公开(公告)号：EP0618757A1

公开(公告)日：1994-10-05

申请号：EP94105177.3

申请日：1994-03-31

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Hofmann, Kerstin

IPC: H05K3/34

CPC classification number: H05K3/3484 ,  H05K1/0201 ,  H05K1/111 ,  H05K1/116 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/062 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/0989 ,  H05K2201/10689 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K2203/0568 ,  Y02P70/611 ,  Y02P70/613

Abstract: Bei einer Leiterplattenanordnung mit leitfähigen Verbindungsbereichen (2) für leitfähige Anschlußbereiche (Pads) (3, 8) und Lotresistbereichen (4), die höher sind als die Verbindungsbereiche und die Anschlußbereiche und die im Bereich der Anschlußflächen Aussparungen (5) aufweisen, ist vorgesehen, daß die Fläche einer Aussparung des Lotresists in Abhängigkeit von der Fläche eines Anschlußbereichs und einer gegebenen Lotkegelhöhe gewählt ist und daß in der Aussparung die Anschlußfläche (3, 8) breiter ist als der zugeordnete angeschlossene Verbindungsbereich (2, 9). Bei dem Verfahren zur Herstellung einer Leiterplatte ist vorgesehen, in die sich nach dem Verfahren ergebende Aussparung des Lotresists Lotmaterial aufzutragen, das die Anschlußfläche und ihre nicht leitfähige Umgebung in der Aussparung zumindest teilweise abdeckt. Der der Anschlußfläche zugeordnete Anschluß eines Bauelements wird durch Aufschmelzen des Lotmaterials mit der Anschlußfläche verlötet.

Abstract translation: 在印刷电路板布置的情况下，其具有导电连接区域（2），用于导电焊盘（3,8）和阻焊区域（4），其高于连接区域和焊盘并具有切口（5） 在连接表面的区域中，根据焊盘的面积和给定的焊料锥高度选择阻焊剂中的切口的面积，并且在切口中， 连接表面（3,8）比相关联的连接的连接区域（2,9）更宽。 制造印刷电路板的方法提供了将焊料材料沉积到根据工艺制造的阻焊剂中的切口中，该焊料材料至少部分地覆盖连接表面及其切割中的非导电环绕， 出。 分配给连接表面的部件的连接通过熔化焊料材料而被焊接到连接表面。

公开(公告)号：EP3104671B1

公开(公告)日：2018-07-18

申请号：EP16167926.1

申请日：2016-05-02

Applicant: Joylabz LLC

Inventor： WILCOX, Bryan Randall ,  EDDIE, Todd ,  SILVER, Jay Saul

IPC: H05K1/11 ,  H01R11/30 ,  H01R12/72 ,  H01R13/62 ,  H01R13/66 ,  G06F1/16 ,  H05K5/02 ,  H05K5/00 ,  H01R11/24

CPC classification number: H01R13/6205 ,  G06F1/16 ,  H01R11/24 ,  H01R13/6658 ,  H01R2201/06 ,  H05K1/11 ,  H05K1/111 ,  H05K1/113 ,  H05K1/117 ,  H05K5/0278 ,  H05K2201/083 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/094 ,  H05K2201/09427 ,  H05K2201/09481 ,  H05K2201/10386

Abstract: Systems and methods for magnetic coupling. One system includes an external computing device and a connector having a conductive end. The system also includes a printed circuit board. The printed circuit board includes a connector side opposite a back side. The connector side has a contact pad with an aperture. The printed circuit board also includes a magnet positioned on the back side of the printed circuit board. The magnet provides a magnetic field configured to provide magnetic attraction forces to a connector contacting the contact pad. The printed circuit board also includes a communication terminal. The system also includes a circuit in communication with the printed circuit board through the connector and contact pad.

公开(公告)号：EP2533617B1

公开(公告)日：2017-12-13

申请号：EP11736603.9

申请日：2011-01-10

Applicant: Huawei Device Co., Ltd.

