公开(公告)号：US5531020A

公开(公告)日：1996-07-02

申请号：US112225

申请日：1993-08-27

Applicant: David Durand ,  Roger A. Iannetta, Jr.

Inventor： David Durand ,  Roger A. Iannetta, Jr.

IPC: C09J163/00 ,  H01B1/22 ,  H01L21/48 ,  H01L21/60 ,  H01R4/04 ,  H05K1/09 ,  H05K1/18 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12 ,  H05K3/28 ,  H05K3/32 ,  H05K3/34

CPC classification number: H01L24/83 ,  C09J163/00 ,  H01B1/22 ,  H01L21/4867 ,  H01L24/29 ,  H01L24/81 ,  H01R4/04 ,  H05K3/1258 ,  H05K3/321 ,  H01L2224/13111 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/3025 ,  H05K1/095 ,  H05K1/181 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1105 ,  H05K2203/1453 ,  H05K3/0023 ,  H05K3/107 ,  H05K3/28 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: A method of making a planar, subsurface electronic circuit having at least one electronic circuit component assembled therewith is disclosed. First, three dimensional, essentially square channels interspersed with lands are formed within a dielectric material on a substrate. The channels are then filled in one pass with a curable polymeric material containing a conductive metal filler so that the upper surfaces of the circuit trace formed by this conductive material are at essentially the same level as the upper surface of the lands. Circuit components are place to engage the conductive material. The curable material is then cured after placing the electronic component(s).

Abstract translation: 公开了一种制造具有组装的至少一个电子电路部件的平面的地下电子电路的方法。 首先，在衬底上的电介质材料内形成散布有焊盘的三维，基本上为方形的通道。 然后将通道用含有导电金属填料的可固化聚合物材料一次填充，使得由该导电材料形成的电路迹线的上表面基本上与焊盘的上表面相同。 电路元件是与导电材料接合的地方。 然后在放置电子部件之后固化可固化材料。

公开(公告)号：US5527591A

公开(公告)日：1996-06-18

申请号：US349042

申请日：1994-12-02

Applicant: David R. Crotzer ,  Gregory E. Dean

Inventor： David R. Crotzer ,  Gregory E. Dean

IPC: H01H1/06 ,  H01H1/60 ,  H05K3/10 ,  H05K3/32 ,  H05K3/40 ,  B32B9/00

CPC classification number: H01H1/06 ,  H05K3/102 ,  H05K3/4007 ,  H01H1/60 ,  H05K2201/0133 ,  H05K2201/023 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/095 ,  H05K2203/1168 ,  H05K2203/1344 ,  H05K3/326 ,  Y10S439/931 ,  Y10T428/24917

Abstract: The present invention comprises an electrical contact having solid homogenous conductive particles on the contact surface. The particles are of greater hardness than that of the contact material to deform the contact material and cause breakage or fracture of the oxide or other contaminating layer, or to penetrate the contaminating layer. The particles are applied to the contact surface by a technique which results in the particles being intimately bonded to the contact surface, usually as a layer of particles. A preferable technique for such particle application is hypervelocity oxygen fuel spraying (HVOF) or plasma spraying, by which the particles are embedded on the contact surfaces to provide a substantially permanent interparticle bond between the applied particles and the contact material.

Abstract translation: 本发明包括在接触表面上具有固体均匀导电颗粒的电接触。 这些颗粒的硬度比接触材料的硬度大，使接触材料变形并导致氧化物或其它污染层的断裂或断裂，或者穿透污染层。 颗粒通过导致颗粒紧密结合到接触表面的技术施加到接触表面，通常作为一层颗粒。 用于这种颗粒应用的优选技术是超高速氧燃料喷射（HVOF）或等离子体喷涂，通过该喷涂，颗粒嵌入在接触表面上，以在施加的颗粒和接触材料之间提供基本上永久的颗粒间粘结。

公开(公告)号：US5445308A

公开(公告)日：1995-08-29

申请号：US263623

申请日：1994-06-22

Applicant: Richard D. Nelson ,  Thomas P. Dolbear ,  Robert W. Froehlich

Inventor： Richard D. Nelson ,  Thomas P. Dolbear ,  Robert W. Froehlich

IPC: C09J9/02 ,  H01B1/22 ,  H01R4/04 ,  H05K3/32 ,  B23K35/26

CPC classification number: C09J9/02 ,  H01B1/22 ,  H01L24/29 ,  H01L24/32 ,  H01R4/04 ,  H05K3/323 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29305 ,  H01L2224/29311 ,  H01L2224/83101 ,  H01L2224/83951 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2201/0209 ,  H05K2201/023 ,  H05K2201/10719 ,  H05K2203/0425

Abstract: A method of providing a thermally conductive connection between spaced surfaces includes (a) mixing a thermally conductive filler containing a liquid metal into an unhardened matrix material, and (b) contacting the unhardened matrix material and randomly dispersed, separate spaced non-solidified regions of filler within the unhardened matrix material to the surfaces. A solid mechanical bond may be provided by hardening the matrix material or by providing a separate adhesive between the surfaces. Preferably, the regions of filler form separate spaced continuous thermally and electrically conductive paths between the surfaces.

