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    Clad sheet for printed circuit board, a multilayered printed circuit board using thereof and maunfacturing method thereof
    72.
    发明申请
    Clad sheet for printed circuit board, a multilayered printed circuit board using thereof and maunfacturing method thereof 失效
    用于印刷电路板的包覆片，使用其的多层印刷电路板及其制造方法

    公开(公告)号：US20020166840A1

    公开(公告)日：2002-11-14

    申请号：US10184968

    申请日：2002-07-01

    Applicant: TOYO KOHAN CO., LTD.

    Inventor： Kinji Saijo ,  Shinji Ohsawa ,  Kazuo Yoshida

    IPC: B32B003/00

    CPC classification number: H05K3/062 ,  H05K3/20 ,  H05K3/44 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/09554 ,  H05K2203/0384 ,  H05K2203/0733 ,  Y10S428/901 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/24917

    Abstract: In the present invention, which produces a clad sheet for a multilayered printed circuit board capable of being economically manufactured and having excellent performance, a multilayered printed circuit board using thereof and a manufacturing method thereof, a multilayered printed circuit board is manufactured by forming clad sheet for a multilayered printed circuit board 34 by laminating copper foil 19, 24, 33 which are to be formed into conductor layer 10, 17, 18 and nickel plating 20, 21 which are to be etching-stopper layer and simultaneously press-bonding both, producing a base by selectively etching clad sheet for a multilayered printed circuit board 34, forming outer conductor layer 15, 16 on the surface of the base and simultaneously making patterning, and electrically connecting among conductor layer 10, 15, 16 by interposing columnar conductor 17, 18 formed by etching copper foil 19, 24, 33 and nickel plating 20, 21.

    Abstract translation: 在本发明中，其制造能够经济地制造并具有优异性能的多层印刷电路板用复合板，使用其的多层印刷电路板及其制造方法，多层印刷电路板通过形成包覆层 对于多层印刷电路板34，通过将要形成导体层10,17,18和作为蚀刻停止层并同时压接两者的镍镀层20,21的铜箔19,24,33层压， 通过选择性地蚀刻用于多层印刷电路板34的包覆片来形成基底，在基底的表面上形成外部导体层15,16并同时进行构图，并且通过插入柱状导体17将导体层10,15,16电连接 18，通过蚀刻铜箔19,24,33和镀镍20,21形成。

    Etched tri-layer metal bonding layer
    74.
    发明授权
    Etched tri-layer metal bonding layer 失效
    蚀刻三层金属粘结层

    公开(公告)号：US06459041B1

    公开(公告)日：2002-10-01

    申请号：US09703815

    申请日：2000-11-01

    Applicant: Achyuta Achari ,  Lakhi Nandlal Goenka ,  Mohan R. Paruchuri

    Inventor： Achyuta Achari ,  Lakhi Nandlal Goenka ,  Mohan R. Paruchuri

    IPC: H01B708

    CPC classification number: B32B15/018 ,  B32B15/017 ,  C23C2/26 ,  C23C2/28 ,  C23C26/00 ,  H05K3/022 ,  H05K2201/0361

    Abstract: A tri-metallic material for use in the manufacture of printed circuit boards is described, and the process for its manufacture is described. The tri-metallic material is a sandwich wherein a copper layer is essential the “bread” of the sandwich and an aluminum layer is the filling between both slices of bread. A metallic bonding and/or barrier layer is spread on the aluminum and is selected for its highly non-corrosive properties as well as its bonding, and diffusion inhibiting capabilities.

    Abstract translation: 描述了用于制造印刷电路板的三金属材料，并描述了其制造方法。 三金属材料是三明治，其中铜层是夹心的“面包”是必需的，铝层是两片面包之间的填充物。 金属结合和/或阻挡层铺展在铝上，并且由于其非腐蚀性以及其粘合和扩散抑制能力而被选择。

    Method for strengthening air bridge circuits
    75.
    发明授权
    Method for strengthening air bridge circuits 失效
    加强空气桥路的方法

    公开(公告)号：US06376780B2

    公开(公告)日：2002-04-23

    申请号：US09761140

    申请日：2001-01-16

    Applicant: Lakhi Nandlal Goenka ,  Mohan R. Paruchuri

    Inventor： Lakhi Nandlal Goenka ,  Mohan R. Paruchuri

    IPC: H01R1204

    CPC classification number: H05K3/4685 ,  H05K3/062 ,  H05K3/205 ,  H05K3/386 ,  H05K2201/0361 ,  H05K2201/0394 ,  H05K2203/0369 ,  H05K2203/0376

    Abstract: A multilayer circuit board having strengthened air bridge crossover structures, and additive and subtractive methods for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit. A preferred embodiment includes air bridge structures having generally T-shaped cross-sections, which provide strengthened, mechanically robust air bridges which are especially resistant to damage from flexure and displacement due to physical impact, bending, thermal excursions, and the like.

