公开(公告)号：EP1427013A2

公开(公告)日：2004-06-09

申请号：EP04005427.2

申请日：2000-09-20

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Haupt, Detlef ,  Maurer, Thomas

IPC: H01L23/367 ,  H05K1/02

CPC classification number: H01L23/367 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/0969 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10772 ,  H01L2924/00

Abstract: Das Steuergerät (20) ist mit einem elektrischen Bauelement (2) bestückt, in dem Wärme erzeugt wird. Diese wird über ein längliches Metallteil (21) abgeführt wird, dessen eine Stirnfläche (22) mit dem Bauelement (2) verlötet ist. Die dem Bauelement (2) zugewandte Stirnfläche (22) weist eine ihre Oberfläche vergrößernde Gestalt auf. Sie ist nach außen gewölbt ausgebildet und kann mit einer Riffelung versehen sein.

Abstract translation: 控制装置具有电子部件（2），其中产生热量并经由长度长的金属部件（10）取下并具有焊接到部件（2）的一个正面（12）。 面向组件（2）的前表面（12）具有扩大其表面的形状。 更具体地，前表面（12）是向外凹的形状并且是波纹状的。 金属部件（10）是由铜制成的铆钉。

公开(公告)号：EP0817267A1

公开(公告)日：1998-01-07

申请号：EP97112006.8

申请日：1995-03-09

Applicant: The Panda Project

Inventor： Crane, Stanford W., Jr. ,  Portuondo, Maria M.

IPC: H01L23/498

CPC classification number: H01L23/49861 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/308 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/4623 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10893 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor die package (30) includes a plurality of conductive leads (11) and a multi-layer structure (10) for carrying electrical signals, the multi-layer structure (10) including a plurality of layers of insulative material (12a-12d), each of the layers including a first surface and a second surface on an opposing side of the layer.
Each of the leads (11) extends into a corresponding well (15) extending completely through at least one of the layers and bottoming at one of the surfaces of one of the layers through which the well (15) does not extend and is electrically coupled to an electrically conductive bonding structure (13) formed within its corresponding well (15).

公开(公告)号：US09698083B2

公开(公告)日：2017-07-04

申请号：US14727554

申请日：2015-06-01

Applicant: Infineon Technologies AG

Inventor： Alfred Swain Hong Yeo

IPC: H01R9/00 ,  H01L23/495 ,  H01L21/56 ,  H01L25/16 ,  H05K1/18 ,  H05K3/34 ,  H01L23/31

CPC classification number: H01L23/49531 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49555 ,  H01L23/49589 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H05K1/18 ,  H05K3/3426 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10689 ,  H05K2201/10765 ,  H05K2201/10772 ,  H05K2201/10962 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic device comprising a package comprising an encapsulated electronic chip, at least one at least partially exposed electrically conductive carrier lead for mounting the package on and electrically connecting the electronic chip to a carrier, and at least one at least partially exposed electrically conductive connection lead, and an electronic member stacked with the package so as to be mounted on and electrically connected to the package by the at least one connection lead.

公开(公告)号：US20160086730A1

公开(公告)日：2016-03-24

申请号：US14630448

申请日：2015-02-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil PARK ,  Kyoung Jin JUN ,  Dae Hyung YUN ,  Soon Ju LEE

IPC: H01G2/06 ,  H01G4/12 ,  H01G4/012 ,  H01G4/30 ,  H01G4/248

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/232 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/10818 ,  H05K2201/10946 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: A multilayer ceramic electronic component and a board having the same are provided. The multilayer ceramic electronic component includes a multilayer ceramic capacitor including external electrodes including front portions and band portions extended from the front portions, terminal electrodes respectively surrounding the front portions and portions of lower surfaces of the band portions of the external electrodes and respectively having a ‘’ shaped groove portion formed in lower portions thereof, and conductive adhesive layers connecting the external electrodes and the terminal electrodes to each other.

