公开(公告)号：EP2911159A4

公开(公告)日：2016-04-06

申请号：EP13848557

申请日：2013-10-21

Applicant: NAT INST FOR MATERIALS SCIENCE

Inventor： KAWAKITA JIN ,  CHIKYO TOYOHIRO ,  HASHIMOTO YASUO ,  HORVATH BARBARA

IPC: H01B1/00 ,  B05D1/26 ,  B05D5/12 ,  B32B27/00 ,  C08G73/02 ,  C08K3/08 ,  C08L65/00 ,  C08L79/02 ,  C09D17/00 ,  C09D201/00 ,  C09J165/00 ,  H01B1/22 ,  H01B5/14 ,  H01L21/768

CPC classification number: H05K1/095 ,  C08G73/0266 ,  C08G2261/3221 ,  C08G2261/3223 ,  C08G2261/43 ,  C08G2261/964 ,  C08K3/08 ,  C08L65/00 ,  C08L79/02 ,  C09D17/00 ,  C09D201/00 ,  C09J7/02 ,  C09J7/20 ,  C09J165/00 ,  C09J2205/102 ,  C09J2465/00 ,  H01B1/22 ,  H01L21/76898 ,  H01L23/49883 ,  H05K1/097 ,  H05K3/4069 ,  H05K2201/032 ,  Y10T428/24339

Abstract: A conductive polymer-metal complex becomes to be adhered simply and strongly on the surface of a substrate such as PTFE. By subjecting a solution containing a monomer which provides a conductive polymer, an anion, and a metal ions such as Ag + , Cu 2+ , Cu + and the like to an irradiation with light having an energy required for exciting an electron to an energy level capable of reducing the metal ion, such as ultraviolet light, under an appropriated condition, thereby precipitating the conductive polymer-metal complex as being dispersed in the reaction liquid. By supplying this dispersion liquid onto various substrates, the complex microparticles in the dispersion liquid enter into and mate with the narrow holes on the surface of the substrate. As a result, the complex precipitate formed on the surface of the substrate and the substrate can be adhered strongly to each other.

公开(公告)号：EP2880105A1

公开(公告)日：2015-06-10

申请号：EP13825256.4

申请日：2013-07-30

Applicant: BYD Company Limited

Inventor： LI, Haibin ,  HU, Wen ,  LIN, Hongye

IPC: C09D11/10 ,  H05K1/02 ,  H05K3/12

CPC classification number: H01B1/22 ,  C09D11/037 ,  C09D11/104 ,  C09D11/52 ,  C09D133/00 ,  C09D163/00 ,  C09D167/00 ,  H05K1/0298 ,  H05K1/092 ,  H05K3/12 ,  H05K3/185 ,  H05K2201/032 ,  H05K2203/0709 ,  H05K2203/107

Abstract: An ink composition and a circuit board and a method for producing the same are provided. The ink composition comprises: an acrylic resin; an epoxy resin; a polyester resin; a curing agent; and an active powder comprising a modified metal compound, in which a metal element of the modified metal compound is selected from a group consisting of Zn, Cr, Co, Cu, Mn, Mo, Ni, and a combination thereof.

公开(公告)号：EP3154064A4

公开(公告)日：2018-02-21

申请号：EP15839289

申请日：2015-09-01

Applicant: LG CHEMICAL LTD

Inventor： PARK CHEE-SUNG ,  PARK CHEOL-HEE ,  LEE HA NA ,  JEONG HAN NAH ,  KIM JAE HYUN ,  JUN SHIN HEE ,  SEONG EUN KYU ,  LEE SU JEONG

IPC: H01B1/22 ,  H01B5/14 ,  H05K1/09 ,  H05K3/10

CPC classification number: H05K1/09 ,  C08J7/123 ,  C08J2369/00 ,  C08K3/22 ,  C08K2003/2248 ,  C08K2003/2293 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/2013 ,  C23C18/204 ,  H01B1/22 ,  H01B5/14 ,  H01B13/00 ,  H05K1/0353 ,  H05K3/105 ,  H05K3/181 ,  H05K2201/032

