公开(公告)号：WO2016030286A1

公开(公告)日：2016-03-03

申请号：PCT/EP2015/069217

申请日：2015-08-21

Applicant: HERAEUS DEUTSCHLAND GMBH & CO. KG

Inventor： FRITZSCHE, Sebastian ,  SCHULZE, Jürgen ,  TRODLER, Jörg

IPC: B23K35/26 ,  B23K35/30 ,  B23K35/362 ,  B23K35/02

CPC classification number: B23K35/262 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/302 ,  B23K35/362 ,  C22C9/02 ,  C22C9/04 ,  C22C13/00 ,  H01L24/27 ,  H01L24/83 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/29111 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/32245 ,  H01L2224/83801 ,  H01L2924/01015 ,  H01L2924/014 ,  H01L2924/1203 ,  H01L2924/1304 ,  H01L2924/20106 ,  H01L2924/20107 ,  H05K1/181 ,  H05K3/3484 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2201/10174

Abstract: Lotpaste, enthaltend oder bestehend aus (i) 10 –30 Gew.-% mindestens einer Art von jeweils einen Phosphoranteil von > 0 bis ≤ 500 Gewichts-ppm aufweisenden Partikeln ausgewählt aus der aus Kupferpartikeln, kupferreichen Kupfer/Zink-Legierungspartikeln und kupferreichen Kupfer/Zinn-Legierungspartikeln bestehenden Gruppe, (ii) 60 –80 Gew.-% mindestens einer Art von Partikeln ausgewählt aus der aus Zinnpartikeln, zinnreichen Zinn/Kupfer- Legierungspartikeln, zinnreichen Zinn/Silber-Legierungspartikeln und zinnreichen Zinn/Kupfer/Silber-Legierungspartikeln bestehenden Gruppe, und (iii) 3 –30 Gew.-% Flussmittel, wobei der mittlere Teilchendurchmesser der metallischen Partikel (i) und (ii) ≤ 15 µm beträgt.

Abstract translation: 焊膏，含有或由（i）的10 -30重量％的至少一种各自的> 0的磷含量的百分比由选自由铜颗粒，富铜的铜/锌合金颗粒的组中选择的具有重量的颗粒为≤500 ppm，且铜 - 富铜/ 锡合金的颗粒组，（ⅱ）60 -80重量％的至少一种选自由锡颗粒，富锡的锡/铜合金粒子，富锡现有锡/银合金粒子和富锡锡/铜/银合金粒子的选自颗粒的％ 基，和（iii）3 -30重量％的流动剂，其中所述金属颗粒的平均粒径（i）和（ii）的≤15微米。

公开(公告)号：WO2015083160A3

公开(公告)日：2015-10-08

申请号：PCT/IL2014051048

申请日：2014-12-02

Applicant: CLEARJET LTD

Inventor： GROUCHKO MICHAEL ,  MAGDASSI SHLOMO

IPC: C09D11/52 ,  C09D11/033 ,  C23C4/18 ,  C23C26/00 ,  H01G9/20 ,  H01H49/00 ,  H01L27/01 ,  H01L27/28 ,  H01L33/42 ,  H01L51/00 ,  H05K1/09 ,  H05K3/12 ,  H05K3/24 ,  H05K3/46

CPC classification number: H05K3/1208 ,  C09D11/10 ,  C09D11/322 ,  C09D11/36 ,  C09D11/52 ,  C23C24/085 ,  H01L51/0005 ,  H01L51/0007 ,  H05K1/092 ,  H05K1/095 ,  H05K1/097 ,  H05K1/16 ,  H05K3/105 ,  H05K3/12 ,  H05K3/125 ,  H05K3/1283 ,  H05K3/227 ,  H05K3/245 ,  H05K3/4685 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2201/0391 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/09681 ,  H05K2201/09736 ,  H05K2201/098 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10128 ,  H05K2201/10143 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/013 ,  H05K2203/0545 ,  H05K2203/0783 ,  H05K2203/081 ,  H05K2203/092 ,  H05K2203/095 ,  H05K2203/1105 ,  H05K2203/111 ,  H05K2203/1173 ,  H05K2203/1476 ,  H05K2203/1492 ,  H05K2203/173 ,  Y02E10/542 ,  Y02E10/549

Abstract: The invention provides a process of forming a continuous pattern on a surface composed of two or more surface regions, each of the regions being of a different surface energy, the process utilizing a novel ink formulation for printing on such multi-region surfaces.

