Abstract:
양측에서 지지된 가동부(16a)를 갖는 미소 구조체의 검사 장치로서, 상기 미소 구조체가 형성된 웨이퍼(8)의 주요면이 거의 일정한 곡률 반경을 갖는 볼록 형상 또는 오목 형상이 되도록 웨이퍼(8)를 유지하는 척톱(9)을 구비한다. 또한, 웨이퍼(8)의 주요면의 형상의 곡률 반경을 변화시키는 변형 수단을 포함한다. 특히, 변형 수단은, 기판을 재치하는 척톱(9)의 상면의 형상을 온도에 따라 변형시키는 온도 제어 수단이다. 척톱(9)의 상면을 평면으로 하고, 웨이퍼(8)를 재치하는 상면이 볼록 형상 또는 오목 형상의 반송용 트레이를 웨이퍼(8)와 척톱(9)의 사이에 개재하는 구성이어도 좋다.
Abstract:
A probe card (4) being connected with a means for evaluating the characteristics of a minute structure by delivering a test sound wave to the movable portion (16a) of the minute structure formed on a wafer (8) comprises a probe (4a) connected electrically with the inspection electrode of the minute structure formed on the wafer (8) in order to detect electrical variation based on the movement of the movable portion (16a) formed on the wafer (8) during test, and at least one of a sound absorption material (11), a shield portion (18) and a horn (19) for suppressing reflection or interference of the test sound wave. A diffusion portion may be provided in place of the sound absorption material (11) or in addition to the sound absorption material (11). The inspection device of a minute structure comprises a probe card (4) having the sound absorption material (11), the shield portion (18) or the horn (19). ® KIPO & WIPO 2009
Abstract:
PURPOSE: An apparatus and method for measuring physical quantity are provided to properly measure a temperature of a glass substrate by preventing the overlap of a resistance of a first wire and a resistance of a temperature sensor. CONSTITUTION: A plurality of temperature sensors(92) are arranged in a temperature measuring point of a glass substrate(G). A dummy sensor(94) is installed near the temperature sensor. A measurement circuit is connected to a temperature sensor by a first wire(93). The dummy sensor is connected to the measurement circuit by a second wire(95). The first wire and the second wire are arranged in parallel.
Abstract:
A speaker unit (2) has a plurality of sound sources so that a sound wave is outputted from each of the sound sources. The arrival of the sound wave as a compressional wave outputted from the speaker unit (2), i.e., an air vibration moves a movable portion of a 3-axis acceleration sensor which is a minute structure of a detection chip TP. A change of the resistance value changing according to this motion is measured according to the output voltage given via a probe (4). A control unit (20) judges the characteristic of the 3-axis acceleration sensor according to the measured characteristic value, i.e., the measurement data. Moreover, an interval between a plurality of sound sources is set to a predetermined value according to a distance difference to the 3-axis acceleration sensor and a wavelength of the test sound wave, so that a test sound wave as a synthesized wave is applied to the movable portion so as to maximize a synthesized sound field of the synthesized sound wave.
Abstract:
A liquid processing device detects friction with high precision between a rotating substrate and a ring-shaped part installed in a circumferential direction of a spin chuck in the lower position of the substrate. The liquid processing device comprises a sound amplifier which is installed in the ring-shaped part to amplify contact sound generated by contact between the rotating substrate supported by the spin chuck and the ring-shaped part; a vibration sensor which senses solid propagation sound spreading in the ring-shaped part and outputs a sensing signal; and a detection unit for detecting the friction between the substrate and the ring-shaped part based on the sensing signal. It is difficult to attenuate the solid propagation sound even when a propagation length is long so that the sensing signal is transmitted to the vibration sensor accurately. Therefore, the detection with high precision can be conducted.