公开(公告)号：EP0361192A3

公开(公告)日：1990-06-06

申请号：EP89116801.5

申请日：1989-09-11

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Mattelin, Antoon

IPC: H05K3/02 ,  H05K3/42

CPC classification number: B44C1/22 ,  B29L2031/3493 ,  C23F1/02 ,  H05K3/0032 ,  H05K3/027 ,  H05K3/061 ,  H05K3/062 ,  H05K3/07 ,  H05K2201/0305 ,  H05K2201/09118 ,  H05K2201/09363 ,  H05K2203/0361 ,  H05K2203/072 ,  H05K2203/135 ,  H05K2203/1476 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Auf ein Substrat (1) werden nacheinander eine Metallschicht (4) und eine erste Ätzresistschicht aufgebracht, worauf diese erste Ätzresistschicht mittels elektromagnetischer Strahlung, vorzugsweise mittels Laserstrahlung, in den unmittelbar an das spätere Leiterbahnmuster angrenzenden Bereichen entfernt und die dadurch freigelegte Metallschicht (4) weggeätzt wird. Danach wird eine zweite metallische Atzresistschicht (7) aufgebracht, worauf die nicht dem Leiterbahnmuster entsprechenden und damit unerwünschten Bereiche (6) anodisch kontaktiert werden und hier dann die zweite Ätzresistschicht (7) elektrolytisch abgetragen wird. Zur Fertigstellung der Leiterplatte brauchen dann nur noch die unerwünschten Bereiche der Metallschicht (4) abgeätzt werden. Die Strukturierung mittels elektromagnetischer Strahlung kann rasch vorgenommen werden, da die größeren Flächen zwischen den Leiterbahnen zunächst noch stehen bleiben und erst danach durch das anodische Strippen und nachfolgende Ätzen mit geringem Aufwand entfernt werden.

Abstract translation: 制造印刷电路板的方法具有双重蚀刻工艺以形成互连布线。 在基板上形成金属层。 将抗蚀剂层施加到金属层。 选择性地去除该层以允许金属层的选择性蚀刻。 将第二蚀刻抗蚀剂层施加到未被蚀刻的金属层上。 金属层的侧壁也被抗蚀剂保护。 然后选择性地去除第二蚀刻抗蚀剂层以允许金属层的第二蚀刻。 在第二蚀刻之后，互连布线保持在所需的图案中。 可以将第二蚀刻抗蚀剂层（可以是锡）留在布线上以改进元件焊接。

公开(公告)号：US20170156211A1

公开(公告)日：2017-06-01

申请号：US14954243

申请日：2015-11-30

Applicant: Cree Fayetteville, Inc.

Inventor： Jennifer Stabach ,  Brice McPherson ,  Chad B. O'Neal

IPC: H05K1/18 ,  H05K3/34 ,  B23K31/02 ,  B23K1/00 ,  B23K1/20

CPC classification number: B23K1/20 ,  B23K1/0016 ,  B23K26/362 ,  H01L23/13 ,  H01L23/3735 ,  H01L23/49894 ,  H01L2224/32225 ,  H05K1/0263 ,  H05K3/027 ,  H05K3/243 ,  H05K3/341 ,  H05K2201/09363 ,  H05K2203/0315 ,  H05K2203/1173

Abstract: A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.

公开(公告)号：US20160336654A1

公开(公告)日：2016-11-17

申请号：US15112998

申请日：2015-01-21

Applicant: DENSO CORPORATION

Inventor： Kazuhiro AOKI ,  Shinichiro MATSUZAWA

IPC: H01Q5/55 ,  H01Q9/04 ,  H05K1/11 ,  H01Q1/48 ,  H01P3/16 ,  H01P5/08

CPC classification number: H01Q5/55 ,  H01P3/121 ,  H01P3/16 ,  H01P5/087 ,  H01P5/107 ,  H01Q1/48 ,  H01Q9/0407 ,  H01Q9/045 ,  H01Q21/0093 ,  H05K1/0218 ,  H05K1/0239 ,  H05K1/115 ,  H05K2201/09363 ,  H05K2201/09618

Abstract: A collective lamination substrate N is provided with pattern layers having N number of layers, where N is an integer and 4 or more, a pseudo waveguide formed penetrating through the pattern layers in a lamination direction, a converter section formed in the pattern layers, mutually converting between an electrical signal and radio waves being transmitted and received via the pseudo waveguide, and ground patterns formed in the pattern layers, covering a periphery of a waveguide formation section. The collective lamination substrate further includes: antennas formed in the waveguide formation section; a first via group provided in a periphery of the waveguide formation section; and a second via group provided in a periphery of the waveguide formation section and positioned at a more outer portion than the first via group.