Abstract translation: 提供了多层陶瓷电子部件和具有该多层陶瓷电子部件的基板。 多层陶瓷电子部件包括多层陶瓷电容器，其包括外部电极，其包括前部和从前部延伸的带部分，端子电极分别围绕外部电极的带部分的前部和下表面的一部分，并且分别具有“ 形成在其下部的槽形部分，以及将外部电极和端子电极彼此连接的导电粘合剂层。

公开(公告)号：US20100139970A1

公开(公告)日：2010-06-10

申请号：US12633443

申请日：2009-12-08

Applicant: Kazuhiro Oshima ,  Yoshikazu Hirabayashi ,  Shigeo Nakajima ,  Yoshitaka Matsushita

Inventor： Kazuhiro Oshima ,  Yoshikazu Hirabayashi ,  Shigeo Nakajima ,  Yoshitaka Matsushita

IPC: H01R12/04 ,  H01B5/00

CPC classification number: H01L23/49811 ,  H01L2924/0002 ,  H01L2924/15312 ,  H05K3/3426 ,  H05K2201/10318 ,  H05K2201/10772 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/613 ,  H01L2924/00

Abstract: A wiring board having a lead pin is provided. The wiring board having the lead pin includes a connecting pad which is formed on the wiring board, and to which the lead pin is bonded through a conductive material. The lead pin includes: a shaft portion; a head portion which is provided on one end of the shaft portion; a protruded portion which is formed on a surface side of the head portion opposed to the connection pad; and a first taper portion which is formed between the head portion and a base part of the shaft portion.

Abstract translation: 提供具有引脚的布线板。 具有引线销的布线板包括形成在布线板上的连接焊盘，引导销通过导电材料接合到该连接焊盘。 引导销包括：轴部; 头部，其设置在所述轴部的一端; 形成在所述头部的与所述连接垫相对的表面侧的突出部; 以及形成在所述头部与所述轴部的基部之间的第一锥形部。

公开(公告)号：US07393217B2

公开(公告)日：2008-07-01

申请号：US11006067

申请日：2004-12-07

Applicant: Kai-Hung Huang ,  Chin-Chi Kuo ,  Tscn-En Li

Inventor： Kai-Hung Huang ,  Chin-Chi Kuo ,  Tscn-En Li

IPC: H01R12/00

CPC classification number: H05K3/368 ,  H01R12/52 ,  H05K3/3426 ,  H05K3/3447 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613

Abstract: A circuit board assembly includes a first circuit board, at least one surface mount connector, and a second circuit board. The first circuit board has at least a first contact. The surface mount connector is substantially a solid rod and includes a first conducting part coupled to the contact of the first circuit board and a second conducting part having a curvy raised portion at the top surface thereof. The second circuit board has at least a second contact coupled to the second conducting part of the surface mount connector.

Abstract translation: 电路板组件包括第一电路板，至少一个表面安装连接器和第二电路板。 第一电路板至少具有第一接触。 表面安装连接器基本上是实心杆，并且包括耦合到第一电路板的触点的第一导电部分和在其顶表面处具有弯曲的凸起部分的第二导电部分。 第二电路板具有耦合到表面安装连接器的第二导电部分的至少第二触点。

公开(公告)号：US20070054548A1

公开(公告)日：2007-03-08

申请号：US11504176

申请日：2006-08-15

Applicant: Hiroshi Nakano

Inventor： Hiroshi Nakano

IPC: H01R13/60

CPC classification number: H05K3/341 ,  H01R12/707 ,  H05K2201/10189 ,  H05K2201/10772 ,  H05K2201/1084 ,  H05K2201/10969 ,  Y02P70/613

Abstract: A circuit board connector (1) has a housing (10), male terminals (20) and fixing members (30). Each fixing member (30) is formed by bending a metal plate into an L-shape to define a mounting portion (31) to mount the fixing member (30) to the housing (10), and a bonding portion (32) to be soldered. The bonding portion (32) is formed with connecting pieces (33) by making U-shaped cuts through the bonding portion (32) and then bending areas enclosed by the cuts upward. A clearance (S) is defined between the bottom edge of the leading end of each connecting piece (33) and the corresponding through hole (34). The lower surfaces of the connecting pieces (33) and the inner surfaces of the through holes (34) can be soldered.

