Substrate and method to use substrate
    2.
    发明专利
    Substrate and method to use substrate 有权
    基板和使用基板的方法

    公开(公告)号:JP2009016838A

    公开(公告)日:2009-01-22

    申请号:JP2008173127

    申请日:2008-07-02

    CPC classification number: G03F7/70925 G03F7/70341 G03F7/70916

    Abstract: PROBLEM TO BE SOLVED: To provide a method for removing contamination from a device used for lithography as an immersion liquid may be contaminated by resist separated from a substrate or the layer deposited on the substrate or particles or flakes of other materials and such contamination, and can make it difficult or impossible to correctly project a (patterned) beam of radiation on the substrate via the immersion liquid. SOLUTION: The method comprises mounting the substrate on a device, the substrate comprising a rigid support layer and a deformable layer provided on the rigid support layer, bringing the deformable layer of the substrate into contact with a surface of the device from which the contamination is removed, and introducing a relative motion between the deformable layer and the surface of the device from which the contamination is removed, thereby separating the contamination from the surface for removal, taking and removing the separated contamination. Other embodiments are described and claimed. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种从用于平版印刷的装置中去除污染物的方法作为浸没液体可能被从基底或沉积在基底上的层或其它材料的颗粒或薄片等分离的抗蚀剂污染 污染,并且可能使得难以或不可能通过浸没液体将(图案化的)辐射束正确投影到基底上。 解决方案:该方法包括将衬底安装在器件上,衬底包括刚性支撑层和设置在刚性支撑层上的可变形层,使得衬底的可变形层与器件的表面接触, 污染被去除,并且在可变形层和去除污染物的装置的表面之间引入相对运动,从而将污染物与表面分离,以除去,取出和除去分离的污染物。 描述和要求保护其他实施例。 版权所有(C)2009,JPO&INPIT

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