Abstract: The present invention relates to a composition for forming a conductive pattern which allows micro conductive patterns to be formed on various polymeric resin products or resin layers by a very simplified process, a method for forming a conductive pattern using the composition, and a resin structure having the conductive pattern. The composition for forming a conductive pattern comprises: a polymeric resin; and a nonconductive metallic compound including a first metal, a second metal and a third metal, wherein the nonconductive metallic compound has a three-dimensional structure including a plurality of first layers (edge-shared octahedral layers) having a structure in which octahedrons comprising two metals from among the first metal, the second metal and the third metal which share the edges thereof with one another are two-dimensionally connected to one other, and a second layer which includes a metal of a different type from the first layer and is arranged between adjacent first layers, and wherein a metallic core including the first metal, the second metal or the third metal or an ion thereof is formed from the nonconductive metallic compound by electromagnetic radiation.

公开(公告)号：EP3089844A4

公开(公告)日：2017-10-04

申请号：EP14877119

申请日：2014-12-31

Applicant: ALPHA METALS

Inventor： RIBAS MORGANA DE AVILA ,  RAUT RAHUL ,  CUCU TRAIAN CORNEL ,  YONG SHU TAI ,  SARKAR SIULI ,  VENKATAGIRIYAPPA RAMAKRISHNA HOSUR

IPC: B23K35/362 ,  B23K35/02 ,  B23K35/26 ,  B23K35/36 ,  H05K1/09 ,  H05K1/11 ,  H05K9/00

CPC classification number: B23K35/362 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3618 ,  H05K1/09 ,  H05K1/111 ,  H05K9/0024 ,  H05K2201/032

Abstract: Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.

Abstract translation: 用于提高焊点机械可靠性的松香型热固性助焊剂配方。 根据一个或一个以上方面，如本文中所展示及描述的焊膏赋予与跌落冲击，热循环，热冲击，剪切强度，弯曲强度性能和/或其它热学中的至少一者有关的改善或增强的焊接接头性质 - 机械性能属性。

公开(公告)号：EP3205750A1

公开(公告)日：2017-08-16

申请号：EP17154692.2

申请日：2017-02-03

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Jayaraju, Nagarajan ,  Barstad, Leon

IPC: C25D7/12 ,  C25D5/18 ,  H05K3/42

CPC classification number: H05K3/429 ,  C23C18/1653 ,  C23C18/38 ,  C25D3/38 ,  C25D5/02 ,  C25D5/18 ,  C25D5/56 ,  C25D7/123 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0094 ,  H05K3/423 ,  H05K2201/032 ,  H05K2203/0723

Abstract: Direct current plating methods inhibit void formation, reduce dimples and eliminate nodules. The method involves electroplating copper at a high current density followed by electroplating at a lower current density to fill through-holes.

Abstract translation: 直流电镀方法抑制空隙形成，减少凹痕并消除结节。 该方法涉及以高电流密度电镀铜，然后以较低的电流密度电镀以填充通孔。

公开(公告)号：EP3127969A4

公开(公告)日：2017-02-08

申请号：EP15773385

申请日：2015-04-01

Applicant: KOREA ELECTRONICS TECHNOLOGY

Inventor： KIM YOONJIN ,  CHO JINWOO ,  SHIN KWONWOO ,  SEO YONGGON ,  KIM YEONWON ,  JANG SANGHYEON ,  JO NAMJE

IPC: C09D11/52 ,  B22F9/24 ,  H01B1/20 ,  H01B5/14

CPC classification number: H05K1/095 ,  B22F1/0022 ,  B22F1/0074 ,  B22F1/02 ,  B22F9/24 ,  B22F2301/10 ,  B22F2302/25 ,  C09D11/037 ,  C09D11/52 ,  H01B1/20 ,  H01B1/22 ,  H05K1/097 ,  H05K3/027 ,  H05K3/1216 ,  H05K3/227 ,  H05K2201/032

Abstract: The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent. In addition, the present invention provides a method of fabricating a wiring board and a wiring board fabricated by the method, the method including a step of screen-printing the ink composition for light sintering on a flexible board body to form a preliminary wiring pattern, a step of drying the preliminary wiring pattern, and a step of reducing and sintering the oxidized copper of the copper oxide nanoparticles, which are included in the preliminary wiring pattern, by irradiating the dried preliminary wiring pattern with light to form a wiring pattern on the board body.

