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    PRINTED CIRCUIT BOARD ASSEMBLY CHIP PACKAGE COMPONENT AND SOLDERING COMPONENT
    81.
    发明申请
    PRINTED CIRCUIT BOARD ASSEMBLY CHIP PACKAGE COMPONENT AND SOLDERING COMPONENT 有权
    印刷电路板组件芯片封装组件和焊接组件

    公开(公告)号：US20120295454A1

    公开(公告)日：2012-11-22

    申请号：US13564483

    申请日：2012-08-01

    Applicant: Zhiwei Jiang ,  Xiaochen Chen ,  Zhipeng Guo

    Inventor： Zhiwei Jiang ,  Xiaochen Chen ,  Zhipeng Guo

    IPC: H01R12/51

    CPC classification number: H05K1/111 ,  H05K1/112 ,  H05K1/141 ,  H05K3/225 ,  H05K2201/09072 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09663 ,  H05K2203/042 ,  Y02P70/611

    Abstract: A printed circuit board assembly (PCBA) chip package component includes: a module board and an interface board. A first soldering pad is set on the bottom of the module board, a second soldering pad is set on top of the interface board, and the second soldering pad is of a castle-type structure. The first soldering pad includes a first soldering area, a second soldering area, and a connection bridge that connects the first soldering area and the second soldering area. The first soldering area corresponds to a top surface of the second soldering pad, and when the first soldering area is soldered to second soldering pad, the second soldering area is located outside the second soldering pad.

    Abstract translation: 印刷电路板组件（PCBA）芯片封装组件包括：模块板和接口板。 第一个焊盘设置在模块板的底部，第二个焊盘设置在接口板的顶部，第二个焊盘为城堡式结构。 第一焊盘包括第一焊接区域，第二焊接区域和连接第一焊接区域和第二焊接区域的连接桥。 第一焊接区域对应于第二焊盘的顶表面，并且当第一焊接区域焊接到第二焊盘时，第二焊接区域位于第二焊盘的外部。

    Processing image data
    82.
    发明申请
    Processing image data 失效
    处理图像数据

    公开(公告)号：US20090310155A1

    公开(公告)日：2009-12-17

    申请号：US12318961

    申请日：2009-01-13

    Applicant: Kwansoo Yun ,  Prasad Jvv ,  Jaewoo Joung ,  Shanghoon Seo ,  Sangdo Cho

    Inventor： Kwansoo Yun ,  Prasad Jvv ,  Jaewoo Joung ,  Shanghoon Seo ,  Sangdo Cho

    IPC: G06K1/00

    CPC classification number: H05K3/125 ,  H05K1/11 ,  H05K3/0005 ,  H05K3/0008 ,  H05K2201/0939

    Abstract: A method of obtaining image data for printing a circular pad having a radius R by forming ink blots having a radius r in an overlapping manner. The method can include: setting a base pitch as the base distance between adjacent ink blots, arranging the vector data of the pad in an x-y coordinate system, setting a first base point in the coordinate system, selecting a first determination point that is separated from the first base point by a unit distance along each of the x-axis and y-axis in any one direction of 45 degrees and 135 degrees, comparing the distance from the first base point to the first determination point with the base pitch, and storing the coordinates of the first determination point as print data if the distance from the first base point to the first determination point is greater than or equal to the base pitch.

    Abstract translation: 通过以重叠的方式形成具有半径r的油墨印迹，获得用于印刷具有半径R的圆形垫的图像数据的方法。 该方法可以包括：将基座间距设置为相邻墨迹之间的基本距离，将该垫的矢量数据排列在xy坐标系中，在坐标系中设置第一基点，选择与 第一基点以45度和135度的任何一个方向沿着x轴和y轴的每一个单位距离，将从第一基点到第一确定点的距离与基座间距进行比较，并且存储 如果从第一基点到第一确定点的距离大于或等于基本间距，则第一确定点的坐标作为打印数据。

    Circuit board and electronic equipment using the same
    84.
    发明申请
    Circuit board and electronic equipment using the same 有权
    电路板和电子设备使用相同

    公开(公告)号：US20020074164A1

    公开(公告)日：2002-06-20

    申请号：US09985727

    申请日：2001-11-06

    Applicant: NEC CORPORATION

    Inventor： Naomi Ishizuka ,  Akihito Matsumoto ,  Eiichi Kono ,  Motoji Suzuki ,  Akihiro Sato ,  Hiroshi Matsuoka ,  Masafumi Kanai

