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    Relay module device
    64.
    发明授权
    Relay module device 有权
    继电器模块装置

    公开(公告)号：US09515652B2

    公开(公告)日：2016-12-06

    申请号：US14606447

    申请日：2015-01-27

    Applicant: Anden Co., Ltd.

    Inventor： Hideyuki Ohtani ,  Naoyuki Yasuda

    IPC: H03K17/693 ,  H03K17/687 ,  H05K3/34

    CPC classification number: H03K17/693 ,  H03K17/6874 ,  H03K17/6877 ,  H05K3/3426 ,  H05K2201/10053 ,  H05K2201/10295 ,  H05K2201/10803 ,  H05K2201/1081 ,  H05K2201/10833 ,  H05K2201/10871 ,  Y02P70/613

    Abstract: In a relay module device, a signal converting section transmits driving signals of switching elements when receiving input signals from an external device and sets a relationship between the input signals and the driving signals. The relationship includes a first mode in which the signal converting section transmits the driving signals to separately control one of the switching elements with respect to one of the input signals, and a second mode in which the signal converting section transmits the driving signals to concurrently control two or more of the switching elements with respect to one of the input signals.

    Abstract translation: 在继电器模块装置中，当从外部装置接收输入信号时，信号转换部分传输开关元件的驱动信号，并设定输入信号与驱动信号之间的关系。 该关系包括第一模式，其中信号转换部分发送驱动信号以相对于输入信号之一单独控制开关元件之一;以及第二模式，其中信号转换部分将驱动信号传输到同时控制 相对于输入信号之一的两个或多个开关元件。

    SOLDER SPACER AND ELECTRONIC MODULE COMPRISING SUCH A SPACER
    66.
    发明申请
    SOLDER SPACER AND ELECTRONIC MODULE COMPRISING SUCH A SPACER 有权
    包括这种间隔器的焊接间隔器和电子模块

    公开(公告)号：US20150173192A1

    公开(公告)日：2015-06-18

    申请号：US14405094

    申请日：2013-05-23

    Applicant: SAGEMCOM BROADBAND SAS

    Inventor： Stephane Kohn

    IPC: H05K1/14 ,  H05K1/11

    CPC classification number: H05K1/14 ,  H05K1/11 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10409 ,  H05K2201/10803 ,  H05K2201/1081 ,  H05K2201/10818 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/2036

    Abstract: The invention provides a spacer for soldering comprising an elongate body having one end provided with a tapped hole and an opposite end provided with a transverse bearing surface having a smooth centering peg projecting therefrom, the peg has a longitudinal outer passage extending over at least a fraction of its length as far as the transverse bearing surface to enable molten solder to penetrate by capillarity as far as the transverse bearing surface. The invention also provides a module including such a spacer.

    Abstract translation: 本发明提供了一种用于焊接的间隔件，其包括细长本体，其一端设有螺纹孔，另一端设置有横向支承表面，该横向支承表面具有从其突出的平滑的定中心钉，所述栓具有纵向外部通道， 其长度为横向支承表面，以使熔融焊料能够通过毛细管力渗透到横向支承表面。 本发明还提供了一种包括这种间隔件的模块。

    Electronic device and on-vehicle module
    67.
    发明授权
    Electronic device and on-vehicle module 有权
    电子设备和车载模块

    公开(公告)号：US07883378B2

    公开(公告)日：2011-02-08

    申请号：US12285893

    申请日：2008-10-16

    Applicant: Shiro Yamashita ,  Hideto Yoshinari

    Inventor： Shiro Yamashita ,  Hideto Yoshinari

    IPC: H01R13/42

    CPC classification number: H05K1/119 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/141 ,  H05K3/308 ,  H05K3/42 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K2201/10803 ,  Y10S439/941

    Abstract: In a module, press-fit connection using a pin terminal including a connection part separated into two parts and a flat plane parallel to the lengthwise direction in the separation part and perpendicular to the separation direction of the pin terminal is performed. A through-hole of a board is structured so that an inner diameter of the through-hole at a middle part in the thickness direction of the board is smaller than that at obverse and reverse surfaces of the board and the length of the middle part of the through-hole connected to the pin terminal is shorter than the length of the flat plane of the pin terminal.