公开(公告)号：EP3127969A1

公开(公告)日：2017-02-08

申请号：EP15773385.8

申请日：2015-04-01

Applicant: Korea Electronics Technology Institute

Inventor： KIM, Yoonjin ,  CHO, Jinwoo ,  SHIN, Kwonwoo ,  SEO, Yonggon ,  KIM, Yeonwon ,  JANG, Sanghyeon ,  JO, Namje

IPC: C09D11/52 ,  H01B1/20 ,  B22F9/24 ,  H01B5/14

CPC classification number: H05K1/095 ,  B22F1/0022 ,  B22F1/0074 ,  B22F1/02 ,  B22F9/24 ,  B22F2301/10 ,  B22F2302/25 ,  C09D11/037 ,  C09D11/52 ,  H01B1/20 ,  H01B1/22 ,  H05K1/097 ,  H05K3/027 ,  H05K3/1216 ,  H05K3/227 ,  H05K2201/032

Abstract: The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent. In addition, the present invention provides a method of fabricating a wiring board and a wiring board fabricated by the method, the method including a step of screen-printing the ink composition for light sintering on a flexible board body to form a preliminary wiring pattern, a step of drying the preliminary wiring pattern, and a step of reducing and sintering the oxidized copper of the copper oxide nanoparticles, which are included in the preliminary wiring pattern, by irradiating the dried preliminary wiring pattern with light to form a wiring pattern on the board body.

Abstract translation: 本发明涉及一种用于轻烧结的油墨组合物，使用该组合物的布线板以及该布线板的制造方法。 本发明旨在提供一种布线图案的形成，而不会损害柔性印刷电路板等薄且柔软的布线板。 本发明提供一种轻烧结用油墨组合物，其包含具有氧化铜膜的氧化铜纳米粒子，还原通过光照射氧化而形成铜纳米粒子的铜的还原剂，分散剂，粘合剂和溶剂。 此外，本发明提供了一种制造布线板的方法和通过该方法制造的布线板，该方法包括以下步骤：在柔性板体上丝网印刷用于光烧结的油墨组合物以形成预备布线图案， 干燥初步布线图案的步骤以及通过用光照射干燥的初步布线图案以还原和烧结包括在初步布线图案中的氧化铜纳米颗粒的氧化铜的步骤以在第一布线图案上形成布线图案 板身。

公开(公告)号：EP2752505B1

公开(公告)日：2016-03-23

申请号：EP12829006.1

申请日：2012-08-30

Applicant: JX Nippon Mining & Metals Corporation

Inventor： NAGAURA, Tomota ,  SAKAGUCHI, Kazuhiko

IPC: C23C28/00 ,  B32B15/01 ,  C25D7/06 ,  C25D5/14 ,  C25D1/04 ,  C25D9/08 ,  H05K1/09 ,  C23C28/02 ,  C23C18/16 ,  C25D3/14 ,  C25D3/16 ,  C25D3/38 ,  C25D3/58 ,  C25D3/56 ,  H05K3/02 ,  C25D11/38

CPC classification number: H05K1/09 ,  B32B15/01 ,  C23C18/165 ,  C23C18/31 ,  C23C28/023 ,  C25D1/04 ,  C25D3/04 ,  C25D3/12 ,  C25D3/14 ,  C25D3/16 ,  C25D3/38 ,  C25D3/562 ,  C25D3/565 ,  C25D3/58 ,  C25D5/14 ,  C25D7/0614 ,  C25D9/08 ,  C25D11/38 ,  H05K3/025 ,  H05K2201/0317 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2203/0307 ,  Y10T428/12438 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12611 ,  Y10T428/12667 ,  Y10T428/12861 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/12958 ,  Y10T428/24917

Abstract: The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 µg/dm 2 of Ni and said Cr layer containing 10-100 µg/dm 2 of Cr is provided.

