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公开(公告)号：KR1020130025310A
公开(公告)日：2013-03-11
申请号：KR1020110101418
申请日：2011-10-05
Applicant: 삼성전자주식회사
CPC classification number: A47L9/009 , A47L2201/06
Abstract: PURPOSE: A driving wheel assembly and a robot cleaner with the same are provided to reduce the size by reducing a space for pressurizing the driving wheel in a main body of the robot cleaner. CONSTITUTION: A robot cleaner comprises a main body and a driving wheel assembly. The driving wheel assembly has a driving wheel(120) which drives the main body. The driving wheel assembly comprises a housing(110), a driving motor(130), a first arm(140), a second arm, and a compression coil spring(170). The first arm is coupled with the driving motor, and the driving wheel and rotates around the rotary shaft of the driving motor. The second arm is connected to the first arm and rotates around the rotary shaft of the driving motor with the first arm. One or more compression coil springs are arranged between the housing and the second arm. When the second arm rotates, the compression coil springs pressurize the second arm in a tangential direction of a trace which is formed by the rotary shaft and the second arm.
Abstract translation: 目的：提供驱动轮组件和机器人清洁器，以通过减小用于对机器人清洁器的主体中的驱动轮进行加压的空间来减小尺寸。 构成：机器人清洁器包括主体和驱动轮组件。 驱动轮组件具有驱动主体的驱动轮（120）。 驱动轮组件包括壳体（110），驱动马达（130），第一臂（140），第二臂和压缩螺旋弹簧（170）。 第一臂与驱动马达相耦合，驱动轮绕驱动马达的旋转轴旋转。 第二臂连接到第一臂并且利用第一臂围绕驱动电动机的旋转轴旋转。 一个或多个压缩螺旋弹簧布置在壳体和第二臂之间。 当第二臂旋转时，压缩螺旋弹簧沿着由旋转轴和第二臂形成的轨迹的切线方向对第二臂加压。
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公开(公告)号：KR1020130021212A
公开(公告)日：2013-03-05
申请号：KR1020110083598
申请日：2011-08-22
Applicant: 삼성전자주식회사
CPC classification number: A47L9/2805 , A47L2201/04
Abstract: PURPOSE: A robot cleaner and a method for controlling the same are provided to control driving method or cleaning strength according to the condition or material of a floor and to prevent standstill due to obstacles. CONSTITUTION: A robot comprises a driving wheel(120) which drives a main body; and a driving wheel assembly which includes the driving wheel. A method for controlling of the robot cleaner comprises: a step of sensing a detector including the driving wheel assembly and detecting the displacement of the driving wheel with respect to a reference position; a step of determining the condition or material of the floor according to the displacement of the driving wheel; and a step of controlling the driving of the robot cleaner according to the determined condition and material of the floor. The driving wheel assembly comprises the detector sensing a sensing target. The detector detects separation distance between the detector and the sensing target. If the separation distance between the detector and the sensing target is maintained as constant, the robot cleaner moves in the area of solid floor(H/F). If the separation distance between the detector and the sensing target changes rapidly with a constant cycle, the robot cleaner moves in the area of tile.
