Abstract:
A printed circuit board assembly (PCBA) chip package component includes: a module board and an interface board. A first soldering pad is set on the bottom of the module board, a second soldering pad is set on top of the interface board, and the second soldering pad is of a castle-type structure. The first soldering pad includes a first soldering area, a second soldering area, and a connection bridge that connects the first soldering area and the second soldering area. The first soldering area corresponds to a top surface of the second soldering pad, and when the first soldering area is soldered to second soldering pad, the second soldering area is located outside the second soldering pad.
Abstract:
A method of obtaining image data for printing a circular pad having a radius R by forming ink blots having a radius r in an overlapping manner. The method can include: setting a base pitch as the base distance between adjacent ink blots, arranging the vector data of the pad in an x-y coordinate system, setting a first base point in the coordinate system, selecting a first determination point that is separated from the first base point by a unit distance along each of the x-axis and y-axis in any one direction of 45 degrees and 135 degrees, comparing the distance from the first base point to the first determination point with the base pitch, and storing the coordinates of the first determination point as print data if the distance from the first base point to the first determination point is greater than or equal to the base pitch.
Abstract:
In a circuit board having lands 2 each of which has a through hole 4 through which a lead of an electrical part is inserted, the lead 3 and the land 2 being mounted in the circuit board by using lead-free solder 6, the width of the land 2 corresponding to the difference in radius between the land 2 and the through hole 4 is set to about 0.40 mm or more. The width of the land 2 is set to such a value that the land exfoliation due to the solidification/shrinkage of the lead-free solder 6 and the shrinkage of the circuit board in the thickness direction can be prevented. The circuit board 1 has circuit wires at least on both the surface and the back surface.
Abstract:
In a circuit board having lands 2 each of which has a through hole 4 through which a lead of an electrical part is inserted, the lead 3 and the land 2 being mounted in the circuit board by using lead-free solder 6, the width of the land 2 corresponding to the difference in radius between the land 2 and the through hole 4 is set to about 0.40 mm or more. The width of the land 2 is set to such a value that the land exfoliation due to the solidification/shrinkage of the lead-free solder 6 and the shrinkage of the circuit board in the thickness direction can be prevented. The circuit board 1 has circuit wires at least on both the surface and the back surface.
Abstract:
A printed circuit board which is an electrically insulative substrate of synthetic resin having at least one pair of spaced electroconductive layers. An electric and/or electronic component, such as resistor or capacitor, of a type which has no lead wires extending outwardly therefrom for external electric connection, but which is constituted by a substantially cubic body having its opposed area applied with respective films or foils of electroconductive material which serve as terminal electrodes, is mounted on the substrate with the terminal electrodes soldered to the respective electroconductive layers. To this end, each of the electroconductive layers has a round portion for connection with the associated terminal electrode of the component. Each round portion has an effective surface area equal to or smaller than any of the terminal electrodes.
Abstract:
The method comprises providing a semiconductor substrate (1), which has a main surface (12) and an opposite further main surface (13), arranging a contact pad (19) above the further main surface, forming a through-substrate via (4) from the main surface to the further main surface at a distance from the contact pad and, by the same method step together with the through-substrate via, forming a further through- substrate via (14) above the contact pad, arranging a hollow metal via layer (5) in the through-substrate via and, by the same method step together with the metal via layer, arranging a further metal via layer (15) in the further through- substrate via, the further metal via layer contacting the contact pad, and removing a bottom portion of the metal via layer to form an optical via laterally surrounded by the metal via layer.
Abstract:
The present disclosure is directed to orientation-independent device configuration and assembly. An electronic device may comprise conductive pads arranged concentrically on a surface of the device. The conductive pads on the device may mate with conductive pads in a device location in circuitry. Example conductive pads may include at least a first circular conductive pad and a second ring-shaped conductive pad arranged to concentrically surround the first conductive pad. The concentric arrangement of the conductive pads allows for orientation-independent placement of the device in the circuitry. In particular, the conductive pads of the device will mate correctly with the conductive pads of the circuitry regardless of variability in device orientation. In one embodiment, the device may also be configured for use with fluidic self-assembly (FSA). For example, a device housing may be manufactured with pockets that cause the device to attain neutral buoyancy during manufacture.
Abstract:
A submount for connecting a semiconductor device to an external circuit, the submount comprising: a planar substrate formed from an insulating material and having relatively narrow edge surfaces and first and second relatively large face surfaces; at least one recess formed along an edge surface; a layer of a conducting material formed on a surface of each of the at least one recess; a first plurality of soldering pads on the first face surface configured to make electrical contact with a semiconductor device; and electrically conducting connections each of which electrically connects a soldering pad in the first plurality of soldering pads to the layer of conducting material of a recess of the at least one recess.
Abstract:
본 발명은 초소형 LED 전극어셈블리 및 이의 제조방법에 관한 것으로, 보다 상세하게는 첫째로, 독립하여 제조된 초소형 LED 소자를 불량 없이 서로 다른 두 전극에 정렬하여 연결시킴으로써 나노단위의 초소형 LED 소자를 서로 다른 전극에 직립으로 결합시키는 난점을 극복할 수 있다. 또한 LED 소자와 연결되는 전극을 동일평면상에 위치시킴으로써 결과적으로 LED 소자의 광추출 효율을 향상시킬 수 있다. 나아가 서로 다른 전극과 연결되는 초소형 LED 소자의 개수를 조절할 수 있다. 둘째로, 초소형 LED 소자가 직립하여 상, 하부 전극과 3차원 결합하지 않고 누운 상태로 동일평면상에 존재하는 서로 다른 전극에 결합함으로써 매우 우수한 광추출 효율을 가지며, LED 소자의 표면에 별도의 층을 형성하여 LED 소자와 전극 간에 단락을 방지함으로써 LED 전극어셈블리의 불량률을 최소화할 수 있으며 만일하나 발생할 수 있는 LED 소자의 불량을 대비하여 복수개의 LED 소자를 전극과 연결시킴으로써 초소형 LED 전극어셈블리 본래의 기능을 유지할 수 있다.