公开(公告)号：JPWO2006006206A1

公开(公告)日：2008-04-24

申请号：JP2006527647

申请日：2004-07-08

Applicant: 富士通株式会社

Inventor： 英一 森 ,  英一 森

IPC: F21V23/00 ,  F21S2/00 ,  H02M7/48

CPC classification number: H05K1/181 ,  H05K1/0231 ,  H05K1/0254 ,  H05K3/3426 ,  H05K2201/1003 ,  H05K2201/10189 ,  H05K2201/10462 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10939 ,  Y02P70/611

Abstract: 高電圧回路を構成するインバータは、冷陰極管に高電圧を供給して発光駆動する。インバータの高電圧発生素子の高電圧出力端子と負荷を接続するコネクタユニットのコネクタ端子とを一体構造としている。即ち、インバータは、基板に実装された高電圧を出力する高電圧発生素子の出力側に基板と略平行で離れた中空位置に一対の高電圧出力端子を延在する。高電圧発生素子の出力側にコンデンサを配置するスペースを介してコネクタユニットが基板に実装され、高電圧出力端子の先端をコネクタケース内のコネクタ端子として一体化する。

公开(公告)号：EP2757613B1

公开(公告)日：2015-11-18

申请号：EP13183848.4

申请日：2013-09-11

Applicant: Samsung SDI Co., Ltd.

Inventor： Yi, Sang-Il ,  Kang, Moon-Gil

IPC: H01M2/20 ,  H01M2/34 ,  H01M10/42 ,  H05K1/00 ,  H05K3/34 ,  H05K3/40 ,  H01M2/10

CPC classification number: H01M2/34 ,  H01M2/105 ,  H01M2/204 ,  H01M10/425 ,  H05K3/3426 ,  H05K3/4015 ,  H05K2201/0394 ,  H05K2201/10037 ,  H05K2201/1031 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10916 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613

公开(公告)号：EP2525399A1

公开(公告)日：2012-11-21

申请号：EP10856616.7

申请日：2010-11-16

Applicant: ZTE Corporation

Inventor： LV, Fei ,  GE, Hu ,  SONG, Jie

IPC: H01L23/31 ,  H01L23/48 ,  H05K3/34

CPC classification number: H05K3/3426 ,  H03H9/1007 ,  H05K3/3494 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10462 ,  Y02P70/613 ,  Y10T29/49124

Abstract: The disclosure discloses a crystal device without an external package, which comprises: a crystal body (21) and two pins (22), wherein the crystal body (21) is a cylindrical body port of a crystal with the external package (15) and redundant pins (12, 13) being removed, and is arranged on a Printed Circuit Board (PCB) horizontally. The two pins (22) are connected to a bottom end of the crystal body (21). Extension parts of the two pins (22) are inclined towards the PCB, and become horizontal when they reach the PCB and are welded to the PCB, and a spacing between the two pins (22) increases gradually. The disclosure also discloses a method for manufacturing a crystal device without a package. The device and method can reduce the cost and make the welding more convenient.

Abstract translation: 本公开公开了一种没有外部封装的晶体器件，其包括：晶体（21）和两个引脚（22），其中晶体（21）是具有外部封装（15）的晶体的圆柱形主体端口，以及 冗余引脚（12,13）被去除，并且被水平布置在印刷电路板（PCB）上。 两个销（22）连接到晶体（21）的底端。 两个销（22）的延伸部分朝着PCB倾斜，并且当它们到达PCB并且被焊接到PCB时变得水平，并且两个销（22）之间的间隔逐渐增加。 本公开还公开了一种用于制造没有封装的晶体器件的方法。 该装置和方法可以降低成本，使焊接更方便。

公开(公告)号：EP2182784A1

公开(公告)日：2010-05-05

申请号：EP09170533.5

申请日：2009-09-17

Applicant: MEDISON CO., LTD.

Inventor： Jin, Gil Ju ,  Park, Jung Lim ,  Kim, Jae Yk

IPC: H05K1/02 ,  B06B1/06 ,  B29C65/48 ,  B29C65/00 ,  B23K1/20

CPC classification number: A61B8/4494 ,  A61B8/00 ,  A61B8/4461 ,  A61B8/4483 ,  B06B1/0622 ,  H05K1/189 ,  H05K3/305 ,  H05K2201/055 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/10083 ,  H05K2201/10462 ,  Y02P70/613

Abstract: Disclosed herein are a PCB and a probe including the same. The probe includes a transducer (110; 710), a PCB (120; 220; 320; 420; 520; 620; 720) having a pattern part (125; 225; 325; 425; 525; 625) contacting the transducer (110; 710) via face-to-face contact, and a bonding member (130) bonding the transducer (110; 710) to the pattern part (125; 225; 325; 425; 525; 625) of the PCB (120; 220; 320; 420; 520; 620; 720). A bonding part of the PCB (120; 220; 320; 420; 520; 620; 720) is provided with the pattern part (125; 225; 325; 425; 525; 625) to increase a bonding area of the bonding part and to allow the bonding member (130) to contact not only a metal layer of the bonding part but also an electrical insulation part thereof, thereby improving a bonding force between the transducer (110; 710) and the PCB (120; 220; 320; 420; 520; 620; 720). As a result, the transducer (110; 710) can be reliably bonded to the PCB (120; 220; 320; 420; 520; 620; 720), so that performance of the transducer can be prevented from being deteriorated due to defective connection between the PCB and the transducer.