Abstract translation: 目的：提供机器人清洁器及其控制方法，以根据地板的状况或材料来控制驱动方法或清洁强度，并防止障碍物停止。 构成：机器人包括驱动主体的驱动轮（120）; 以及包括驱动轮的驱动轮组件。 一种用于控制机器人清洁器的方法包括：感测包括所述驱动轮组件并且检测所述驱动轮相对于参考位置的位移的检测器的步骤; 根据驱动轮的位移确定地板的状态或材料的步骤; 以及根据所确定的地板的状况和材料来控制机器人清洁器的驱动的步骤。 驱动轮组件包括检测感测目标的检测器。 检测器检测检测器和检测目标之间的间隔距离。 如果检测器和感测对象之间的分离距离保持不变，机器人清洁剂将在实心地板（H / F）的区域移动。 如果检测器和感测目标之间的间隔距离以恒定周期快速变化，机器人清洁器将在瓦片区域中移动。
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公开(公告)号：KR1020120019629A
公开(公告)日：2012-03-07
申请号：KR1020100082935
申请日：2010-08-26
Applicant: 삼성전자주식회사
CPC classification number: A47L9/30 , A47L9/246 , A47L9/2805 , A47L9/2852 , A47L9/2857 , A47L9/2889 , A47L2201/00
Abstract: PURPOSE: A robot cleaner and a control method thereof are provided to inform to a user that the static electricity is radiated by generating the sound energy through a buzzer of a radiating unit. CONSTITUTION: A robot cleaner comprises a main body(10), a driving unit(20), a main brush(30), a collecting unit, a ground unit(50), and a radiating unit(60). The collecting unit collects the static electricity. The collecting unit is installed in a part of the main body where the friction with the main brush is generated. The ground unit has an electric potential difference with the collecting unit. The radiating unit radiates the collected static electricity by converting into the different type energy. The ground unit is arranged in the inner side of the robot cleaner.
Abstract translation: 目的：提供一种机器人清洁器及其控制方法，用于通过辐射单元的蜂鸣器产生声能来向用户通知静电被辐射。 构成：机器人清洁器包括主体（10），驱动单元（20），主刷（30），收集单元，接地单元（50）和辐射单元（60）。 收集单元收集静电。 收集单元安装在与主刷摩擦的主体的一部分中。 接地单元与收集单元具有电位差。 辐射单元通过转换成不同类型的能量来辐射所收集的静电。 地面单元布置在机器人清洁器的内侧。
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公开(公告)号：KR1020100093357A
公开(公告)日：2010-08-25
申请号：KR1020090012506
申请日：2009-02-16
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/16 , H01L2924/01078 , H01L2924/01079
Abstract: PURPOSE: A wafer level chip size package is provided to prevent from generating a crack by the physical impact or the thermal expansion coefficient mismatch by alleviating the stress on the solder joint part with the configuration including an air gap. CONSTITUTION: A semiconductor chip(11) comprises an electrode pad(12). A first insulation layer(15) is formed on the upper side of the semiconductor chip. A first seed metal layer(17) is formed on the exposed electrode pad and the first insulation layer. A first redistribution(23) is formed on the first seed metal layer. A second insulation layer(25) is formed on the first redistribution and on the first insulation layer.
Abstract translation: 目的：提供晶片级芯片尺寸封装，以通过减轻包含气隙的构造对焊点部件的应力来防止由于物理冲击或热膨胀系数失配而产生裂纹。 构成：半导体芯片（11）包括电极焊盘（12）。 第一绝缘层（15）形成在半导体芯片的上侧。 在暴露的电极焊盘和第一绝缘层上形成第一种子金属层（17）。 在第一种子金属层上形成第一再分布（23）。 在第一再分布上和第一绝缘层上形成第二绝缘层（25）。
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公开(公告)号：KR1020090097694A
公开(公告)日：2009-09-16
申请号：KR1020080023001
申请日：2008-03-12
Applicant: 삼성전자주식회사
CPC classification number: H01L25/0657 , H01L24/05 , H01L24/06 , H01L24/16 , H01L24/48 , H01L24/49 , H01L2224/0401 , H01L2224/04042 , H01L2224/05001 , H01L2224/0554 , H01L2224/16145 , H01L2224/16237 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48464 , H01L2224/49175 , H01L2224/731 , H01L2224/73207 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2225/06527 , H01L2225/06572 , H01L2924/00014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A semiconductor package and a multi chip package using the same are provided to stack more semiconductor chips in one package by reducing the thickness of the package and performing the connection of the minimum distance by not requiring an interposer chip. A chip pad(103) is formed on a substrate(101) including an integrated circuit. A semiconductor chip(110) includes a passivation layer(105) exposing a chip pad. A wire bonding pad(127a) is connected to the chip pad and is extended and formed on the semiconductor chip. A first rewiring layer(121) has a first solder pad for the connection of a second semiconductor chip. A second rewiring layer(131) has a second solder pad for the connection of a third semiconductor chip. The rewiring insulating layer includes an opening unit to expose the chip pad for the rewiring.