    Abstract translation: 一种具有加强的空气桥交叉结构的多层电路板及其制造方法，其中该电路包括专门设计的金属防腐层，以机械和/或电气强化电路。 优选的实施例包括通常具有T形横截面的空气桥结构，其提供加强的机械坚固的空气桥，其特别地抵抗由于物理冲击，弯曲，热偏移等引起的挠曲和位移的损坏。

    Method for etch formation of electrical contact posts on a charge plate used for ink jet printing
    78.
    发明授权
    Method for etch formation of electrical contact posts on a charge plate used for ink jet printing 失效
    用于喷墨印刷的电荷板上的电接触柱的蚀刻形成方法

    公开(公告)号：US06274057B1

    公开(公告)日：2001-08-14

    申请号：US09251883

    申请日：1999-02-17

    Applicant: Richard W. Sexton ,  James E. Harrison, Jr.

    Inventor： Richard W. Sexton ,  James E. Harrison, Jr.

    IPC: H01B1300

    CPC classification number: B41J2/03 ,  C23F1/02 ,  H05K3/062 ,  H05K3/205 ,  H05K3/4007 ,  H05K2201/0361 ,  H05K2201/0367 ,  H05K2203/1184

    Abstract: Metallic bumps are formed for electrical interconnection between the charge plate and the charge drive electronics. This is achieved by having improved electrical connection between an ink jet charge plate and associated charge leads is promoted. First, a mask is aligned to permit plating of an etch mask on the charge plate coupon on the side opposite the charge plate circuitry, so as to place masked regions directly across the coupon from the contact pads of the charge plate circuitry. All the copper alloy charge plate coupon is then etched away except the small portions between the termination and the etch mask. The bump thus formed is used to provide a high pressure point electrical connection to the charge plate.

    Abstract translation: 金属凸点形成用于充电板和充电驱动电子器件之间的电互连。 这通过改善喷墨充电板和相关电荷引线之间的电连接来实现。 首先，将掩模对准以允许在与充电板电路相对的一侧的电荷板试剂上镀覆蚀刻掩模，以便将掩蔽的区域直接放置在来自充电板电路的接触焊盘的试样上。 然后除去终端和蚀刻掩模之间的小部分之外，所有的铜合金电荷板试片都被蚀刻掉。 这样形成的凸块用于提供与充电板的高压点电连接。

    Bond pads for fine-pitch applications on air bridge circuit boards
    79.
    发明授权
    Bond pads for fine-pitch applications on air bridge circuit boards 失效
    用于空气桥接电路板上精细间距应用的接合垫

    公开(公告)号：US6111204A

    公开(公告)日：2000-08-29

    申请号：US246864

    申请日：1999-02-08

    Applicant: Lakhi Nandlal Goenka

    Inventor： Lakhi Nandlal Goenka

    IPC: H05K1/11 ,  H05K3/06 ,  H05K3/46 ,  H05K1/09

    CPC classification number: H05K1/111 ,  H05K2201/0361 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09736 ,  H05K2201/09772 ,  H05K2201/098 ,  H05K3/062 ,  H05K3/4685 ,  Y02P70/611

    Abstract: An etched tri-metal-layer air bridge circuit board specially designed for fine-pitch applications, comprising: an electrically insulative substrate surface, a plurality of tri-metal-layer bond pads arranged in a generally straight row on the substrate surface wherein the row defines a width direction therealong, and a circuit trace arranged on the substrate surface, wherein the circuit trace runs between two adjacent ones of the plurality of tri-metal-layer bond pads. Each bond pad comprises: (1) a bottom layer attached to the substrate surface, the bottom layer being made of a first metal and having an overall width W1 as measured along the width direction; (2) a top layer disposed above and generally concentric with the bottom layer, the top layer being made of the first metal and having an overall width W2 as measured along the width direction; and (3) a middle layer made of a second metal connecting the bottom layer and the top layer. The bond pads are specially shaped such that W2>W1 for at least the two adjacent bond pads, thus enabling the circuit trace to be spaced closely to the bottom layers of the two adjacent bond pads, while allowing the top layers of the pads to be made much larger so as to avoid delamination thereof from their associated middle layers.

    Abstract translation: 专为细间距应用设计的蚀刻三金属层空气桥接电路板，包括：电绝缘基板表面，多个三基金属层接合焊盘，其布置在基板表面上的大致直线上，其中该行 限定其宽度方向和布置在基板表面上的电路迹线，其中电路迹线在多个三金属层接合焊盘中的两个相邻的三个金属层接合焊盘之间延伸。 每个接合焊盘包括：（1）附着到基板表面的底层，底层由第一金属制成，具有沿宽度方向测量的总宽度W1; （2）顶层，其设置在所述底层的上方并且与所述底层大致同心，所述顶层由所述第一金属制成，并且具有沿宽度方向测量的总宽度W2; 和（3）由连接底层和顶层的第二金属制成的中间层。 接合焊盘是特别成形的，使得W2> W1用于至少两个相邻的接合焊盘，从而使得电路迹线能够与两个相邻接合焊盘的底层紧密地间隔开，同时允许焊盘的顶层为 做得更大，以避免与其相关联的中间层分层。

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