Abstract translation: 本文公开了一种PCB和包括该PCB的探针。 所述探头包括换能器（110; 710），具有与所述换能器（110）接触的图案部分（125; 225; 325; 425; 525; 625）的PCB（120; 220; 320; 420; 520; ;将所述换能器（110; 710）连接到所述PCB（120; 220）的图案部分（125; 225; 325; 425; 525; 625）上的接合部件（130） ; 320; 420; 520; 620; 720）。 PCB（120; 220; 320; 420; 520; 620; 720）的接合部分设置有图案部分（125; 225; 325; 425; 525; 625），以增加接合部分的接合面积， 以允许接合部件（130）不仅接触接合部分的金属层，而且接触其电绝缘部分，从而改善换能器（110; 710）和PCB（120; 220; 320; 320）之间的结合力。 420; 520; 620; 720）。 结果，传感器（110; 710）可以可靠地结合到PCB（120; 220; 320; 420; 520; 620; 720），从而可以防止换能器的性能由于连接不良而被劣化 在PCB和传感器之间。

公开(公告)号：EP1996000A3

公开(公告)日：2009-07-22

申请号：EP08155194.7

申请日：2008-04-25

Applicant: Delphi Technologies, Inc.

Inventor： Sailor, Steven L. ,  Hunkeler, Hugh R. ,  Hinze, Lee R.

IPC: H05K3/00

CPC classification number: H05K3/301 ,  H01G2/04 ,  H01G4/38 ,  H05K1/141 ,  H05K3/308 ,  H05K7/12 ,  H05K2201/10015 ,  H05K2201/10303 ,  H05K2201/10325 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

Abstract: A stand-off mounting apparatus (10/50/80) includes an insulative carrier (12/52/82) for off-board mounting of leaded or surface-mount components (18, 20/58-62/92-96), particularly large temperature-sensitive discrete components such as capacitors. The carrier (12/52/82) has a component-mounting surface that is elevated relative to the circuit board (14), and is positioned with respect to the circuit board (14) such that the circuit board area under the mounting surface of the carrier (12/52/82) is available for the placement of smaller non-temperature-sensitive components. The off-board components (18, 20/58-62/92-96) are mounted on the component-mounting surface of the carrier (12/52/82), and the carrier (82) may include support features (102) for providing additional mechanical support for the components (92-96). Electrical leads (16/56/88) for electrically coupling the elevated components (18, 20/58-62/92-96) to the circuit board (14) may be insert-molded in the carrier (12/52), or may be inserted into plated through-holes (110) in the carrier (82).

公开(公告)号：EP1714535A1

公开(公告)日：2006-10-25

申请号：EP04804614.8

申请日：2004-11-30

Applicant: ROBERT BOSCH GMBH

Inventor： MUELLER, Wolfgang ,  UHLAND, Thomas ,  SCHMIDT, Dirk ,  DEGIRMENCI, Ibrahim ,  DISTLER, Frank

IPC: H05K7/20 ,  H05K5/00 ,  B60R16/02

CPC classification number: H05K3/301 ,  H05K1/18 ,  H05K3/0061 ,  H05K5/0056 ,  H05K2201/10015 ,  H05K2201/10303 ,  H05K2201/10462 ,  H05K2201/10606 ,  H05K2201/2045

Abstract: A device (10) for the vibration-proof mounting of electric special components (11, 12) and/or electric circuits, particularly configured as a second assembly level in a control unit, is comprised of a support (13) to which a circuit support (14) having special components (11, 12) fastened thereto is applied at least to a portion of the support surface in an electrically insulated manner, preferably by gluing.

公开(公告)号：EP0983713A1

公开(公告)日：2000-03-08

申请号：EP99915500.5

申请日：1999-03-04

Applicant: Patent-Treuhand-Gesellschaftfür elektrische Glühlampen mbH

Inventor： FRANCK, Felix

IPC: H05K1/18

CPC classification number: H05K1/18 ,  H05K13/04 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10651

Abstract: The invention relates to the spatial arrangement of radially and axially cabled components on a circuit card (4). According to the invention, at least one axially cabled component, e.g. a diode (2), and optionally an axial SMD component, are arranged beneath at least one radially cabled component, e.g. an encased capacitor (1) and directly adjacent to the leads thereof (7, 8). In another embodiment, the body of the axially cabled component (2) is partly surrounded by at least one lead (7) of the radially cabled component (1), thus optimally utilizing the space beneath said component (1).