Abstract translation: 本发明提供了一种在由两个或更多个表面区域组成的表面上形成连续图案的方法，每个区域具有不同的表面能，该方法利用新的油墨配方在这种多区域表面上印刷。

公开(公告)号：WO2015083160A2

公开(公告)日：2015-06-11

申请号：PCT/IL2014/051048

申请日：2014-12-02

Applicant: CLEARJET LTD

Inventor： GROUCHKO, Michael ,  MAGDASSI, Shlomo

IPC: C09D11/52

CPC classification number: H05K3/1208 ,  C09D11/10 ,  C09D11/322 ,  C09D11/36 ,  C09D11/52 ,  C23C24/085 ,  H01L51/0005 ,  H01L51/0007 ,  H05K1/092 ,  H05K1/095 ,  H05K1/097 ,  H05K1/16 ,  H05K3/105 ,  H05K3/12 ,  H05K3/125 ,  H05K3/1283 ,  H05K3/227 ,  H05K3/245 ,  H05K3/4685 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2201/0391 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/09681 ,  H05K2201/09736 ,  H05K2201/098 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10128 ,  H05K2201/10143 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/013 ,  H05K2203/0545 ,  H05K2203/0783 ,  H05K2203/081 ,  H05K2203/092 ,  H05K2203/095 ,  H05K2203/1105 ,  H05K2203/111 ,  H05K2203/1173 ,  H05K2203/1476 ,  H05K2203/1492 ,  H05K2203/173 ,  Y02E10/542 ,  Y02E10/549

Abstract: The invention provides a process of forming a continuous pattern on a surface composed of two or more surface regions, each of the regions being of a different surface energy, the process utilizing a novel ink formulation for printing on such multi-region surfaces.

Abstract translation: 本发明提供了在由两个或更多个表面区域组成的表面上形成连续图案的过程，每个区域具有不同的表面能量，该过程利用新型油墨配方用于印刷 这样的多区域表面。

公开(公告)号：WO2013133104A1

公开(公告)日：2013-09-12

申请号：PCT/JP2013/055144

申请日：2013-02-27

Applicant: 日産自動車株式会社

Inventor： 中山　裕介 ,  長井　純之

IPC: H02M7/48

CPC classification number: H05K1/0271 ,  H02M7/003 ,  H02M7/537 ,  H05K1/181 ,  H05K7/209 ,  H05K2201/10015 ,  H05K2201/10037 ,  H05K2201/10151 ,  H05K2201/10174 ,  H05K2201/10272

Abstract: 　パワーモジュールと、冷却器を備える基部と、第２の基板と、第１のバスバーと、第２のバスバーと、平滑コンデンサと、第１の基板と、を備え、基部の上面にパワーモジュールが載置されると共に、パワーモジュールの上方側に、第１のバスバーと、平滑コンデンサと、第１の基板と、が順に積層して備えられ、第２の基板は、基部に対して立設方向に備えられ、パワーモジュールと第１の基板とにそれぞれ固定される。

Abstract translation: 该电力转换装置具备电源模块，设置有冷却器的基座部，第二基板，第一汇流条，第二汇流条，平滑电容器以及第一基板。 功率模块被放置在基部的上表面上，并且在功率模块的上方，通过顺序层压提供第一母线，平滑电容器和第一衬底。 第二基板相对于基部沿竖直方向设置，并且固定到功率模块和第一基板。

公开(公告)号：WO99062168A1

公开(公告)日：1999-12-02

申请号：PCT/US1999/009154

申请日：1999-04-27

IPC: H02M3/00 ,  H05K1/02 ,  H05K1/18 ,  H05K7/14 ,  H02M1/12 ,  H02K5/00 ,  H02K7/02 ,  H02K7/20

CPC classification number: H05K1/181 ,  H02M3/00 ,  H05K1/0203 ,  H05K7/209 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10174 ,  H05K2203/165 ,  Y02P70/611

Abstract: Briefly, in accordance with one embodiment of the invention, a DC-to-DC converter package (120) includes: a DC-to-DC converter circuit. The components of the DC-to-DC converter circuit that perform high frequency switching during converter operation are surface mounted on a printed circuit board (PCB) so that the heat produced from the high frequency switching is approximately equally distributed at least over the portion of the PCB where the components are mounted.

