Abstract:
PROBLEM TO BE SOLVED: To provide a system efficiently and effectively eliminating an energy loss in lithography equipment when a relevant component is locally cooled by the evaporation of a supplied liquid, and defocus and lens aberration are caused by transformation and alteration in immersion lithography for filling a gap between a projection system and a substrate with an immersion liquid in order to increase the number of holes. SOLUTION: A timetable 34 is prepared having information on time at which the evaporation of a supplied liquid 11 is the most likely caused, the position of a substrate W, a speed, an acceleration speed and the like. The evaporation of a local area is prevented by heating at least a portion of the substrate W by using a heater according to the timetable 34 by using a liquid evaporation control device 30 or sending humidified air. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a system that efficiently and effectively eliminate energy loss in a lithographic apparatus where a related component is locally cooled by evaporation of a supplied liquid and may be deformed and change in quality to possibly cause defocusing and lens aberrations during immersion lithography in which the part between a projection system and a substrate is filled with an immersion liquid so as to increase a numerical aperture. SOLUTION: A schedule table 34 is prepared which contains information regarding time when the supplied liquid 11 is most apt to evaporate, the position, speed, acceleration, etc. of the substrate, and a liquid evaporation controller 30 heats at least part of the substrate W by a heater or sends humidifying air according to the schedule table 34 to prevent local evaporation. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a system that efficiently and effectively eliminates such energy loss in a lithographic apparatus as occurs by evaporation of a provided liquid which locally cools associated components leading to deformations and deterioration that may cause defocus and lens aberration in immersion lithography where a space between a projection system and a substrate is filled with an immersion liquid to increase the numerical aperture.SOLUTION: A timetable 34 is prepared which comprises information regarding the time and the position, the speed, the acceleration etc. of the substrate W at which evaporation of a provided liquid 11 is most likely to occur. A liquid evaporation controller 30 heats at least a part of the substrate W by a heater or sends humidified air to prevent local evaporation, according to the timetable 34.
Abstract:
PROBLEM TO BE SOLVED: To provide a method of removing contamination from an immersion hood and/or an immersion fluid in an immersion lithography device. SOLUTION: A cleaning substrate CW1 having a rigid support layer and a deformable layer provided on the rigid support layer is loaded in the device, the deformable layer 2 of the cleaning substrate CW1 is brought into contact with a surface of the device from which the contamination is removed, and a relative movement between the deformable layer 2 and the surface of the device from which the contamination is removed is introduced to remove the contamination separated from an immersion hood surface. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for removing contamination from a device used for lithography as an immersion liquid may be contaminated by resist separated from a substrate or the layer deposited on the substrate or particles or flakes of other materials and such contamination, and can make it difficult or impossible to correctly project a (patterned) beam of radiation on the substrate via the immersion liquid. SOLUTION: The method comprises mounting the substrate on a device, the substrate comprising a rigid support layer and a deformable layer provided on the rigid support layer, bringing the deformable layer of the substrate into contact with a surface of the device from which the contamination is removed, and introducing a relative motion between the deformable layer and the surface of the device from which the contamination is removed, thereby separating the contamination from the surface for removal, taking and removing the separated contamination. Other embodiments are described and claimed. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
Substrates and Methods of Using Those Substrates A method of removing contamination from an apparatus used in lithography is disclosed. The method includes loading a substrate into the apparatus, the substrate comprising a rigid support layer and a deformable layer provided on the rigid support layer, bringing the deformable layer of the substrate into contact with a surface of the apparatus from which contamination is to be removed, introducing relative movement between the deformable layer and the surface of the apparatus from which contamination is to be removed to dislodge contamination from the surface for removal, and removing the dislodged contamination. Other aspects of the invention are also described and claimed.