Abstract translation: 在间隔表面之间提供导热连接的方法包括（a）将含有液态金属的导热填料混合到未硬化的基体材料中，和（b）使未硬化的基体材料和随机分散的分开的非固化区域 未固化的基体材料中的填料到表面。 可以通过硬化基质材料或通过在表面之间提供单独的粘合剂来提供固体机械结合。 优选地，填料区域在表面之间形成分开的连续的热和导电路径。

公开(公告)号：US5340640A

公开(公告)日：1994-08-23

申请号：US036309

申请日：1993-03-24

Applicant: Alfred Bientz

Inventor： Alfred Bientz

IPC: H05K1/09 ,  H05K1/18 ,  H05K3/32 ,  B32B3/00

CPC classification number: H05K1/095 ,  H05K3/323 ,  H01L2224/29499 ,  H05K1/181 ,  H05K2201/023 ,  H05K2201/0326 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10S428/901 ,  Y10T428/24893 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/25

Abstract: A printed circuit module, particularly for electronic applications and equipment, comprising a rigid or flexible circuit carrier substrate (1), conductive traces (2) printed on the substrate, and electronic components (5) for electrical connection thereto. The conductive traces comprise a printed ink layer having fine conductive particles embedded therein. The ink is rendered conductive by a touch-contact distribution of the particles in the printed ink layer. The conductive particles comprise electrically conductive crystallites (8) composed of a non-oxidizable crystalline compound of an element of sub-group IV of the Periodic Table, along with nitrogen or carbon. The electronic components (5) are electrically connected to the conductive traces (2) with an anisotropic adhesive (7). The adhesive may also contain the crystallites to effect an electrical connection between the conductive traces (2 ) and the contact areas (6 ) of electronic components (5 ) .

Abstract translation: 一种特别用于电子应用和设备的印刷电路模块，包括刚性或柔性的电路载体衬底（1），印刷在衬底上的导电迹线（2）和用于与其电连接的电子部件（5）。 导电迹线包括其中嵌入有细导电颗粒的印刷油墨层。 通过印刷油墨层中的颗粒的触摸接触分布使油墨变得导电。 导电颗粒包括由元素周期表第IV族元素的不可氧化结晶化合物与氮或碳组成的导电微晶（8）。 电子部件（5）用各向异性粘合剂（7）电连接到导电迹线（2）。 粘合剂还可以包含微晶，以实现导电迹线（2）和电子部件（5）的接触区域（6）之间的电连接。

公开(公告)号：US5240761A

公开(公告)日：1993-08-31

申请号：US237546

申请日：1988-08-29

Applicant: Clyde D. Calhoun ,  Maurice J. Fleming

Inventor： Clyde D. Calhoun ,  Maurice J. Fleming

IPC: C09J7/00 ,  C09J7/02 ,  H05K3/32

CPC classification number: C09J7/00 ,  C09J7/0203 ,  C09J7/0207 ,  H05K3/323 ,  C09J2201/32 ,  C09J2201/602 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/09945 ,  Y10T428/24413 ,  Y10T428/24545 ,  Y10T428/256 ,  Y10T428/258 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

Abstract: Electrically conductive elements on two substrates can be electrically interconnected by an adhesive tape containing electrically conductive particles, most of which are substantially uniformly spaced from their six nearest neighbors. Preferably the particles are spherical and of substantially equal diameter slightly exceeding the thickness of the adhesive layer. The adhesive tape can be made by forming a dense monolayer of the particles, covering a stretchable adhesive layer with that dense monolayer, biaxially stretching the adhesive layer to separate each particle from other particles of the monolayer, and then embedding the particles either into that adhesive layer or into the adhesive layer of another tape.

