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    Method for forming a filter
    71.
    发明授权
    Method for forming a filter 失效
    形成过滤器的方法

    公开(公告)号：US5985164A

    公开(公告)日：1999-11-16

    申请号：US950952

    申请日：1997-10-15

    Applicant: Wen-Hua Chu ,  Mauro Ferrari

    Inventor： Wen-Hua Chu ,  Mauro Ferrari

    IPC: B01D39/20 ,  B01D67/00 ,  B01D69/02 ,  B01D69/12 ,  B01D71/02 ,  B81B1/00 ,  B81C1/00 ,  C23C16/01 ,  G03F7/00 ,  B32B31/00 ,  B01D71/04 ,  C19K13/00

    CPC classification number: B81C1/00246 ,  B01D39/20 ,  B01D67/0058 ,  B01D67/0062 ,  B01D67/0072 ,  B01D69/02 ,  B01D69/12 ,  B01D71/02 ,  B81B3/007 ,  C23C16/01 ,  G03F7/0015 ,  B01D2325/04 ,  B81B2201/10 ,  B81C2201/014 ,  B81C2201/032 ,  B81C2203/0728 ,  B81C2203/075

    Abstract: Surface micromachining and bulk micromachining are employed for realizing a porous membrane with bulk support for a microparticle filter. The filter is manufactured by a process employing a thin film etch-stop, in which the bulk substrate is etched using a first etching process followed by etching of the etch stop and of material within pores of a filter layer using a second etching process. The filter is sufficiently sturdy to allow for easy handling. It may be used as a diffusion barrier and under high pressures. The disclosed fabrication method is simple, reliable, and integrated-circuit compatible, and thus amenable to mass production. Electronic circuitry may be integrated on the filter surface, as may be desired for several purposes, such as fluid characterization, filter self-cleaning, or charging of the filter surfaces. Methods are shown for the realization of biological containment capsules based on this microfilter.

    Abstract translation: 采用表面微机械加工和体积微加工技术来实现具有大量支撑微孔过滤器的多孔膜。 该过滤器是通过使用薄膜蚀刻停止的工艺制造的，其中使用第一蚀刻工艺蚀刻大块衬底，然后使用第二蚀刻工艺蚀刻蚀刻停止层和过滤层的孔内的材料。 过滤器足够坚固以便于处理。 它可以用作扩散屏障并在高压下使用。 所公开的制造方法简单，可靠，并且集成电路兼容，因此适合批量生产。 电子电路可以集成在过滤器表面上，如可能需要多种目的，例如流体表征，过滤器自清洁或过滤表面的充电。 显示了基于该微型过滤器实现生物遏制胶囊的方法。

    A METHOD FOR MANFACTURING A MEMBRANE IN A (111) SURFACE OF A (100) SILICIUM WAFER
    75.
    发明申请
    A METHOD FOR MANFACTURING A MEMBRANE IN A (111) SURFACE OF A (100) SILICIUM WAFER 审中-公开
    在（100）硅酸盐（111）表面上制造膜的方法

    公开(公告)号：WO2004083111A1

    公开(公告)日：2004-09-30

    申请号：PCT/NL2004/000197

    申请日：2004-03-22

    Applicant: TECHNISCHE UNIVERSITEIT DELFT ,  VENSTRA, Warner, Jurrien

    Inventor： VENSTRA, Warner, Jurrien

    IPC: B81C1/00

    CPC classification number: B81C1/0015 ,  B81B2201/10 ,  B81B2201/12 ,  B81B2203/019 ,  B81C1/00158 ,  B81C2201/0132

    Abstract: The invention relates to a method for the fabrication of a membrane oriented in a (111) plane of a (100) silicon wafer. To this end the method comprises the following steps: applying a mask to both sides of the wafer, wherein portions of the sides are covered by the mask; and the at least partial removal by etching away silicon material from the portions of the two sides of the wafer that are not covered. This method is characterised in that the etching step substantially removes the silicon material forming recesses in the two surfaces of the wafer, such that the walls of the recesses are formed by (111) planes, and in that not covered portions at both sides of the wafer are aligned in relation to one another such that a (111) plane is formed and the distance d between said two planes is less than the thickness of the silicon wafer, so as to form a membrane in the (111) plane having a thickness d. Such a membrane has many application possibilities in the field of MEMS, for example by dividing the membrane into individual cantilevers.

    Abstract translation: 本发明涉及一种用于制造在（100）硅晶片的（111）面中取向的膜的方法。 为此，该方法包括以下步骤：将掩模施加到晶片的两侧，其中边的部分被掩模覆盖; 以及通过从未覆盖的晶片的两侧的部分蚀刻掉硅材料来进行至少部分去除。 该方法的特征在于，蚀刻步骤基本上去除晶片的两个表面中的形成硅材料的凹槽，使得凹部的壁由（111）面形成，并且在该两面的不覆盖部分 晶片相对于彼此对准，使得形成（111）面并且所述两个平面之间的距离d小于硅晶片的厚度，以便在（111）面中形成具有厚度的膜 天。 这种膜在MEMS领域具有许多应用可能性，例如通过将膜分成单独的悬臂。

