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51.发明申请
公开(公告)号：WO2006053206A9
公开(公告)日：2006-08-24
申请号：PCT/US2005040907
申请日：2005-11-10
Applicant: PPG IND OHIO INC
Inventor： OLSON KEVIN C , WANG ALAN E , ELENIUS PETER , GOODMAN THOMAS W
CPC classification number: H05K3/002 , H05K1/056 , H05K3/0052 , H05K3/403 , H05K3/44 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K3/4644 , H05K2201/0166 , H05K2201/0397 , H05K2201/0909 , H05K2201/09181 , H05K2201/0919 , H05K2201/09309 , H05K2201/09536 , H05K2201/09545 , H05K2201/09554 , H05K2201/09645 , H05K2201/09827 , H05K2203/1105 , H05K2203/135
Abstract: A circuit board or each circuit board of a multi-layer circuit board includes an electrically conductive sheet coated with an insulating top layer covering one surface of the conductive sheet, an insulating bottom layer covering another surface of the conductive sheet and an insulating edge layer covering an edge of the conductive sheet. An insulating interlayer can be sandwiched between a pair of adjacent circuit boards of a multi-layer circuit board assembly. A landless through-hole or via can extend through one or more of the circuit boards for connecting electrical conductors on opposing surfaces thereof.
Abstract translation: 多层电路板的电路板或每个电路板包括涂覆有覆盖导电片的一个表面的绝缘顶层的导电片，覆盖导电片的另一个表面的绝缘底层以及覆盖导电片的绝缘边缘层覆盖物 导电片的边缘。 绝缘中间层可以夹在多层电路板组件的一对相邻电路板之间。 无焊点通孔或通孔可以延伸穿过一个或多个电路板，用于在其相对表面上连接电导体。
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52.发明公开ELECTRONIC DEVICE HAVING A HIDDEN INPUT KEY AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE 审中-公开一个隐藏的电子输入设备和电子器件的制造方法
公开(公告)号：EP2628065A1
公开(公告)日：2013-08-21
申请号：EP10778850.7
申请日：2010-10-13
Applicant: Sony Ericsson Mobile Communications AB
Inventor： MORÄN, Jonas , KLEVERMAN, Mats
CPC classification number: G06F3/0202 , H03K17/9645 , H05K1/0275 , H05K1/053 , H05K1/115 , H05K1/116 , H05K1/162 , H05K1/167 , H05K3/0026 , H05K3/4015 , H05K3/4046 , H05K3/445 , H05K2201/0108 , H05K2201/0376 , H05K2201/09545 , H05K2201/09609 , H05K2201/09836 , H05K2201/0999 , H05K2201/10121 , H05K2201/10151 , H05K2203/107
Abstract: An electronic device comprises a housing having an outer face and an inner face. A key is provided on the housing, which comprises a micro hole formed in the housing and a conductive material extending within the micro hole to the outer face of the housing. A sensor is coupled to the conductive material to detect whether an object is brought into contact or out of contact with the micro hole at the outer face.
Abstract translation: 一种电子设备，包括具有外表面和上内面的壳体。 一个关键的设置在外壳，它包括一个微孔在壳体和导电材料的微孔到所述外壳的外表面内延伸而形成上。 传感器被耦合到所述导电材料以检测被接触或不与在外表面上的微孔接触的是否为对象。
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53.发明公开
公开(公告)号：EP1137332A1
公开(公告)日：2001-09-26
申请号：EP00956889.0
申请日：2000-09-01
Applicant: IBIDEN CO., LTD.
Inventor： INAGAKI, Yasushi, Ogaki-Kita-Kojou, Ibiden Co Ltd , ASAI, Motoo, Ogaki-Kita-Kojou, Ibiden Co Ltd , WANG, Dongdong, Ogaki-Kita-Kojou, Ibiden Co Ltd , YABASHI, Hideo, Ogaki-Kita-Kojou, Ibiden Co Ltd , SHIRAI, Seiji, Ogaki-Kita-Kojou, Ibiden Co Ltd
CPC classification number: H05K1/115 , H01G2/06 , H01G4/12 , H01G4/224 , H01G4/228 , H01G4/248 , H01G4/40 , H01L21/4857 , H01L23/498 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L25/16 , H01L25/162 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05027 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2924/01002 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01046 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H05K1/0231 , H05K1/112 , H05K1/181 , H05K1/183 , H05K1/185 , H05K1/186 , H05K3/4602 , H05K2201/09509 , H05K2201/09545 , H05K2201/096 , H05K2201/10015 , H05K2201/10636 , H05K2201/10674 , Y02P70/611
Abstract: Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large thickness. Therefore, the thickness of the printed circuit board does not become large.