Abstract translation: 简而言之，根据本发明的一个实施例，DC-DC转换器封装（120）包括：DC-DC转换器电路。 在转换器操作期间执行高频切换的DC-DC转换器电路的部件被表面安装在印刷电路板（PCB）上，使得从高频开关产生的热量至少在 安装组件的PCB。

公开(公告)号：WO99026806A1

公开(公告)日：1999-06-03

申请号：PCT/GB1998/003473

申请日：1998-11-18

IPC: H05K7/06 ,  B60L11/18 ,  B60L15/20 ,  H02J7/34 ,  H02M7/00 ,  H05K1/18 ,  H05K7/14

CPC classification number: B60L15/007 ,  B60L11/1805 ,  H02J7/345 ,  H02M7/003 ,  H05K1/18 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/1572 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/7258

Abstract: A controller, for a battery-operated vehicle or the like, comprises a plurality of mosfet/diode/capacitor circuits. A printed circuit board (PCB) has the mosfet/diode/capacitor circuits arranged in four sets, one set along each side of the board, and with the inner areas of the board on both sides and the outer area on at least one side being substantially solid tracking areas forming the connections to the circuits. The connectors (A, B+, B-) to circuits are located substantially along a diagonal of the board, with the connectors (A and B+) to the two sides of the diodes located at opposite corners of the inner areas of the board. The inner tracking areas are divided by isolating lines into separate fingers for the respective circuits. The mosfet and diode of each circuit are mounted on one side of the board and the capacitor on the other, with a heat sink bar located between the mosfet and diode with the mosfet and diode clamped to it by a nut and bolt passing through lugs on the mosfet and diode each a matching hole in the bar.

Abstract translation: 用于电池供电的车辆等的控制器包括多个mosfet /二极管/电容器电路。 印刷电路板（PCB）具有四组的MOSFET /二极管/电容器电路，一组沿着板的每一侧设置，并且板的两侧的内部区域和至少一侧的外部区域是 基本上牢固的跟踪区域形成与电路的连接。 连接器（A，B +，B-）到电路基本上沿着板的对角线定位，连接器（A和B +）连接到位于板的内部区域的相对拐角处的二极管的两侧。 内部跟踪区域通过将线分隔成用于各个电路的分离的指状物。 每个电路的mosfet和二极管安装在电路板的一侧和另一侧的电容器之间，散热片条位于MOSFET和二极管之间，MOSFET和二极管通过螺母和螺栓夹紧，通过凸耳 该mosfet和二极管每个在一个匹配的孔在酒吧。

公开(公告)号：WO98057387A1

公开(公告)日：1998-12-17

申请号：PCT/US1998/011832

申请日：1998-06-09

IPC: H01P7/08 ,  H03B1/00 ,  H03B5/02 ,  H03B5/18 ,  H05K1/14 ,  H05K1/16

CPC classification number: H05K1/165 ,  H03B5/1847 ,  H03B2201/014 ,  H05K1/141 ,  H05K1/162 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/171 ,  H05K2203/175

Abstract: A resonator (5) includes a substrate (15) to which are attached trimmable capacitance (31, 32A) and inductance (37, 38) portions which together with a varactor (7) and transistor (8) form an oscillator circuit. The resonator (5) mounts orthogonally in a slot (10) on an oscillator board (9) to reduce microphonic effects from a cover (6) that otherwise would degrade the oscillator performance.

Abstract translation: 谐振器（5）包括与可变电抗器（7）和晶体管（8）一起形成振荡器电路的可调节电容（31,32A）和电感（37,38）部分的基板（15）。 谐振器（5）正交地安装在振荡器板（9）上的槽（10）中以减少来自盖（6）的麦克风效应，否则会降低振荡器性能。

公开(公告)号：WO1991009450A1

公开(公告)日：1991-06-27

申请号：PCT/US1990006564

申请日：1990-11-08

Applicant: SUNDSTRAND CORPORATION

Inventor： SUNDSTRAND CORPORATION ,  HUSS, John ,  HOPPE, Richard, J. ,  CROWE, Lawrence, E. ,  SUTRINA, Thomas ,  LAKIN, Eric, D.