    IPC: H05K001/11 ,  H01R012/04

    CPC classification number: H05K3/3447 ,  H01R4/023 ,  H05K1/116 ,  H05K3/3463 ,  H05K2201/0939 ,  H05K2201/099

    Abstract: In a circuit board having lands 2 each of which has a through hole 4 through which a lead of an electrical part is inserted, the lead 3 and the land 2 being mounted in the circuit board by using lead-free solder 6, the width of the land 2 corresponding to the difference in radius between the land 2 and the through hole 4 is set to about 0.40 mm or more. The width of the land 2 is set to such a value that the land exfoliation due to the solidification/shrinkage of the lead-free solder 6 and the shrinkage of the circuit board in the thickness direction can be prevented. The circuit board 1 has circuit wires at least on both the surface and the back surface.

    Abstract translation: 在具有焊盘2的电路板中，每个焊盘2具有插入电气部件的引线的通孔4，引线3和焊盘2通过使用无铅焊料6安装在电路板中，宽度 对应于焊盘2和通孔4之间的半径差的焊盘2被设定为大约0.40mm或更大。 焊盘2的宽度被设定为可以防止由于无铅焊料6的凝固/收缩导致的焊盘剥离和电路板在厚度方向上的收缩的值。 电路板1至少在表面和背面都具有电路线。

    Printed circuit board
    85.
    发明授权
    Printed circuit board 失效
    印刷电路板

    公开(公告)号：US4164778A

    公开(公告)日：1979-08-14

    申请号：US816197

    申请日：1977-07-15

    Applicant: Hitoshi Sawairi ,  Fuminori Hirose ,  Kaoru Konishikawa

    Inventor： Hitoshi Sawairi ,  Fuminori Hirose ,  Kaoru Konishikawa

    IPC: H05K1/11 ,  H05K3/34 ,  H05K5/00

    CPC classification number: H05K1/111 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09727 ,  H05K2201/099 ,  H05K2201/10636 ,  H05K2203/042 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A printed circuit board which is an electrically insulative substrate of synthetic resin having at least one pair of spaced electroconductive layers. An electric and/or electronic component, such as resistor or capacitor, of a type which has no lead wires extending outwardly therefrom for external electric connection, but which is constituted by a substantially cubic body having its opposed area applied with respective films or foils of electroconductive material which serve as terminal electrodes, is mounted on the substrate with the terminal electrodes soldered to the respective electroconductive layers. To this end, each of the electroconductive layers has a round portion for connection with the associated terminal electrode of the component. Each round portion has an effective surface area equal to or smaller than any of the terminal electrodes.

    Abstract translation: 一种印刷电路板，其是具有至少一对隔开的导电层的合成树脂的电绝缘基板。 电气和/或电子部件，例如电阻器或电容器，其类型不具有从外部电连接向外延伸的引线，但是由基本上立方体构成，其相对面积施加有相应的膜或箔 用作端子电极的导电材料安装在基板上，端子电极焊接到相应的导电层上。 为此，每个导电层具有用于与部件的相关联的端子电极连接的圆形部分。 每个圆形部分具有等于或小于任何端子电极的有效表面积。

    ORIENTATION-INDEPENDENT DEVICE CONFIGURATION AND ASSEMBLY
    87.
    发明申请
    ORIENTATION-INDEPENDENT DEVICE CONFIGURATION AND ASSEMBLY 审中-公开
    方向独立的设备配置和组装

    公开(公告)号：WO2015047757A1

    公开(公告)日：2015-04-02

    申请号：PCT/US2014/055480

    申请日：2014-09-12

    Applicant: OSRAM SYLVANIA INC.