Abstract translation: 在印刷电路板10中设置片状电容器20以这种方式，向IC芯片90和片状电容器20之间的距离被缩短，并且降低环路电感。 此外，片状电容器20容纳在具有大厚度的核心基板30。 因此，在印刷电路板的厚度不会变大。
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公开(公告)号：EP0101409B1
公开(公告)日：1987-11-19
申请号：EP83810323.2
申请日：1983-07-15
Applicant: CIRTECH S.A.
Inventor： Strobel, Jean-Paul
IPC: H05K3/42
CPC classification number: H05K3/427 , H05K1/116 , H05K3/062 , H05K3/108 , H05K3/3468 , H05K2201/09545 , H05K2203/044 , H05K2203/0723 , Y10T29/49165
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公开(公告)号：EP0101409A1
公开(公告)日：1984-02-22
申请号：EP83810323.2
申请日：1983-07-15
Applicant: CIRTECH S.A.
Inventor： Strobel, Jean-Paul
IPC: H05K3/42
CPC classification number: H05K3/427 , H05K1/116 , H05K3/062 , H05K3/108 , H05K3/3468 , H05K2201/09545 , H05K2203/044 , H05K2203/0723 , Y10T29/49165
Abstract: @ Le circuit imprimé est réalisé sans couronnes de soudure, aussi appelées pastilles, autour des trous de connection, de contactage et de fixation.
La paroi du trou est recouverte d'une couche de cuivre (24) qui s'étend jusqu'à la surface du support (10) ou qui s'arrête un peu au-dessous. Cette couche porte une métallisation en étain-plomb (26) qui sert de couche de liaison à la soudure (32). Cette dernière s'étend vers le fil (30) du composant soudé mais ne touche pas la surface du support.
Une condition de la réalisation est le perçage précis, net, propre et franc des trous.-
Patent Agency Ranking56.发明公开
公开(公告)号：EP3275292A1
公开(公告)日：2018-01-31
申请号：EP16714805.5
申请日：2016-03-23
Applicant: Safran Electronics & Defense
Inventor： GUILLOT, François , SPOOR, Pascal , CHETANNEAU, Patrice
CPC classification number: H05K7/1439 , G06F1/184 , H01R12/7064 , H01R12/716 , H05K1/111 , H05K1/115 , H05K3/0011 , H05K3/0094 , H05K3/421 , H05K3/4644 , H05K7/1412 , H05K7/1445 , H05K7/1452 , H05K7/1459 , H05K2201/0104 , H05K2201/09509 , H05K2201/09545 , H05K2201/10189 , H05K2201/10295
Abstract: The present invention concerns a backplane electronic board (20) having an inner face (142) suitable for being connected to electronic board connectors (12) and an outer face (143) suitable for being connected to an outer connector (15), the backplane board (20) being characterised in that it has blind holes opening on the inner face (142) of same, and holes opening on the outer face (143) of same, the holes being suitable for receiving press-fit connection elements and forming therewith an electrical connection point.
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57.发明公开
公开(公告)号：EP1817947A1
公开(公告)日：2007-08-15
申请号：EP05851537.0
申请日：2005-11-10
Applicant: PPG Industries Ohio, Inc.
Inventor： OLSON, Kevin, C. , WANG, Alan, E. , ELENIUS, Peter , GOODMAN, Thomas, W.
CPC classification number: H05K3/002 , H05K1/056 , H05K3/0052 , H05K3/403 , H05K3/44 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K3/4644 , H05K2201/0166 , H05K2201/0397 , H05K2201/0909 , H05K2201/09181 , H05K2201/0919 , H05K2201/09309 , H05K2201/09536 , H05K2201/09545 , H05K2201/09554 , H05K2201/09645 , H05K2201/09827 , H05K2203/1105 , H05K2203/135
Abstract: A circuit board or each circuit board of a multi-layer circuit board includes an electrically conductive sheet coated with an insulating top layer covering one surface of the conductive sheet, an insulating bottom layer covering another surface of the conductive sheet and an insulating edge layer covering an edge of the conductive sheet. An insulating interlayer can be sandwiched between a pair of adjacent circuit boards of a multi-layer circuit board assembly. A landless through-hole or via can extend through one or more of the circuit boards for connecting electrical conductors on opposing surfaces thereof.