公开(公告)号：EP0522633A2

公开(公告)日：1993-01-13

申请号：EP92201948.4

申请日：1992-06-30

Applicant: Philips Electronics N.V.

Inventor： Bax, Fransiscus Wilhelmus Maria

IPC: H01R33/09

CPC classification number: H05K3/301 ,  H01R12/58 ,  H01R33/09 ,  H05K2201/10462 ,  H05K2201/10568 ,  H05K2201/10606 ,  H05K2203/167 ,  Y10S362/80

Abstract: The elctric lamp having a cap (10) of synthetic resin is suitable for use on a printed circuit board (6). The cap (10) has resilient arms (15) extending alongside a plane (8) through the axis (2) of the lamp vessel (1). The holder portion (11) of the cap (3) holding the lamp vessel (1), and the arms (3) can clamp a p.c.b. (6) in between them. Means (19, 21) may be present to keep the lamp fixed in an opening (9) in p.c.b. (6) or at an edge thereof. The lamp requires little space on a p.c.b.

Abstract translation: 具有合成树脂的盖（10）的电弧灯适用于印刷电路板（6）。 盖（10）具有通过灯容器（1）的轴线（2）沿平面（8）延伸的弹性臂（15）。 保持灯泡（1）的盖（3）的保持部（11）和臂（3）可以夹住p.c.b。 （6）之间。 可以存在装置（19,21）以将灯固定在p.c.b中的开口（9）中。 （6）或其边缘。 灯泡在p.c.b上几乎没有空间。

公开(公告)号：EP2525399A4

公开(公告)日：2016-11-23

申请号：EP10856616

申请日：2010-11-16

Applicant: ZTE CORP

Inventor： LV FEI ,  GE HU ,  SONG JIE

IPC: H01L23/31 ,  H01L23/48 ,  H03H9/05 ,  H05K3/34

CPC classification number: H05K3/3426 ,  H03H9/1007 ,  H05K3/3494 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10462 ,  Y02P70/613 ,  Y10T29/49124

Abstract: The disclosure discloses a crystal device without an external package, which comprises: a crystal body (21) and two pins (22), wherein the crystal body (21) is a cylindrical body port of a crystal with the external package (15) and redundant pins (12, 13) being removed, and is arranged on a Printed Circuit Board (PCB) horizontally. The two pins (22) are connected to a bottom end of the crystal body (21). Extension parts of the two pins (22) are inclined towards the PCB, and become horizontal when they reach the PCB and are welded to the PCB, and a spacing between the two pins (22) increases gradually. The disclosure also discloses a method for manufacturing a crystal device without a package. The device and method can reduce the cost and make the welding more convenient.

公开(公告)号：EP2866534A4

公开(公告)日：2016-01-20

申请号：EP13807421

申请日：2013-06-21

Applicant: KYOCERA CORP

Inventor： OHASHI YOSHIO ,  SHIKATA KUNIHIDE

IPC: H05K3/38 ,  C04B37/00 ,  C04B37/02 ,  C04B41/50 ,  C04B41/51 ,  C04B41/52 ,  C04B41/53 ,  C04B41/90 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K3/12

CPC classification number: H05K1/181 ,  C04B37/025 ,  C04B2237/10 ,  C04B2237/343 ,  C04B2237/407 ,  C04B2237/55 ,  C04B2237/59 ,  C04B2237/86 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/111 ,  H05K3/388 ,  H05K2201/10462 ,  H05K2201/2063 ,  Y02P70/611 ,  H01L2924/00014

Abstract: [Object] To provide a highly reliable circuit board which can be used for a long period of time and an electronic apparatus including this circuit board and an electronic component mounted thereon. [Solution] The circuit board includes a ceramic sintered body (11) and a metal wiring layer (13) provided on at least one primary surface (11a) thereof with a glass layer (12) interposed therebetween, and when the cross section of the circuit board perpendicular to the primary surface (11a) of the ceramic sintered body (11) is viewed, the ratio of the length of an interface (15) between the glass layer (12) and the metal wiring layer (13) to a length (12a) of the glass layer (12) in a direction along the primary surface (11a) is 1.25 to 1.80. As a result, good heat dissipation characteristics can be obtained, and the metal wiring layer (13) is not likely to be peeled away from the ceramic sintered body (11) due to operation of an electronic component (21) and/or cooling/heating cycles performed by repeated on-off operations thereof, so that a highly reliable circuit board which can be used for a long period of time can be provided.