before dividing the substrate with its bonded strips. The substrate and bonded strips are bodily-divided, to make carriers with optical elements, in such a manner that after division, only one optical element is present on each carrier. Alternatively, the division may leave numbers of optical elements (cut from their respective original strips) on a single carrier. This stage of division is also achieved by sawing.

    54.
    发明专利
    未知

    公开(公告)号:DE102005056949A1

    公开(公告)日:2007-04-05

    申请号:DE102005056949

    申请日:2005-11-29

    Abstract: The laser has a modes selective device provided for rejection of higher resonator modes of the laser. The selective device is fixedly connected with a semiconductor body (3). The selective device is arranged in an optical path of a pumping radiation source. An optical unit (11) is used as a heat sink and provided in thermal contact with a radiation passage surface of the body. A non-optical linear crystal is arranged in a resonator of the laser. The optical unit is provided for frequency selection of the laser radiation passing through the optical unit.

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