Abstract:
The present invention is to provide a metal-core substrate without mounting large size terminals and connectors. Hence, the metal-core substrate can be smaller and thinner. A metal-core substrate includes a metal plate, an insulating layer formed on a surface of the metal plate and a circuit pattern formed on a surface of the insulating layer, wherein a part of said metal plate is exposed to outside of the insulating layer and is utilized as connector terminals. The metal plate has a heat sink plate to heat sink a heat-generating device mounted on the metal-core substrate and connector terminal plates disposed separately from the heat sink plate and utilized for the connector terminals. The heat-generating device and a driving part thereof each are disposed on a different surface of the metal-core substrate.
Abstract:
A printed wiring board includes a plurality of conductor plates that includes at least one conductor plate that is used as a lead for electrical connection with an external circuit, the conductor plates being separated spatially from one another; an insulating layer formed on or across the conductor plates or both on and across the conductor plates; and a plurality of wiring patterns formed on the insulating layer. At least one of the conductor plates is electrically connected with at least one of the wiring patterns through a via-hole.
Abstract:
In a vehicle electronic control unit, a power device and a circuit component, which structure a circuit in which current flows when the power device is driven, and a printed board are disposed within an aluminum case as a housing. Both the power device and the circuit component are disposed within a resin mold unit in a state where both the power device and the circuit component are wired so that a loop circuit is structured as a current path. Both the power device and the circuit component are mounted on the printed board by using a connection terminal which protrudes from the resin mold unit. According to the vehicle electronic control unit, noise and efficiency of the circuit can be improved because a loop of large current can be reduced.
Abstract:
An electrically conductive stripline (16) is formed on a thermally fusible sheet (10), with a portion (16a) of the stripline (16) extending adjacent to an edge (10a) of the sheet (10). A cavity (18) is formed in another thermally fusible sheet (12) having an end (18a) at an edge (12a) thereof. The sheets (10,12) are laminated together with their edges (10a,12a) aligned, and the cavity (18) aligned with and facing the edge portion (16a) of the stripline (16). A retaining pin (20) may be temporarily inserted into the cavity (18) to prevent collapse thereof during the lamination step. The laminated sheets (10,12) are heated to thermally fuse them together. An electrically conductive pin (28) is partially inserted into the cavity (18) and ohmically bonded to the stripline (18) to provide an external connection.
Abstract:
A fan control board having a central low voltage wiring center as well as a safety interlock for electric heaters. The interlock uses diodes to insure proper fan operation in the event of miswiring of the heater sequencers. Another feature is a quick connect for the time delay relay which permits easy insertion and removal thereof for replacement and/or cleaning. Diode circuits are provided in both the circuit to normally power the fan motor as well as in the circuit to power the PTC resistor which closes the fan motor circuit with the circuit which powers the PTC resistor also being connected across the fan motor circuit to provided rectified power to the fan circuit and permit the fan motor to turn on concurrently with the application of power to the PTC resistor to prevent the heater from being turned on prior to the fan. Circuitry to control each of multiple furnace heater elements is also applied via rectification circuitry to the fan motor circuitry to cause operation of the fan motor regardless of the order of operation of the heater elements of a furnace. There is also provided a quick connect and time delay relay design to allow easy insertion and removal of the relay for cleaning and/or replacement by having three spaced contacts on the housing surface of the relay with the quick connect having resilient opposed C-shaped terminal for frictionally locking one of the relay contacts therein and a pair of terminals at opposite ends thereof, at least one being resilient for contacting the other contacts on the housing.
Abstract:
There is disclosed a high density electronic connector system in which a plastic insulating body supports on one or more levels a plurality of conductive circuit traces. Output contacts to these traces are provided by small metal balls. The metal balls are driven into tight contact with respective ones of the conductive traces and captivated by the plastic body. The balls are covered with gold and provide miniature, wear resistant closely spaced output contacts in the connector system.
Abstract:
A metallic core printed circuit board having a number of lead terminals such as IC or LSI lead terminals provided on at least one edge of an electrically conductive substrate which forms a core by etching or other process. The respective terminals are electrically insulated from and secured to the core by an insulating binder, and then either conductor circuit patterns are directly formed on or a printed board wherein a printed circuit has been completed is bonded to the layer of the insulating binder. The metallic core printed circuit board makes it possible to increase a packaging density of required components, to allow easy connection to other circuit boards such as a mother board and the like, and to reduce a volume of the circuit.
Abstract:
The present invention is a method and structure which produces extremely thin, electrically conductive epoxy bonds between two substrates. Copper microspheres, having an average diameter of about 2 microns are bound in an epoxy layer which bonds two substrates together. The microspheres make electrical contact between the substrates while providing intersphere gaps which are filled with the epoxy which actually bonds the substrates together.
Abstract:
A device is disclosed for mounting, interconnecting and terminating printed circuits. The invention comprises a frame of insulating material arranged to support, position and confine two printed circuit substrates. A connector molded on one end of the frame extends input/output signals to both substrates. A handle molded on a second end of the frame includes slots through which clips are inserted electrically interconnecting the two substrates. The clips also aid in retaining both substrates to the frame.