Abstract translation: 提供半导体封装和使用其的多芯片封装，以通过减小封装的厚度并通过不需要插入器芯片来执行最小距离的连接来在一个封装中堆叠更多的半导体芯片。 在包括集成电路的基板（101）上形成芯片焊盘（103）。 半导体芯片（110）包括暴露芯片焊盘的钝化层（105）。 引线接合焊盘（127a）连接到芯片焊盘并在半导体芯片上延伸和形成。 第一再布线层（121）具有用于连接第二半导体芯片的第一焊盘。 第二再布线层（131）具有用于连接第三半导体芯片的第二焊盘。 再布线绝缘层包括用于暴露芯片焊盘以用于重新布线的开口单元。
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Patent Agency Ranking
公开(公告)号：KR1020090080752A
公开(公告)日：2009-07-27
申请号：KR1020080006703
申请日：2008-01-22
Applicant: 삼성전자주식회사
CPC classification number: H01L24/91 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/73 , H01L25/0657 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05599 , H01L2224/13099 , H01L2224/16145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2225/0651 , H01L2225/06513 , H01L2225/06568 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/00
Abstract: A semiconductor package and a manufacturing method thereof are provided to perform a heterogeneous interconnection and to secure reliability inside the same die while an existing process is maintained. A semiconductor package(200) includes a substrate(201), redistribution lines(214a,214b), and a first external terminal contact pad. The substrate includes a chip pad(204). The redistribution lines are electrically connected to the chip pad. The redistribution lines include an opening part and an external terminal contact part. The first external terminal contact pad is arranged in the opening part. The first external terminal contact pad is electrically connected to the redistribution lines.
Abstract translation: 提供半导体封装及其制造方法来执行异构互连并且在保持现有处理的同时确保同一裸片内的可靠性。 半导体封装（200）包括衬底（201），再分配线（214a，214b）和第一外部端子接触焊盘。 衬底包括芯片焊盘（204）。 再分配线电连接到芯片焊盘。 再分配线包括开口部分和外部端子接触部分。 第一外部端子接触垫布置在开口部分中。 第一外部端子接触焊盘电连接到再分配线。
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公开(公告)号：KR1020090034081A
公开(公告)日：2009-04-07
申请号：KR1020070099243
申请日：2007-10-02
Applicant: 삼성전자주식회사
IPC: H01L23/12
CPC classification number: H01L24/29 , H01L21/561 , H01L23/3121 , H01L24/24 , H01L24/82 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/24145 , H01L2224/29101 , H01L2224/9202 , H01L2224/97 , H01L2225/06541 , H01L2225/06551 , H01L2225/06575 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2224/82 , H01L2924/00
Abstract: A stack-type semiconductor package apparatus and manufacturing method the same are provided to reduce the number of process the degree of difficulty of the process by using a wafer level package process. A circuit for the base chip is formed on the base chip for producing wafer(S1). The circuit for the lamination chip is formed on the lamination chip for producing wafer(S2). The lamination chip for producing wafer is cut down and individual lamination chips are made(S3). The glue is formed on the circuit for the base chip(S4). The individual lamination chip is laminated on the glue(S5). The glue is formed on the circuit of the individual lamination chip. The circuit for the circuit for the base chip and lamination chip are electrically connected with the signal transmission member(S6). The base chip having the lamination chip is made(S7).