Abstract translation: 两个基板上的导电元件可以通过含有导电颗粒的粘合带电互连，其中大部分与其六个最近的邻近部分基本均匀地间隔开。 优选地，颗粒是球形的并且具有基本相等的直径略微超过粘合剂层的厚度。 胶带可以通过形成致密的单层颗粒，用该致密单层覆盖可拉伸的粘合剂层，双轴拉伸粘合剂层以将每个颗粒与单层的其它颗粒分离，然后将颗粒包埋在该粘合剂中 层或另一条胶带的粘合剂层。

公开(公告)号：US5180523A

公开(公告)日：1993-01-19

申请号：US436199

申请日：1989-11-14

Applicant: David Durand ,  David P. Vieau ,  Ang-Ling Chu ,  Tai S. Weiu

Inventor： David Durand ,  David P. Vieau ,  Ang-Ling Chu ,  Tai S. Weiu

IPC: C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32

CPC classification number: H05K3/321 ,  C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/181 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1105 ,  H05K2203/1453 ,  H05K3/0023 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25

Abstract: An electrically conductive cement having substantially stable conductivity and resistance characteristics under high humidity conditions comprises a mixture of two epoxy resins with the proportion of each epoxy resin adjusted to provide a volumetric shrinkage in the mixture in the 4 to 16% and a conductive silver particular filler including agglomerates having size and surface characteristics that maintain stable electrical contact with an electrical component lead. The epoxy mixture is preferably a combination of a high-shrinkage epoxy resin and a lower-shrinkage epoxy resin in the appropriate amounts of each so as to produce the desired volumetric shrinkage characteristic. The conductive particle filler is preferably an admixture of silver flakes, silver powder, and an effective amount of silver agglomerates. The agglomerates are irregularly shaped particles having multiple surface indentations and recesses to produce many rough-edged salients or ridges and having a particle length, width, and thickness aspect ratio of about 1:1:1. An effective amount of such agglomerates appears to effect penetration of surface oxides when establishing the cemented connection as a result of the volumetric shrinkage of the polymeric carrier upon curing.

Abstract translation: 在高湿度条件下具有基本上稳定的导电性和电阻特性的导电水泥包括两种环氧树脂的混合物，其中每种环氧树脂的比例被调节以提供4至16％的混合物的体积收缩率和导电的银特殊填料 包括具有与电气部件引线保持稳定的电接触的尺寸和表面特性的附聚物。 环氧混合物优选为高收缩率环氧树脂和较低收缩率的环氧树脂的组合，以适当的量，以产生所需的体积收缩特性。 导电颗粒填料优选为银薄片，银粉和有效量的银附聚物的混合物。 附聚物是具有多个表面凹陷和凹陷的不规则形状的颗粒，以产生许多粗边缘的凸起，并且具有约1:1:1的颗粒长度，宽度和厚度纵横比。 当固化时聚合物载体的体积收缩结果确定粘合连接时，有效量的这种附聚物似乎会影响表面氧化物的渗透。

公开(公告)号：US4832455A

公开(公告)日：1989-05-23

申请号：US94383

申请日：1987-09-04

Applicant: Shozo Takeno ,  Masayuki Kakegawa ,  Yoshimasa Adachi

Inventor： Shozo Takeno ,  Masayuki Kakegawa ,  Yoshimasa Adachi

IPC: G02F1/13 ,  H05K1/00 ,  H05K1/11 ,  H05K3/32 ,  H05K3/36

CPC classification number: G02F1/13452 ,  H05K3/323 ,  H05K3/361 ,  H05K1/0393 ,  H05K1/117 ,  H05K2201/023 ,  H05K2201/0266 ,  H05K2201/094 ,  H05K2201/09663

Abstract: A liquid crystal apparatus in which an anisotropic conductive layer made of organic resin containing several electrically conductive particles having substantially identical particle sizes is disposed between lead electrodes of a liquid crystal device and the lead electrodes of a drive circuit board, thermocompression bonding being applied to make the electrically conductive particles in direct contact with both lead electrodes to allow both lead electrodes to be electrically connected with each other. Further, at least one of the lead electrodes of a common electrode in the liquid crystal device and of the circuit board corresponding to the common electrode includes a number of separated electrodes that are spaced apart, and the pitches and widths of the separated electrodes are in the range of .+-.30% around the average values for pitch and width for the separated electrodes.

