Abstract:
The invention relates to a method of producing a high-epsilon dielectric/ferroelectric capacitor. According to the inventive method, a structural layer (10) with a central base-layer zone (11) and a trench (13) that is filled with Si and that laterally surrounds said layer is produced. A metal layer (14) is deposited on said layer and is siliconized above the Si-filled trench (13). When the siliconized metal layer section (18) is oxidized, it migrates into the trench (13), thereby forming a base electrode (19) above the base-layer zone (11).
Abstract:
Disclosed is a method for producing semiconductor elements comprising a metal layer (10) arranged on a semiconductor substrate . The inventive method consists of the following steps: a silicon layer (30) is deposited on a metal layer (10); an etch mask is applied in order to structure the silicon layer (30); the silicon layer is selectively etched (30) using said etch mask (25); and the metal layer (10) is structured in an etching process using a selectively etched silicon layer (30) as a hard mask.
Abstract:
In a method for fabricating a high-epsilon dielectric/ferroelectric capacitor, a patterning layer with a central base layer zone and a Si-filled trench laterally surrounding the latter is produced. Above that, a metal layer is deposited and is silicided above the Si-filled trench. Through oxidation of the silicided metal layer section the latter migrates into the trench and a base electrode is formed above the base layer zone.
Abstract:
The integrated semiconductor memory configuration has a semiconductor body in which selection transistors and storage capacitors are integrated. The storage capacitors have a dielectric layer configured between two electrodes. At least the upper electrode is constructed in a layered manner with a platinum layer, that is seated on the dielectric layer, and a thicker, base metal layer lying above the platinum layer.
Abstract:
A bismuth-containing ceramic layer is produced using a bismuth precursor dissolved in a formic, acetic or propionic acid solvent. A ceramic layer is produced by (a) dissolving a bismuth precursor in a solvent of an organic acid of formula CnH2n+1COOH (n = 0, 1 or 2) and optionally water; (b) dissolving a further precursor in a further solvent and/or providing a further precursor in the liquid state; and (c) applying the precursors to a substrate and heating. Preferred Feature: The further solvent is the same organic acid or tetrahydrofuran. A strontium-bismuth tantalate layer is formed using a solution of Bi(OAc)3 and Sr(OAc)2 in acetic acid which is heated to above the melting point of a tantalum-containing precursor before mixing with the tantalum-containing precursor in the liquid state.
Abstract:
An integrated memory device or store includes write-to memory cells (MC), a first differential read-amplifier (SA;SSA) with terminals connected to a data line pair (BLL;DL) allowing relevant information to be passed over the data lines as difference signals and temporarily stored at each write-access. A switch unit (SW) connects the data lines (BLL;DL) to the first read amplifier (SA;SSA) and reverse the terminals of the data lines to the read-amplifier depending on the switching state, where the latter changes at least once during a write-access so that the write-in information from the first amplifier (SA;SSA) is initially non-inverted and then inverted in the relevant memory cell (MC).
Abstract:
Plasma etching at temperatures of above 100 deg C comprises applying a polyimide mask before the structure is etched. Preferred Features: The polyimide contains fluorine. The polyimide is formed on the wafer by crosslinking.
Abstract:
Process for producing an integrated semiconductor memory configuration, in particular one suited to the use of ferroelectric materials as storage dielectrics, in which a conductive connection between one electrode of a storage capacitor and a selection transistor is not produced until after the storage dielectric has been deposited; and a semiconductor memory configuration produced using the production process.
Abstract:
The invention relates to a semiconductor device for integrated circuits with a stack cell located in an insulating layer (2) having a plug (1) filled contact hole (8) with a capacitor with a lower electrode (5) turned towards the plug (1), a paraelectric or ferroelectric dielectric (6) and an upper electrode (7). A barrier layer (3) is located between the plug (1) and the lower electrode (5). Said layer is surrounded by a silicon nitride collar (4) preventing effective oxidation of barrier layer (3).
Abstract:
A circuit includes a sensor delivering a charge, a capacitor non-volatilely storing the charge, and a read and reset circuit reading out the stored charge. The capacitor has further connection terminals connected to the read and reset circuit and in parallel with the sensor terminals, and a ferroelectric storage dielectric intermittently connected to the sensor. The sensor can be a photodiode, a phototransistor, a Hall sensor, or a thermoelement. A switch can be connected between one of the further terminals and one of the sensor terminals. Preferably, the switch is a transistor and a drive circuit drives it. The sensor and the capacitor are formed in a semiconductor body. During a storage procedure, time periods during which the switch is on are coordinated with the sensor and/or capacitor to keep an electrical field present between the further terminals below a maximum value at which the ferroelectric dielectric saturates.