Abstract translation: 电路板连接器（1）具有壳体（10），阳端子（20）和固定构件（30）。 每个固定构件（30）通过将金属板弯曲成L形而形成以将固定构件（30）安装到壳体（10）的安装部分（31）和形成为 焊接。 通过在接合部分（32）上形成U形切口，然后由向上切割的弯曲区域形成接合部分（32）。 在每个连接件（33）的前端的底部边缘和相应的通孔（34）之间限定有间隙（S）。 连接片（33）的下表面和通孔（34）的内表面可被焊接。

公开(公告)号：US06966482B2

公开(公告)日：2005-11-22

申请号：US10340798

申请日：2003-01-13

Applicant: Makoto Totani ,  Toshihiro Miyake ,  Tomohiro Yokochi ,  Takehito Teramae ,  Yoshitaro Yazaki ,  Kazuyuki Deguchi ,  Hajime Nakagawa

Inventor： Makoto Totani ,  Toshihiro Miyake ,  Tomohiro Yokochi ,  Takehito Teramae ,  Yoshitaro Yazaki ,  Kazuyuki Deguchi ,  Hajime Nakagawa

IPC: H01R12/62 ,  H05K3/34 ,  H05K3/36 ,  H05K1/03 ,  B23K31/02 ,  H01L23/48

CPC classification number: H05K3/363 ,  H05K3/3452 ,  H05K3/3494 ,  H05K2201/0129 ,  H05K2201/091 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10772 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/065

Abstract: Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.

Abstract translation: 形成在柔性印刷电路板上的焊盘通过焊料与刚性印刷电路板上形成的焊盘电连接。 此时，在刚性印刷电路板上的相邻的两个焊盘之间形成阻焊剂，并且端接有刚性印刷电路板和柔性印刷电路板之间的端部。 因此，即使剩余焊料被挤出到刚性印刷电路板上，阻焊剂也可以防止在焊盘之间形成焊料桥。

公开(公告)号：US06417997B1

公开(公告)日：2002-07-09

申请号：US09865814

申请日：2001-05-25

Applicant: Stephen P. Williams

Inventor： Stephen P. Williams

IPC: G11B548

CPC classification number: G11B5/4846 ,  G11B5/4853 ,  H05K3/363 ,  H05K3/4007 ,  H05K2201/091 ,  H05K2201/10772 ,  H05K2201/2036 ,  Y10T29/49144

Abstract: Mechanically formed standoffs in a disk drive integrated circuit interconnect reduces the cost of manufacturing and improves the reliability of the electrical interconnections thereof. Connection pads defined along the interconnect are bonded with bonding pads of a signal producing source and a signal processing source. The standoffs provide mechanical stops during the bonding process, enabling sufficient bonding material to form between bonding areas. The standoffs are mechanically formed with a punch and die assembly either directly through a bonding pad predefined along traces on the interconnect or adjacent the bonding pad. The standoffs formed through the bonding pads are covered with solder or other electrically conductive bonding material.

Abstract translation: 在磁盘驱动器集成电路互连中机械地形成的支座降低了制造成本并提高了其电互连的可靠性。 沿着互连件限定的连接焊盘与信号产生源和信号处理源的焊盘接合。 在接合过程中，间隙提供机械停止，使得能够在接合区域之间形成足够的接合材料。 该支座通过冲头和模具组件机械地形成，该冲头和模具组件可以直接通过沿着互连线上的迹线预定的接合焊盘，或者与焊盘相邻。 通过焊盘形成的支座被焊料或其它导电粘合材料覆盖。

公开(公告)号：US20020014518A1

公开(公告)日：2002-02-07

申请号：US09907599

申请日：2001-07-19

Inventor： Makoto Totani ,  Toshihiro Miyake ,  Tomohiro Yokochi ,  Takehito Teramae ,  Yoshitaro Yazaki ,  Kazuyuki Deguchi ,  Hajime Nakagawa

IPC: B23K031/02

CPC classification number: H05K3/363 ,  H05K3/3452 ,  H05K3/3494 ,  H05K2201/0129 ,  H05K2201/091 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10772 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/065

Abstract: Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.

Abstract translation: 形成在柔性印刷电路板上的焊盘通过焊料与刚性印刷电路板上形成的焊盘电连接。 此时，在刚性印刷电路板上的相邻的两个焊盘之间形成阻焊剂，并且端接有刚性印刷电路板和柔性印刷电路板之间的端部。 因此，即使剩余焊料被挤出到刚性印刷电路板上，阻焊剂也可以防止在焊盘之间形成焊料桥。