Abstract translation: 在液晶装置的引线电极与驱动电路基板的引线电极之间配置有由含有数个具有大致相同粒径的导电性粒子的有机树脂构成的各向异性导电层的液晶装置， 导电颗粒与两个引线电极直接接触，以允许两个引线电极彼此电连接。 此外，液晶装置中的公共电极的引线电极和对应于公共电极的电路板中的至少一个引线电极包括间隔开的多个分离的电极，并且分离的电极的间距和宽度在 围绕分离电极的间距和宽度的平均值的+/- 30％的范围。

公开(公告)号：US4676854A

公开(公告)日：1987-06-30

申请号：US808141

申请日：1985-12-12

Applicant: Tameyuki Suzuki ,  Takuro Kamakura

Inventor： Tameyuki Suzuki ,  Takuro Kamakura

IPC: H01R4/04 ,  H05K3/24 ,  H05K3/32 ,  H05K3/36 ,  C25D15/00 ,  B32B31/12

CPC classification number: H05K3/361 ,  H01R4/04 ,  H05K2201/023 ,  H05K2203/135 ,  H05K3/245 ,  H05K3/321

Abstract: A method for selectively bonding a substrate having an electroconductive pattern to another substrate at selected portions of the pattern. An adhesive layer is formed on the selected portion of the pattern by the electrodeposition of a high molecular resin and the substrate is then bonded to the other substrate by means of the adhesive layer.

Abstract translation: 一种用于在图案的选定部分将具有导电图案的基板选择性地结合到另一基底的方法。 通过高分子树脂的电沉积在图案的选定部分上形成粘合剂层，然后通过粘合剂层将基片粘合到另一个基底上。

公开(公告)号：JPWO2010093035A1

公开(公告)日：2012-08-16

申请号：JP2010550566

申请日：2010-02-15

Applicant: 株式会社村田製作所

Inventor： 尾上　智章 ,  智章 尾上 ,  正明 平山 ,  正明 平山 ,  義樹 油谷 ,  義樹 油谷

IPC: C08L101/00 ,  C08K3/04 ,  H01B1/00 ,  H01B1/24

CPC classification number: H05K3/321 ,  H01R4/00 ,  H01R4/04 ,  H01R4/58 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0323 ,  Y10T428/25

Abstract: 高い導通信頼性を確保することが可能な、導電性樹脂組成物、それを用いた接合信頼性の高い電子部品の製造方法、接合対象間を確実に接合することが可能な接合方法および接合構造、該接合構造を備えた信頼性の高い電子部品を提供する。(a)硬化性樹脂と、(b)球形カーボン本体の表面がカーボン微粒子によりコートされた硬質球形カーボン、および/または、球形カーボン本体の表面がピッチに由来するカーボン細片により被覆された硬質球形カーボンとを含有する導電性樹脂組成物を用いる。互いに電気的に接続させるべき部位を備えた少なくとも2つのワークの、部位間に、前記導電性樹脂組成物を供給し、前記部位間に圧力を加えつつ、導電性樹脂組成物を硬化させる。

公开(公告)号：JP2010287834A

公开(公告)日：2010-12-24

申请号：JP2009142258

申请日：2009-06-15

Applicant: Sumitomo Electric Ind Ltd ,  住友電気工業株式会社

Inventor： YAMAMOTO MASAMICHI ,  NAKATSUGI KYOICHIRO ,  OKUDA YASUHIRO

IPC: H01L21/60 ,  H05K3/28 ,  H05K3/32 ,  H05K3/34

CPC classification number: H05K3/323 ,  C09J9/02 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H05K3/282 ,  H05K3/361 ,  H05K2201/023 ,  H05K2201/0379 ,  Y10T156/10 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To form an inexpensive and highly reliable connection structure capable of simplifying a manufacturing process by connecting a connecting electrode having organic films as an oxidation preventing film using a conductive adhesive. SOLUTION: This electrode connection method for connecting a first connecting electrode 2 to a second connecting electrode 10 through the conductive adhesive 9 interposed between these electrodes includes an organic film forming process to provide an organic film 6 on the surface of at least the first connecting electrode, and an electrode connecting process to connect the first connecting electrode to the second connecting electrode through the conductive adhesive. In the electrode connecting process, an organic film decomposing component blended in the conductive adhesive is made to act on the organic film, and the organic film is decomposed to perform connection between these connecting electrodes. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：通过使用导电粘合剂将具有有机膜的连接电极作为氧化防止膜进行连接，形成能够简化制造工艺的便宜且高度可靠的连接结构。 解决方案：用于通过介于这些电极之间的导电粘合剂9将第一连接电极2连接到第二连接电极10的电极连接方法包括有机膜形成工艺，以在至少 第一连接电极和通过导电粘合剂将第一连接电极连接到第二连接电极的电极连接工艺。 在电极连接工序中，使配合在导电性粘合剂中的有机膜分解成分作用于有机膜，有机膜分解，从而在这些连接电极之间进行连接。 版权所有（C）2011，JPO＆INPIT