公开(公告)号：EP2869677A1

公开(公告)日：2015-05-06

申请号：EP13808900.8

申请日：2013-02-28

Applicant: Ishihara Chemical Co., Ltd.

Inventor： KAWATO, Yuichi ,  MITA, Tomohiro ,  MAEDA, Yusuke ,  KUDO, Tomio

IPC: H05K3/38 ,  H05K1/09 ,  H05K3/24

CPC classification number: H05K3/38 ,  H05K1/0296 ,  H05K1/0313 ,  H05K1/097 ,  H05K3/245 ,  H05K3/246 ,  H05K3/386 ,  H05K2201/0129 ,  H05K2201/0137 ,  H05K2201/0154 ,  H05K2201/032 ,  H05K2203/1126 ,  H05K2203/1131 ,  Y10T29/49163

Abstract: In a conductive film formed by photo sintering of a film composed of copper particulates, adhesiveness to a base material of the conductive film is improved.
A circuit board 1 includes a circuit including a conductive film 2, and a substrate 3. The circuit board 1 further includes a resin layer 4 between the substrate 3 and the conductive film 2. The substrate 3 is made of a non-thermoplastic base material 31. The resin layer 4 contains a thermoplastic resin. The conductive film 2 is formed by photo sintering of a film composed of copper particulates 21, and thus improving adhesiveness of the conductive film 2 to the base material 31 through the resin layer 4.

Abstract translation: 在通过由铜微粒构成的膜的光烧结而形成的导电膜中，与导电膜的基材的粘合性提高。 电路板1包括具有导电膜2和基板3的电路。电路板1还包括在基板3和导电膜2之间的树脂层4.基板3由非热塑性基材 树脂层4含有热塑性树脂。 导电膜2通过由铜微粒21构成的膜进行光烧结而形成，从而提高导电膜2通过树脂层4与基材31的密合性。

公开(公告)号：EP2635097A1

公开(公告)日：2013-09-04

申请号：EP12157276.2

申请日：2012-02-28

Applicant: Electrolux Home Products Corporation N.V.

Inventor： Jeanneteau, Laurent ,  Rigolle, Thibaut ,  Viroli, Alex ,  Fattorini, Andrea

IPC: H05K1/14 ,  H05K3/34 ,  H05K3/40 ,  H05K1/05

CPC classification number: H05K1/142 ,  H05K1/0306 ,  H05K1/056 ,  H05K1/14 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3421 ,  H05K3/4015 ,  H05K3/4046 ,  H05K2201/0183 ,  H05K2201/032 ,  H05K2201/041 ,  H05K2201/10295 ,  H05K2201/1034

Abstract: The present invention relates to an electric and/or electronic circuit including a printed circuit board (20), at least one separate circuit board (10) and at least one power connector (12) for said printed circuit board (20). The at least one power connector (12) is connected or connectable to a corresponding counterpart. A number of electric and/or electronic components (22) is sold at the separate circuit board (10). The at least one separate circuit board (10) is connected to the printed circuit board (20) by a number of solder joints (16). The solder joints (16) are connected to the separate circuit board (10) by a through-hole-technology. The solder joints (16) are connected to the printed circuit board (20) by SMD (surface mount device) technology. At least one power connector (12) is fastened at the separate circuit board (10) by the through-hole-technology.

Abstract translation: 本发明涉及到电气和/或电子电路，其包括印刷电路板（20），至少一个单独的电路板（10）和至少一个电源连接器（12），用于所述印刷电路板（20）。 该至少一个电源连接器（12）连接或可连接到相应的配对。 （22）一种数电气和/或电子组件中的单独的电路板（10）被出售。 所述至少一个单独的电路板（10）是由多个焊点（16）连接到印刷电路板（20）。 焊点（16）通过的通孔的技术连接到单独电路板（10）。 焊点（16）由SMD连接到印刷电路板（20）（表面安装器件）技术。 至少一个电源连接器（12）是在单独的电路板（10）通过的通孔技术夯实。