    METHOD OF FORMING MICRO-PIPES ON A SUBSTRATE AND A STRUCTURE FORMED THEREWITH
    78.
    发明公开
    METHOD OF FORMING MICRO-PIPES ON A SUBSTRATE AND A STRUCTURE FORMED THEREWITH 审中-公开
    在衬底上形成微管的方法和由此形成的结构

    公开(公告)号：EP3281910A1

    公开(公告)日：2018-02-14

    申请号：EP16183687.9

    申请日：2016-08-11

    Applicant: IMEC VZW

    Inventor： Tao, Zheng ,  Chan, Boon Teik ,  Xu, XiuMei ,  Khashayar, Babaei Gavan ,  Altamirano Sanchez, Efrain

    IPC: B81C1/00

    CPC classification number: B01D15/10 ,  B01D53/0407 ,  B01D63/14 ,  B01L3/502753 ,  B01L2300/0896 ,  B81B2201/058 ,  B81B2201/10 ,  B81B2203/0315 ,  B81B2203/0338 ,  B81B2203/0346 ,  B81B2203/0384 ,  B81C1/00119 ,  C12M1/123 ,  C12M33/14

    Abstract: A method for producing a structure comprising, on a main surface of a substrate, at least one elongated cavity having openings at opposing ends. The method comprises providing a substrate having a main surface. On the main surface, a first pair of features are formed that protrude perpendicularly from the main surface. The features have elongated sidewalls and a top surface, are parallel to one another, are separated by a gap having a width sl and a bottom area, and have a width wl and a height h1. A ratio of h1/w1 is in the range of 3 to 30 and wherein the separation gap sl is less than twice the height of h1. At least the main surface of the substrate and the first pair of features are brought in contact with a liquid, suitable for making a contact angle of less than 90° with the material of the elongated sidewalls and subsequently, the substrate is dried.

    Abstract translation: 一种用于制造结构的方法，该结构包括在衬底的主表面上的至少一个在相对端具有开口的细长空腔。 该方法包括提供具有主表面的衬底。 在主表面上形成第一对特征，其从主表面垂直地突出。 这些特征具有细长侧壁和顶表面，彼此平行，被具有宽度sl和底部区域的间隙隔开，并且具有宽度w1和高度h1。 h1 / w1的比例在3至30的范围内，并且其中分隔间隙sl小于h1的高度的两倍。 至少使衬底的主表面和第一对部件与液体接触，适合与细长侧壁的材料形成小于90°的接触角并随后干燥衬底。

    Process for manufacturing a micromechanical structure having a buried area provided with a filter
    79.
    发明公开
    Process for manufacturing a micromechanical structure having a buried area provided with a filter 有权
    一种用于与带有滤波器的掩埋区制造微机械结构的方法

    公开(公告)号：EP2412665A1

    公开(公告)日：2012-02-01

    申请号：EP11175428.9

    申请日：2011-07-26

    Applicant: STMicroelectronics S.r.l.

    Inventor： Ferrera, Marco ,  Perletti, Matteo ,  Varisco, Igor ,  Zanotti, Luca

    IPC: B81C1/00 ,  B01L3/00 ,  G03F7/00 ,  B01D71/02

    CPC classification number: B81C1/00119 ,  B01D67/0062 ,  B01D71/02 ,  B01D2325/021 ,  B01D2325/028 ,  B01L3/502707 ,  B01L3/502753 ,  B01L2300/0681 ,  B81B2201/10 ,  B81C1/00071 ,  B81C1/00087 ,  B81C2201/0133 ,  B81C2201/0157 ,  F04B19/006

    Abstract: A process for manufacturing a micromechanical structure (25) envisages: forming a buried cavity (10) within a body (1, 12) of semiconductor material, separated from a top surface (12a) of the body by a first surface layer (12); and forming an access duct (18a) for fluid communication between the buried cavity (10) and an external environment. The method envisages: forming an etching mask (14) on the top surface (12a) at a first access area (17a); forming a second surface layer (15) on the top surface (12a) and on the etching mask (14); carrying out an etch such as to remove, in a position corresponding to the first access area, a portion of the second surface layer (15), and an underlying portion of the first surface layer (12) not covered by the etching mask (14) until the buried cavity is reached, thus forming both the first access duct (18a) and a filter element (20), set between the first access duct and the same buried cavity.

    Abstract translation: 一种用于制造微机械结构（25）设想过程：半导体材料的主体（1，12）内形成掩埋空腔（10），由第一表面层与所述主体的顶面（12a）的分离（12） ; 以及形成到埋入腔（10）之间，并与外部环境中访问管道（18）流体连通。 该方法设想：在在第一接入区域（17a）的蚀刻顶表面（12A）上掩模（14）成形; 形成所述顶面（12A）上的第二表面层（15）和在蚀刻掩模（14）; 进行蚀刻：如以除去，在对应于所述第一接入区，第二表面层（15）的一部分的位置，并在第一表面层（12）未包括的蚀刻掩模的下层部分（14 ）达到掩埋空腔直到，从而形成两个第一接入管道（18a）和一个过滤器元件（20），所述第一进出管道和相同的掩埋空腔之间。

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