Inventor： JIANG, Zhiwei ,  CHEN, Xiaochen ,  GUO, Zhipeng

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/22

CPC classification number: H05K1/111 ,  H05K1/112 ,  H05K1/141 ,  H05K3/225 ,  H05K2201/09072 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09663 ,  H05K2203/042 ,  Y02P70/611

Abstract: Embodiments of the present invention disclose a PCBA chip package component and a soldering component, which can facilitate repairing of a PCBA chip package module. The PCBA chip package component in the embodiments of the present invention includes: a module board and an interface board. A first soldering pad is set on the bottom of the module board, a second soldering pad is set on top of the interface board, and the second soldering pad is of a castle-type structure. The first soldering pad includes a first soldering area, a second soldering area, and a connection bridge that connects the first soldering area and the second soldering area. The first soldering area corresponds to a top surface of the second soldering pad, and when the first soldering area is soldered to second soldering pad, the second soldering area is located outside the second soldering pad. The embodiments of the present invention further provides a soldering component. The embodiments of the present invention may facilitate the repairing of the PCBA chip package component.

公开(公告)号：EP1026928A3

公开(公告)日：2003-02-05

申请号：EP00300553.5

申请日：2000-01-26

Applicant: Ford Motor Company

Inventor： Goenka, Lakhi Nandial

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K3/062 ,  H05K3/4685 ,  H05K2201/0361 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09736 ,  H05K2201/09772 ,  H05K2201/098 ,  Y02P70/611

Abstract: An etched tri-metal-layer air bridge circuit board specially designed for fine-pitch applications, comprising: an electrically insulative substrate surface (10), a plurality of tri-metal-layer bond pads (12) arranged in a generally straight row on the substrate surface (10) wherein the row defines a width direction therealong, and a circuit trace (20) arranged on the substrate surface (10), wherein the circuit trace (20) runs between two adjacent ones (22) of the plurality of tri-metal-layer bond pads (12). Each bond pad (12) comprises: (1) a bottom layer (14) attached to the substrate surface (10), the bottom layer (14) being made of a first metal and having an overall width W1 as measured along the width direction; (2) a top layer (18) disposed above and generally concentric with the bottom layer (14), the top layer (18) being made of the first metal and having an overall width W2 as measured along the width direction; and (3) a middle layer (16) made of a second metal connecting the bottom layer (14) and the top layer (18). The bond pads (12) are specially shaped such that W2 > W1 for at least the two adjacent bond pads (12), thus enabling the circuit trace (20) to be spaced closely to the bottom layers (14) of the two adjacent bond pads (12), while allowing the top layers (18) of the pads (12) to be made much larger so as to avoid delamination thereof from their associated middle layers (16).

公开(公告)号：EP0964609A1

公开(公告)日：1999-12-15

申请号：EP99304262.1

申请日：1999-06-01

Applicant: Ford Motor Company

Inventor： McMillian, Richard Keith ,  Jairazbhoy, Vivek Amir

IPC: H05K3/34

CPC classification number: H05K3/3442 ,  H01L2224/10175 ,  H01L2924/384 ,  H01L2924/3841 ,  H05K1/111 ,  H05K3/3452 ,  H05K2201/0939 ,  H05K2201/0989 ,  H05K2201/10636 ,  H05K2201/10689 ,  Y02P70/611 ,  Y02P70/613

Abstract: There is disclosed herein a printed circuit board (PCB) having improved resistance against solder bridging and component decentring/tombstoning. The PCB comprises: a substrate 10 having a top surface 12; at least two mounting pads 14 disposed on the top surface in matched relation with terminations 26 of an electronic component 24; and a solder mask 16 disposed on the top surface and having at least two apertures 18 therethrough, wherein each aperture generally conforms in shape with and is arranged about a respective one of the mounting pads 14. Each aperture 18 has at least one inner aperture edge 22i generally within a projected footprint F of the electronic component and at least one outer aperture edge 220 generally outside the footprint F. Each aperture 18 includes a notch 20 in one or more of the at least one outer aperture edge 220, wherein each notch 20 extends generally outward from its respective mounting pad 14. The notch 20 provides a reservoir in the solder mask aperture 18 about each pad 14, into which flux, other solder paste effluents, and solder balls may be channelled and remain contained.