Abstract translation: 集体层叠基板N设置有N层数的图案层，其中N为整数且为4以上，形成在层叠方向上贯穿图案层的伪波导管，形成在图案层中的转换器部分相互 在电信号和经由伪波导发送和接收的无线电波之间进行转换，以及形成在图案层中的覆盖波导形成部分的周边的接地图案。 集体层叠基板还包括：形成在波导形成部中的天线; 设置在波导形成部的周围的第一通孔组; 以及第二通孔组，设置在波导形成部的周边并位于比第一通孔组更外侧的部分。

公开(公告)号：US20160334279A1

公开(公告)日：2016-11-17

申请号：US14714005

申请日：2015-05-15

Applicant: Google Inc.

Inventor： Adam Mittleman ,  Ian Charles Smith ,  Daniel Adam Warren ,  William Raeming Dong ,  Jeff Wheeler

IPC: G01J5/06 ,  G01J5/00 ,  G01J5/10 ,  H05K1/02

CPC classification number: G01J5/06 ,  G01J5/0014 ,  G01J5/0205 ,  G01J5/04 ,  G01J5/10 ,  G08B13/189 ,  G08B13/191 ,  H05K1/0201 ,  H05K1/0298 ,  H05K2201/09063 ,  H05K2201/093 ,  H05K2201/09363 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10522 ,  H05K2201/10575 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A multilayered circuit board having a metal-free region vertically extending through at least a portion of a conductive layer, which lies generally parallel to a horizontal plane, vertically spaced from an outer surface. Heat-emitting and heat-sensitive components are mounted on the outer surface. The heat-emitting component is vertically and laterally spaced from the metal-free region, whereas the heat-sensitive component is vertically spaced and laterally aligned within the metal-free region such that the metal-free region is a thermal barrier that shields heat-sensitive component from radial heat flowing from the heat-emitting component.

Abstract translation: 一种多层电路板，其具有垂直延伸穿过导电层的至少一部分的无金属区域，该导电层大致平行于与外表面垂直间隔的水平平面。 发热和热敏元件安装在外表面上。 发热部件与无金属区域垂直和横向间隔开，而热敏部件在无金属区域内垂直间隔开并横向对准，使得无金属区域是屏蔽热 - 来自发热部件的径向热的敏感部件。

公开(公告)号：US09313879B2

公开(公告)日：2016-04-12

申请号：US14056611

申请日：2013-10-17

Applicant: Wistron Corp.

Inventor： Lung-Fai Tuen ,  Wen-Hsien Wang ,  Chiu-Hsien Chang

IPC: H02H9/04 ,  H05K1/02

CPC classification number: H05K1/0259 ,  H02H9/045 ,  H05K2201/09354 ,  H05K2201/09363

Abstract: A motherboard with an electrostatic discharge protection (ESD) function including a first electrode, a second electrode, an isolation region and an energy storage unit is disclosed. The first electrode receives a grounding level. The second electrode includes at least one solder pad to fix an input/output port thereon. The isolation region is disposed between the first and the second electrodes. The energy storage unit is coupled between the first and the second electrodes and disposed across the isolation region.