    Abstract translation: 在模块中，使用包括分离成两部分的连接部分的引脚端子和在分离部分中与长度方向平行的平面并且垂直于引脚端子的分离方向的压配合连接。 板的通孔的结构使得板的厚度方向中间部分处的通孔的内径小于板的正面和反面以及中间部分的长度 连接到引脚端子的通孔比引脚端子的平面的长度短。

    Electronic device and manufacturing method of the same
    69.
    发明申请
    Electronic device and manufacturing method of the same 有权
    电子器件及其制造方法相同

    公开(公告)号：US20080146051A1

    公开(公告)日：2008-06-19

    申请号：US11979968

    申请日：2007-11-13

    Applicant: Takayoshi Honda

    Inventor： Takayoshi Honda

    IPC: H01R12/00

    CPC classification number: H05K1/116 ,  H01R12/707 ,  H01R43/0256 ,  H05K1/023 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10901 ,  H05K2203/1178 ,  H05K2203/1394

    Abstract: An electronic device includes a printed circuit board with multiple lands and through holes and an electronic element with multiple terminals on the board. Each terminal is coupled with the land through a solder. The lands include a surface land on the board and an insertion land on a sidewall of the through hole. The terminals include a branch terminal having an insertion member and a surface member. The insertion member is coupled with the insertion land through the solder. The surface member is coupled with the surface land through the solder. The surface member is parallel to the printed circuit board. The insertion member is perpendicular to the printed circuit board. The insertion member extends from a part of the surface member, which faces the surface land and disposed above the through hole.

    Abstract translation: 电子设备包括具有多个焊盘和通孔的印刷电路板以及具有多个端子的电子元件。 每个端子通过焊料与焊盘连接。 焊盘包括板上的表面焊盘和通孔的侧壁上的插入焊盘。 端子包括具有插入部件和表面部件的分支端子。 插入构件通过焊料与插入平台耦合。 表面构件通过焊料与表面焊盘连接。 表面构件平行于印刷电路板。 插入构件垂直于印刷电路板。 所述插入部件从所述表面部件的面向所述表面焊盘并设置在所述通孔的上方的一部分延伸。

    Electronic component with high density, low cost attachment
    70.
    发明申请
    Electronic component with high density, low cost attachment 有权
    电子元件密度高，附件成本低

    公开(公告)号：US20070207635A1

    公开(公告)日：2007-09-06

    申请号：US11604289

    申请日：2006-11-27

    Applicant: Mark Gailus ,  Leon Khilchenko

    Inventor： Mark Gailus ,  Leon Khilchenko

    IPC: H01R12/00

    CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/10803 ,  H05K2201/10924 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00

    Abstract: A contact tail for an electronic component compatible with surface mount manufacturing techniques. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. High precision in the contact tails in turn provides more reliable solder joints across an array of contact tails in an electronic component. Further, the contact tail may be shaped to reduce the propensity for solder to wick from the attachment area during a reflow operation. Reducing the propensity of solder to wick reduces the chance that solder will interfere with the operation of the electronic component. Additionally, reducing the propensity for solder to wick allows pads to which the contact tail is attached to be positioned over vias, thereby increasing the density with which contacts may be attached to a substrate. The reliability with which electronic assemblies incorporating components using the contact tail is also increased when the contact tail is used in self-centering arrays.

    Abstract translation: 与表面贴装制造技术兼容的电子元件的接触尾部。 接触尾部被冲压，提供相对低的制造成本和高精度。 接触尾部的高精度依次在电子部件中的接触尾部阵列上提供更可靠的焊点。 此外，接触尾部可以被成形为在回流操作期间降低焊料从连接区域芯吸的倾向。 降低焊料对芯的倾向降低了焊料会干扰电子部件的操作的可能性。 此外，降低焊料对芯的倾向允许接触尾部附着的焊盘定位在通孔上方，从而增加接触可附着于基底的密度。 当接触尾部用于自定心阵列时，使用接触尾部组装部件的电子组件的可靠性也增加。

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