Abstract translation: 提供了一种堆叠型半导体封装装置及其制造方法，以通过使用晶片级封装工艺来减少处理的难度。 用于制造晶片的基片（S1）上形成用于基片的电路。 用于层压芯片的电路形成在用于制造晶片的层叠芯片（S2）上。 切割用于制造晶片的层叠芯片，制造各个层叠芯片（S3）。 在基片的电路上形成胶（S4）。 单个层压芯片层压在胶水上（S5）。 在各个层叠芯片的电路上形成胶水。 用于基片和层叠芯片的电路的电路与信号传输部件电连接（S6）。 制作具有层压芯片的基片（S7）。
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公开(公告)号：KR1020080069485A
公开(公告)日：2008-07-28
申请号：KR1020070007253
申请日：2007-01-23
Applicant: 삼성전자주식회사
IPC: H01L23/12
CPC classification number: H01L24/19 , H01L23/13 , H01L24/24 , H01L24/82 , H01L2221/68377 , H01L2224/04105 , H01L2224/05001 , H01L2224/05008 , H01L2224/05026 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05548 , H01L2224/05569 , H01L2224/13144 , H01L2224/13147 , H01L2224/18 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15156 , H01L2924/15311 , H01L2924/18162 , H01L2924/18165 , H01L2924/30105 , H01L2924/3512 , H01L2224/05599
Abstract: A stack package and a stack packaging method are provided to insert a semiconductor chip in interposers and arrange the semiconductor chip and the interposers vertically for improving wiring length and wiring density. A stack package(200) comprises a semiconductor chip and interposers(100) for inserting the semiconductor chip. The semiconductor chip and the interposers are arranged vertically. The semiconductor chip includes a bonding pad(130) and a protective layer(120). The bonding pad is connected with a wire or a re-wiring pattern(150). The protective layer protects a surface of the protective chip. The bonding pad is an aluminum layer, and the protective layer is a silicon nitride layer. The interposers includes cavities and connection terminal grooves(170). Some of the connection terminal grooves are filled with a metal material to form a connection terminal(160). A solder part(180) is a solder ball or a metal bump such as copper, gold, or nickel. A module substrate(190) includes a photo solder resist layer(195) and a substrate pad(197).
Abstract translation: 提供堆叠封装和堆叠封装方法以将半导体芯片插入到插入件中，并且垂直布置半导体芯片和内插器以改善布线长度和布线密度。 堆叠封装（200）包括用于插入半导体芯片的半导体芯片和插入件（100）。 半导体芯片和内插器垂直布置。 半导体芯片包括焊盘（130）和保护层（120）。 接合焊盘与导线或再布线图案（150）连接。 保护层保护保护芯片的表面。 焊盘是铝层，保护层是氮化硅层。 插入件包括空腔和连接端子槽（170）。 一些连接端子槽被金属材料填充以形成连接端子（160）。 焊料部分（180）是焊料球或诸如铜，金或镍的金属凸块。 模块衬底（190）包括光阻抗层（195）和衬底焊盘（197）。
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公开(公告)号：KR100753528B1
公开(公告)日：2007-08-30
申请号：KR1020060000786
申请日：2006-01-04
Applicant: 삼성전자주식회사
CPC classification number: H01L25/0657 , H01L21/76898 , H01L23/481 , H01L25/50 , H01L2224/02371 , H01L2224/02372 , H01L2224/0401 , H01L2224/13025 , H01L2224/274 , H01L2225/06513 , H01L2225/06541 , H01L2924/01079 , H01L2924/01087
Abstract: 복수개를 적층 가능한 웨이퍼 레벨 패키지 및 이의 제조 방법에 관한 것이다. 웨이퍼 레벨 패키지의 제조 방법은 웨이퍼 상에 섬 형상을 갖는 예비 반도체 패키지들을 형성하고, 예비 반도체 패키지들에 형성된 패드와 전기적으로 연결되는 제1 패턴부, 예비 반도체 패키지의 측면과 나란하며 제1 패턴부와 연결되며 측면으로부터 절연된 제2 패턴부를 갖는 도전체를 형성한다. 이어서, 예비 반도체 패키지들을 웨이퍼로부터 개별화한다.
웨이퍼, 웨이퍼 레벨, 패키지, 도전체, 패턴부 -
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