Abstract translation: 公开了一种具有包括第一电极，第二电极，隔离区域和能量存储单元的静电放电保护（ESD）功能的主板。 第一个电极接收接地电平。 第二电极包括至少一个用于固定其上的输入/输出端口的焊盘。 隔离区设置在第一和第二电极之间。 能量存储单元耦合在第一和第二电极之间并且跨越隔离区域设置。

公开(公告)号：US20160087169A1

公开(公告)日：2016-03-24

申请号：US14956804

申请日：2015-12-02

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Tadaaki MIYATA ,  Naoki MORI

IPC: H01L33/54 ,  H01L27/15 ,  H01L33/50 ,  H01L33/62 ,  H01L33/56 ,  H01L33/32 ,  H01L33/60

CPC classification number: H01L33/56 ,  F21S4/22 ,  F21Y2101/00 ,  F21Y2103/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/32 ,  H01L33/483 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/09363 ,  H05K2201/10106

Abstract: A light emitting device includes a substrate, a light emitting device and a sealing resin member. The substrate includes a flexible base, a plurality of wiring portions, a groove portion and a pair of terminal portions. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate and the plurality of wiring portions are arranged on the flexible base. The groove portion is formed between the plurality of wiring portions spaced apart from each other. The pair of terminal portions is arranged along the first direction at the both sides of the plurality of wiring portions. The light emitting element is disposed on the substrate and electrically connected to the plurality of wiring portions. The sealing resin member seals the light emitting element and a part of the substrate. The light emitting element is mounted on the substrate in a flip-chip manner.

Abstract translation: 发光器件包括衬底，发光器件和密封树脂构件。 基板包括柔性基座，多个布线部分，槽部分和一对端子部分。 柔性基部沿着与基板的纵向相对应的第一方向延伸，并且多个布线部布置在柔性基部上。 槽部形成在彼此间隔开的多个配线部之间。 一对端子部分沿着第一方向布置在多个布线部分的两侧。 发光元件设置在基板上并电连接到多个布线部分。 密封树脂构件密封发光元件和基板的一部分。 发光元件以倒装芯片方式安装在基板上。

公开(公告)号：US08338716B2

公开(公告)日：2012-12-25

申请号：US12741105

申请日：2008-11-04

Applicant: Youichiro Nakahara ,  Naoto Ikegawa ,  Kyohei Uemura ,  Yoshiyuki Uchinono

Inventor： Youichiro Nakahara ,  Naoto Ikegawa ,  Kyohei Uemura ,  Yoshiyuki Uchinono

IPC: H05K1/09

CPC classification number: H05K3/027 ,  H05K3/108 ,  H05K3/244 ,  H05K2201/09363 ,  H05K2203/0723 ,  H05K2203/107

Abstract: A circuit board includes: an insulating substrate; and a circuit formed on the insulating substrate. The circuit includes: a undercoat layer with a circuit pattern formed by irradiating a metal thin film covering a surface of the insulating substrate with a laser along an outer shape of the circuit so as to partly remove the metal thin film along the outer shape of the circuit; a Cu plating layer, a Ni plating layer and a Au plating layer formed by metal plating and sequentially provided on a surface of the undercoat layer. A first middle plating layer and a second middle plating layer are provided between the Ni plating layer and the Au plating layer. The first middle plating layer includes metal with a less noble standard electrode potential with respect to Au and is in contact with the Au plating layer. The second middle plating layer includes metal with a noble standard electrode potential with respect to the metal in the first middle plating layer and is in contact with the first middle plating layer.

Abstract translation: 电路板包括：绝缘基板; 以及形成在绝缘基板上的电路。 该电路包括：具有电路图案的底涂层，其通过沿电路的外形以激光照射覆盖绝缘基板的表面的金属薄膜而形成，以沿着外部形状部分去除金属薄膜 电路 Cu镀层，Ni镀层和通过金属电镀形成的Au镀层，并依次设置在底涂层的表面上。 在Ni镀层和Au镀层之间设置第一中间镀层和第二中间镀层。 第一中间镀层包括相对于Au具有较低贵族标准电极电位的金属，并与Au镀层接触。 第二中间镀层包括相对于第一中间镀层中的金属具有贵族标准电极电位并与第一中间镀层接触的金属。

公开(公告)号：US08124879B2

公开(公告)日：2012-02-28

申请号：US12301409

申请日：2007-05-18

Applicant: Motonari Ogura

Inventor： Motonari Ogura

IPC: H05K1/00

CPC classification number: H05K1/0271 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/117 ,  H05K2201/093 ,  H05K2201/09363 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/10689 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: A printed wiring board includes a substrate member, terminals and wiring pattern. The terminals are formed in a specific shape on the substrate member and arranged to be aligned in a specific arrangement direction on the substrate member. The wiring pattern is formed on the opposite side across the substrate member from a terminal portion where the terminals are formed, and a plurality of slits are formed extending in a direction perpendicular to the specific arrangement direction.