Abstract translation: 这里公开了一种印刷电路板（PCB），其具有改进的耐焊接桥接和元件偏心/墓碑的电阻。 PCB包括：具有顶表面12的基板10; 至少两个安装焊盘14，其以与电子部件24的端子26相匹配的方式设置在顶表面上; 以及设置在顶表面上并且具有穿过其中的至少两个孔18的焊接掩模16，其中每个孔基本上与形状相配合并围绕相应的一个安装焊盘14布置。每个孔18具有至少一个内孔边缘 22i通常在电子部件的投影占地面积F内和通常在封面F外部的至少一个外部孔边缘220.每个孔口18包括位于至少一个外部孔口边缘220中的一个或多个中的凹口20，其中每个凹口20 凹槽20围绕每个焊盘14在焊料掩模孔18中提供储存器，焊剂，其它焊膏流出物和焊球可被引导并保持在其中。

公开(公告)号：EP0615290A3

公开(公告)日：1994-11-17

申请号：EP94102227.9

申请日：1994-02-14

Applicant: International Business Machines Corporation

Inventor： Deutsch, Alina ,  Lewis, David Andrew ,  Narayan. Chandrasekhar ,  Plachy,Anthony Louis

IPC: H01L23/538 ,  H01L23/64

CPC classification number: H01L23/5385 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0216 ,  H05K1/0289 ,  H05K1/111 ,  H05K3/4614 ,  H05K2201/0373 ,  H05K2201/0792 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/10719 ,  H05K2203/061 ,  Y02P70/611 ,  H01L2924/00

Abstract: Electrical interconnection structures are described. The electrical interconnection structures are formed by electrically interconnecting in a stack a plurality of discrete substrates (22, 24). By using a plurality of discrete substrates, a multilayer dielectric/electrical conductor structure can be fabricated from individual discrete substrates each of which can be tested prior to forming a composite stack so that defects in each discrete substrate can be eliminated before inclusion into the stack. Electrical interconnection between adjacent substrate is provided by an array of contact locations on each surface of the adjacent substrates. Corresponding contacts on adjacent substrates are adapted for mutual electrical engagement. Adjacent contact locations can be thermocompression bonded. To reduce the parasitic capacitance and coupled noise between the contact pads (26) the electrical conductors within the interior of each discrete substrate, the contact pads on each substrate have elongated shape. The elongated contact pads or lattice pads on adjacent substrates are nonparallel and preferably orthogonal so that the corresponding pads of adjacent substrates electrically interconnect an intersecting area which varies in location along the elongated contact pads as the placement of the adjacent substrates varies in the manufacture thereof.

Abstract translation: 描述电互连结构。 电互连结构通过在堆叠中电互连而形成，多个分立的衬底（22,24）。 通过使用多个分立的衬底，多层电介质/电导体结构可以由单独的离散衬底制成，每个离散衬底可以在形成复合堆叠之前进行测试，从而在包含在堆叠中之前可以消除每个离散衬底中的缺陷。 相邻基板之间的电气互连由相邻基板的每个表面上的接触位置阵列提供。 相邻基板上的对应接点适于相互电接合。 相邻的接触位置可以热压粘合。 为了减小接触焊盘（26）之间的寄生电容和耦合噪声，每个离散衬底内部的电导体，每个衬底上的接触焊盘具有细长形状。 相邻基板上的细长接触焊盘或网格焊盘是不平行的并且优选地是正交的，使得相邻衬底的相应衬垫在相邻衬底的布置在其制造中变化时，沿着细长接触焊盘的位置电连接沿着位置变化的交叉区域。

公开(公告)号：EP0414393A1

公开(公告)日：1991-02-27

申请号：EP90308484.6

申请日：1990-08-01

Applicant: ITT INDUSTRIES LIMITED

Inventor： Collier, John Covell ,  Lee, David

IPC: H01R23/70

CPC classification number: H01R12/57 ,  H01R12/721 ,  H05K1/117 ,  H05K3/325 ,  H05K3/341 ,  H05K3/4015 ,  H05K2201/0367 ,  H05K2201/0939 ,  H05K2201/09709 ,  H05K2201/10863 ,  Y10S439/951

Abstract: An electrical connecting arrangement is provided between an electrical edge connector and a printed circuit board in which contact pads provided near the edge of the printed circuit board have a convex profile at least in the direction of insertion of the board into an opening in the edge connector. The depth of the connector opening and the distance of the contact pads from the board edge is such that during insertion of the board into the connector contact springs of the latter ride up and over the convex profile of the pads and come to rest beyond the centre line of the convex profile when the board is fully inserted.