    Inventor： HAMBY, David W. ,  SCOTCH, Adam M. ,  VENK, Sridharan ,  LENEF, Alan

    IPC: H01L25/16 ,  H01L33/00 ,  H05K1/11 ,  H05K3/30

    CPC classification number: H01L33/62 ,  H01L24/83 ,  H01L33/38 ,  H01L2924/12041 ,  H05K1/111 ,  H05K3/303 ,  H05K2201/0939 ,  H05K2201/09809 ,  H05K2201/10106 ,  H05K2203/048 ,  H05K2203/0776 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

    Abstract: The present disclosure is directed to orientation-independent device configuration and assembly. An electronic device may comprise conductive pads arranged concentrically on a surface of the device. The conductive pads on the device may mate with conductive pads in a device location in circuitry. Example conductive pads may include at least a first circular conductive pad and a second ring-shaped conductive pad arranged to concentrically surround the first conductive pad. The concentric arrangement of the conductive pads allows for orientation-independent placement of the device in the circuitry. In particular, the conductive pads of the device will mate correctly with the conductive pads of the circuitry regardless of variability in device orientation. In one embodiment, the device may also be configured for use with fluidic self-assembly (FSA). For example, a device housing may be manufactured with pockets that cause the device to attain neutral buoyancy during manufacture.

    Abstract translation: 本公开涉及定向无关的装置配置和组装。 电子设备可以包括同心地布置在设备的表面上的导电垫。 器件上的导电焊盘可与电路中的器件位置中的导电焊盘配合。 示例性导电焊盘可以包括至少第一圆形导电焊盘和布置成同心地围绕第一导电焊盘的第二环形导电焊盘。 导电焊盘的同心布置允许器件在电路中的定向无关放置。 特别地，器件的导电焊盘将正确地与电路的导电焊盘配合，而不管器件取向如何变化。 在一个实施例中，该装置还可被配置为与流体自组装（FSA）一起使用。 例如，装置壳体可以制造成具有在制造期间使装置达到中性浮力的凹穴。

    초소형 LED 전극어셈블리 및 이의 제조방법
    89.
    发明申请
    초소형 LED 전극어셈블리 및 이의 제조방법 审中-公开
    超小型LED电极组件及其制造方法

    公开(公告)号：WO2015005655A1

    公开(公告)日：2015-01-15

    申请号：PCT/KR2014/006123

    申请日：2014-07-08

    Applicant: 피에스아이 주식회사

    Inventor： 도영락

    IPC: H01L33/62

    CPC classification number: H01L25/0753 ,  H01L33/38 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H05K1/0295 ,  H05K1/0296 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/048 ,  Y02P70/611 ,  H01L2924/00

    Abstract: 본 발명은 초소형 LED 전극어셈블리 및 이의 제조방법에 관한 것으로, 보다 상세하게는 첫째로, 독립하여 제조된 초소형 LED 소자를 불량 없이 서로 다른 두 전극에 정렬하여 연결시킴으로써 나노단위의 초소형 LED 소자를 서로 다른 전극에 직립으로 결합시키는 난점을 극복할 수 있다. 또한 LED 소자와 연결되는 전극을 동일평면상에 위치시킴으로써 결과적으로 LED 소자의 광추출 효율을 향상시킬 수 있다. 나아가 서로 다른 전극과 연결되는 초소형 LED 소자의 개수를 조절할 수 있다. 둘째로, 초소형 LED 소자가 직립하여 상, 하부 전극과 3차원 결합하지 않고 누운 상태로 동일평면상에 존재하는 서로 다른 전극에 결합함으로써 매우 우수한 광추출 효율을 가지며, LED 소자의 표면에 별도의 층을 형성하여 LED 소자와 전극 간에 단락을 방지함으로써 LED 전극어셈블리의 불량률을 최소화할 수 있으며 만일하나 발생할 수 있는 LED 소자의 불량을 대비하여 복수개의 LED 소자를 전극과 연결시킴으로써 초소형 LED 전극어셈블리 본래의 기능을 유지할 수 있다.

    Abstract translation: 本发明涉及一种超小型ELD电极组件及其制造方法，更具体地说，首先，克服了将立体位置的纳米单位超小型LED耦合到不同电极的难度 通过将独立制造的超小型LED对准并连接到两个不同的电极而不涉及缺陷。 此外，最终可以通过将要连接到LED的电极定位在相同的平坦表面上来提高LED的光提取效率。 此外，可以控制连接到不同电极的超小型LED的数量。 其次，通过将水平位置的超小型LED与同一平面上的不同电极连接，本发明具有非常优异的光提取效率，而不是将处于立体位置的超小型LED三维连接到上下 电极; 通过在LED的表面上形成附加层来防止LED和电极之间的短路，可以使LED电极组件的缺陷率最小化。 并且在偶尔有缺陷的LED的情况下，可以通过将多个LED与电极连接来维持超小型LED电极组件的原始功能。

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