Abstract translation: 印刷电路板包括基板部件，端子和布线图案。 端子在基板部件上形成为特定的形状，并且被布置成在基板部件上沿特定排列方向对齐。 布线图案从形成有端子的端子部分的基板部件的相反侧形成，并且沿垂直于特定布置方向的方向形成多个狭缝。

公开(公告)号：US20110298359A1

公开(公告)日：2011-12-08

申请号：US13067343

申请日：2011-05-25

Applicant: Jan Hesse ,  Christian Kirchhof ,  Udo Bechtloff ,  Kai Schmieder

Inventor： Jan Hesse ,  Christian Kirchhof ,  Udo Bechtloff ,  Kai Schmieder

IPC: H01J1/62

CPC classification number: H01L51/5203 ,  H01L51/5243 ,  H01L2251/5361 ,  H05K1/112 ,  H05K3/321 ,  H05K2201/0108 ,  H05K2201/09072 ,  H05K2201/09363 ,  H05K2201/10106

Abstract: The invention relates to a lighting element, wherein at least one organic light-emitting diode is formed at an optically transparent substrate as a layer structure. In the lighting element in accordance with the invention, at least one organic light-emitting diode is formed at an optically transparent substrate as a layer structure. The at least one organic light-emitting diode and the substrate are connected to a circuit board and electric contact elements for the connection of the electrodes of the organic light-emitting diode(s) are present at the surface of the circuit board. The surface of the circuit board facing in the direction of the organic light-emitting diode(s) is provided over its full area with a metallic coating as a permeation barrier. The metallic coating is only breached by electric insulators formed about the contact elements.

Abstract translation: 本发明涉及一种照明元件，其中至少一个有机发光二极管形成在光学透明基板上作为层结构。 在根据本发明的照明元件中，至少一个有机发光二极管形成在光学透明基板上作为层结构。 至少一个有机发光二极管和基板连接到电路板，并且用于连接有机发光二极管的电极的电接触元件存在于电路板的表面。 电路板的面向有机发光二极管的方向的表面在其全部区域上设置有作为渗透屏障的金属涂层。 金属涂层仅由围绕接触元件形成的电绝缘体破坏。

公开(公告)号：US08039754B2

公开(公告)日：2011-10-18

申请号：US12374123

申请日：2007-05-14

Applicant: Martin Fink ,  Georg Fischer

Inventor： Martin Fink ,  Georg Fischer

IPC: H05K5/03 ,  H05K5/06

CPC classification number: H05K1/118 ,  B60R16/0215 ,  H05K3/365 ,  H05K2201/09363 ,  H05K2201/09381 ,  H05K2201/099 ,  Y10T29/49126 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A conductor carrier includes a base insulating film, a contact insulating film, at least one first printed conductor and one second printed conductor. The contact insulating film includes at least one first recess and one second recess. The printed conductors are embedded between the two insulating films and each forms a first overlapping region with the first or second recess of the contact insulating film. The conductor carrier also includes an insulating region which separates the first printed conductor from the second printed conductor in an insulating manner due to the contact insulating film being less raised than outside the insulating region, and extends between the first and second recesses of the contact insulating film in a meandering manner. A configuration having the conductor carrier is also provided.

Abstract translation: 导体载体包括基底绝缘膜，接触绝缘膜，至少一个第一印刷导体和一个第二印刷导体。 接触绝缘膜包括至少一个第一凹部和一个第二凹部。 印刷的导体嵌入在两个绝缘膜之间，并且每个与接触绝缘膜的第一或第二凹部形成第一重叠区域。 导体载体还包括绝缘区域，其由于接触绝缘膜比绝缘区域外部稍微升高而以绝缘方式将第一印刷导体与第二印刷导体分离，并且在接触绝缘的第一和第二凹部之间延伸 电影以蜿蜒的方式。 还提供了具有导体载体的构造。