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公开(公告)号：EP1744606A3
公开(公告)日：2007-04-11
申请号：EP06020265.2
申请日：2000-09-01
Applicant: IBIDEN CO., LTD.
Inventor： Inagaki, Yasushi Ogaki-kita-kojou Ibiden Co., Ltd. , Asai, Motoo Ogaki-kita-kojou Ibiden Co., Ltd. , Wang, Dongdong Ogaki-kita-kojou Ibiden Co., Ltd. , Yabashi, Hideo Ogaki-kita-kojou Ibiden Co., Ltd. , Shirai, Seiji Ogaki-kita-kojou Ibiden Co., Ltd.
IPC: H05K1/18
CPC classification number: H05K1/115 , H01G2/06 , H01G4/12 , H01G4/224 , H01G4/228 , H01G4/248 , H01G4/40 , H01L21/4857 , H01L23/498 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L25/16 , H01L25/162 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05027 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2924/01002 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01046 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H05K1/0231 , H05K1/112 , H05K1/181 , H05K1/183 , H05K1/185 , H05K1/186 , H05K3/4602 , H05K2201/09509 , H05K2201/09545 , H05K2201/096 , H05K2201/10015 , H05K2201/10636 , H05K2201/10674 , Y02P70/611
Abstract: Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large thickness. Therefore, the thickness of the printed circuit board does not become large.
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59.发明公开System and method for providing high voltage withstand capability between pins of a high-density compliant pin connector 有权系统和方法，用于产生连接器的柔性销之间的高电压电阻具有高接触密度
公开(公告)号：EP1174951A2
公开(公告)日：2002-01-23
申请号：EP01116898.6
申请日：2001-07-11
Applicant: Alcatel USA Sourcing, L.P.
Inventor： Skeoch, Steven
IPC: H01R12/04
CPC classification number: H05K1/0254 , H01R12/7082 , H01R13/05 , H05K3/308 , H05K3/3473 , H05K3/429 , H05K2201/09545 , H05K2201/10189 , H05K2201/1059 , H05K2203/0242 , Y10T29/49126
Abstract: A system and method for providing high voltage resistance capability in a receptacle apparatus for accepting a high-density compliant pin connector. A plurality of high-density compliant pin through-holes are formed in a printed circuit board for receiving the pins of the high-density compliant pin connector. The through-holes are plated using an electrically conductive material, whereby conductive pads are formed around the plated through-holes on at least one side of the printed circuit board. Thereafter, the conductive pads around the plated through-holes on the printed circuit board are removed by controlled depth back-drilling so as to increase the inter-pad clearance of the through-holes for withstanding foreign voltages.
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公开(公告)号：EP3381245A1
公开(公告)日：2018-10-03
申请号：EP16810543.5
申请日：2016-11-22
Applicant: Mercury Systems, Inc.
Inventor： MCKENNEY, Darryl J. , METHRATTA, Absu , OUELLETTE, Erica
CPC classification number: H01R12/58 , H01R4/028 , H01R9/091 , H01R12/526 , H01R12/714 , H01R12/716 , H01R13/05 , H01R13/405 , H01R13/652 , H05K1/0213 , H05K1/0237 , H05K1/0298 , H05K1/11 , H05K1/111 , H05K1/115 , H05K1/181 , H05K1/184 , H05K3/308 , H05K3/34 , H05K3/421 , H05K2201/09545 , H05K2201/09827 , H05K2201/10098 , H05K2201/10189 , H05K2201/10295 , H05K2201/1078 , H05K2201/10803 , H05K2201/10878 , H05K2201/10901 , Y02P70/611
Abstract: An RF connector includes a conductive pin for carrying an RF signal. The conductive pin has a first longitudinal end that serves to interface with a male RF connector to receive the RF signal. The pin also includes a second longitudinal end for connecting with a printed circuit board (PCB). The second longitudinal end may be tapered, and the pin may have a groove formed above the tapered end. A housing encircles the conductive pin. The housing is shaped and sized to accept the male RF connector. A grounding element may be positioned on the bottom of the housing. The grounding element is to contact the PCB when the connector is connected to the PCB. The grounding element may be ring-shaped and soldered to the housing or epoxied to the housing.
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