Abstract translation: 在电气边缘连接器和印刷电路板之间提供电连接装置，其中设置在印刷电路板边缘附近的接触垫至少在电路板插入边缘连接器的开口中的方向上具有凸起轮廓 。 连接器开口的深度以及接触垫距板边缘的距离是这样的，即在将电路板插入连接器的过程中，电路板的接触弹簧在电路板的凸起轮廓上越过并且越过中心 当电路板完全插入时，凸轮廓线。

公开(公告)号：JP2015176713A

公开(公告)日：2015-10-05

申请号：JP2014051577

申请日：2014-03-14

Applicant: 日亜化学工業株式会社

Inventor： 岡 祐太

IPC: F21S2/00 ,  H01L33/62 ,  H05K1/18 ,  F21Y101/02 ,  F21V19/00

CPC classification number: H01L33/62 ,  H05K1/111 ,  H01L33/486 ,  H05K2201/0939 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2203/048 ,  H05K3/3436 ,  Y02P70/611

Abstract: 【課題】発光装置を載置する向きにかかわらず発光装置の電極と実装基板の配線を接合することができる照明装置を提供する。 【解決手段】発光装置の第1電極及び第2電極が実装基板の第1配線及び第2配線にそれぞれ接合材料を介して対向するよう接合される照明装置であって、前記実装基板の第1配線と前記発光装置の第1電極との少なくとも一部が平面視において重なる場合に、前記発光装置の向きにかかわらず、前記実装基板の第2配線と前記発光装置の第2電極との少なくとも一部が平面視において重なる照明装置である。 【選択図】図1

Abstract translation: 要解决的问题：提供一种能够连接发光装置的电极和安装板的布线的照明装置，而不管安装发光装置的方向如何。解决方案：在照明器中，第一电极和 发光装置的第二电极分别通过连接材料分别与安装板的第一布线和第二布线相对。 在照明装置中，在平面图中，安装基板的第一布线和发光装置的第一电极至少部分重叠的情况下，与发光装置的方向无关，第二布线 发光装置的安装板和第二电极在平面图中至少部分重叠。

公开(公告)号：JP2015052454A

公开(公告)日：2015-03-19

申请号：JP2013183768

申请日：2013-09-05

Applicant: 日東電工株式会社 ,  Nitto Denko Corp

Inventor： IHARA TERUICHI ,  ICHINOSE KOJI

IPC: G01R31/02 ,  H05K3/00

CPC classification number: H05K3/4038 ,  G01R31/2805 ,  G01R31/2813 ,  G11B5/455 ,  G11B5/484 ,  H05K1/0268 ,  H05K1/115 ,  H05K1/116 ,  H05K3/4685 ,  H05K2201/09381 ,  H05K2201/0939 ,  Y10T29/49004

Abstract: 【課題】電極パッド間が複数の線路で電気的に接続されている場合でも、電極パッド間の導通の異常を検出することが可能な配線回路基板の導通検査方法および配線回路基板の製造方法を提供する。【解決手段】測定プローブ54,55が電極パッド21,31にそれぞれ接触するとともに、測定プローブ56,57が電極パッド21,31にそれぞれ接触する。測定プローブ54,55を通して電極パッド21,31および複数の線路LA1〜LA5を含む電流経路に電流が流される。電流経路の電流の値が測定され、測定プローブ56,57間の電圧の値が測定される。測定された電流の値および測定された電圧の値に基づいて、電極パッド21,31間の導通が検査される。【選択図】図7

Abstract translation: 要解决的问题：为了提供布线电路板的连续性检查方法以及制造可以检测电极焊盘之间的连续性的异常的布线电路板的方法，即使当电极焊盘经由多条线电互连时。 解决方案：测量探头54和55分别与电极焊盘21和31接触，测量探头56和57分别与电极焊盘21和31接触。 使电流流过包括电极焊盘21和31的电流路径以及通过测量探针54和55的多条线LA1-LA5。测量电流路径中的电流值， 测量测量探头56和57。 基于测量的电流值和测量的电压值，检查电极焊盘21和31之间的连续性。

公开(公告)号：JP4356740B2

公开(公告)日：2009-11-04

申请号：JP2006321472

申请日：2006-11-29

Applicant: セイコーエプソン株式会社

Inventor： 山田　　純 ,  順一郎 篠▲崎▼

IPC: H05K3/10

CPC classification number: H05K3/125 ,  H05K2201/09272 ,  H05K2201/0939 ,  H05K2203/013