IPC: H02M01/00

CPC classification number: H05K1/0265 ,  H05K1/0203 ,  H05K1/16 ,  H05K1/167 ,  H05K3/0061 ,  H05K2201/10166 ,  H05K2201/10174

Abstract: Prior power converters have utilized discrete components mounted on circuit boards of different design. Failure of one or more of the components requires the components to be separately tested to determine which is faulty. The faulty component or the board containing same must then be replaced. This results in significant down time for the inverter and can require stocking of a large number of specialized boards. In order to overcome these problems, an inverter (22) is assembled using a series of circuit boards (80, 82, 84) of standardized type. Each circuit board includes separate layers (101, 102-136, RS1+, 280, 290, 292) which interconnect components mounted thereon together with a heat exchanger (102) which cools high power components. When a malfunction of a component occurs, the entire board may be replaced so that inverter down time is minimized. Also, the use of standardized boards reduces stocking requirements and inventory costs.

公开(公告)号：WO1987006767A1

公开(公告)日：1987-11-05

申请号：PCT/US1987000894

申请日：1987-04-22

Applicant: AMP INCORPORATED

Inventor： AMP INCORPORATED ,  WALTERS, Cecil, Kent

IPC: H01L25/08

CPC classification number: H01L24/83 ,  H01L24/33 ,  H01L24/81 ,  H01L25/074 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/1579 ,  H01L2924/30105 ,  H01L2924/3011 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3442 ,  H05K2201/10174 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199

Abstract: A surface mountable bipolar zener diode includes first and second semiconductor elements (1, 2), each of which defines a respective p-n junction (10, 11) near a respective inner face (36, 38), and each of which defines a respective metallized layer (26, 27) on a respective outer face (4, 5). The inner faces (36, 38) are soldered together such that the p-n junctions (10, 11) are disposed near the center of the assembled diode. The outer faces (26, 27) are operated parallel to one another and to the p-n junctions (10, 11) and are disposed perpendicularly to a pair of printed circuit board contacts (8, 9). Fillets (28, 29) of solder or conductive epoxy extend between the metallized layers (26, 27) and the printed circuit board contacts (8, 9) to interconnect the bipolar zener diode with the printed circuit board contacts (8, 9).

公开(公告)号：KR1020160111389A

公开(公告)日：2016-09-26

申请号：KR1020167019756

申请日：2015-01-08

Applicant: 로베르트 보쉬 게엠베하

Inventor： 샤프,울리히 ,  베르샤우어,크리스티나 ,  발,루벤 ,  쿠글러,안드레아스

IPC: H05K1/18 ,  H01L23/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10 ,  H05K3/40 ,  B29C67/00

CPC classification number: H05K1/186 ,  B29C64/00 ,  B29C70/46 ,  B29C70/68 ,  B29C70/882 ,  B81C1/00301 ,  H01L21/4867 ,  H01L21/56 ,  H01L23/4334 ,  H01L23/5389 ,  H01L24/16 ,  H01L2224/1302 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16105 ,  H01L2924/12041 ,  H05K1/0209 ,  H05K1/0272 ,  H05K1/0274 ,  H05K1/117 ,  H05K3/0035 ,  H05K3/101 ,  H05K3/403 ,  H05K3/4069 ,  H05K2201/0108 ,  H05K2201/0133 ,  H05K2201/0949 ,  H05K2201/09836 ,  H05K2201/10083 ,  H05K2201/10151 ,  H05K2201/10174 ,  H05K2201/10674 ,  H05K2201/2009 ,  H01L24/74 ,  H01L2924/00 ,  H01L2924/00014

Abstract: 본발명은전자기능부품및 전자기능부품의제조방법에관한것이다. 전자기능부품은전자부품(20)을포함하고, 상기전자부품은 3차원프린팅공정에의해기능부품내에매립된다. 3차원프린팅공정에의해전자부품을둘러싸는것 외에도기능부품의형상및 기계적특성과관련해서개별적인조정이이루어질수 있다. 또한전자부품의전기접속부들(21)은적절한형태로기능부품의표면(30a)에안내된다.