公开(公告)号：US07031164B2

公开(公告)日：2006-04-18

申请号：US10636623

申请日：2003-08-08

Applicant: Atsushi Yamaguchi

Inventor： Atsushi Yamaguchi

IPC: H05K7/20

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K2201/062 ,  H05K2201/093 ,  H05K2201/0969 ,  H05K2201/09781 ,  H01L2924/00

Abstract: An electronic circuit device including a heat-generating element is mounted on a circuit board composed of three laminated layers: a heat-receiving layer on which the heat-generating element is mounted, an insulating layer, and a heat-dissipating layer. The heat-receiving layer is connected to the heat-dissipating layer through heat-conductive passages formed in the insulating layer. The heat generated in the heat-generating element is transferred to the heat-dissipating layer through the heat-conductive passages, and the heat is efficiently dissipated on both the heat-receiving layer and the heat-dissipating layer.

Abstract translation: 包括发热元件的电子电路装置安装在由三个层压层组成的电路板上：安装有发热元件的热​​接收层，绝缘层和散热层。 热接收层通过形成在绝缘层中的导热通道连接到散热层。 在发热元件中产生的热量通过导热通道传递到散热层，并且热量在热接收层和散热层两者上被有效地消散。

公开(公告)号：US20060049515A1

公开(公告)日：2006-03-09

申请号：US11211893

申请日：2005-08-25

Applicant: Peter Poechmueller

Inventor： Peter Poechmueller

IPC: H01L23/34 ,  H01L23/02

CPC classification number: G11C5/04 ,  G11C5/143 ,  H05K1/0201 ,  H05K1/181 ,  H05K2201/062 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/09972

Abstract: The invention relates to a memory module having a printed circuit board; having one or more memory chips which are arranged in a first region of the printed circuit board and are contact-connected by the printed circuit board; having a buffer chip for driving the memory chips and for communicating with a system that is external to the memory module, the buffer chip being arranged in a second region of the printed circuit board and being contact-connected by the printed circuit board; wherein the first and second regions of the printed circuit board are essentially thermally decoupled from one another.

Abstract translation: 本发明涉及一种具有印刷电路板的存储模块; 具有布置在印刷电路板的第一区域中并通过印刷电路板接触连接的一个或多个存储器芯片; 具有用于驱动存储芯片并用于与存储器模块外部的系统进行通信的缓冲芯片，缓冲芯片布置在印刷电路板的第二区域中并通过印刷电路板接触连接; 其中印刷电路板的第一和第二区域基本上彼此热分离。

公开(公告)号：US06880970B2

公开(公告)日：2005-04-19

申请号：US10453752

申请日：2003-06-03

Applicant: Russell N. Mirov

Inventor： Russell N. Mirov

IPC: G01K1/20 ,  H05K1/02 ,  G01K1/00

CPC classification number: H05K1/0201 ,  G01K1/20 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/10151

Abstract: A method and apparatus for thermally isolating a temperature sensor mounted on a printed circuit board from a heat generating component mounted on the printed circuit board is provided. Generally, a thermal isolation region, which may be comprised of a plurality of openings in the printed circuit board, is disposed about the temperature sensor to interrupt conductive transfer of heat from the heat generating component to the temperature sensor. The openings extend sufficiently far into the printed circuit board to remove at least a portion of a conductive layer, such as a power plane from the region surrounding the temperature sensor. Electrical power and signals may be provided to the temperature sensor through regions intermediate the openings.

Abstract translation: 提供了一种用于将安装在印刷电路板上的温度传感器与安装在印刷电路板上的发热部件进行热隔离的方法和装置。 通常，可以在印刷电路板中由多个开口组成的热隔离区域设置在温度传感器周围，以中断热量从发热部件到温度传感器的传导传递。 这些开口足够远地延伸到印刷电路板中以从包围温度传感器的区域移除至少一部分导电层，例如电源平面。 可以通过开口之间的区域向温度传感器提供电力和信号。

公开(公告)号：US20040055782A1

公开(公告)日：2004-03-25

申请号：US10664353

申请日：2003-09-17

Applicant: Alps Electric Co., Ltd.

Inventor： Yukimasa Yamamoto

IPC: H05K001/00

CPC classification number: H05K3/3442 ,  H05K1/0201 ,  H05K1/141 ,  H05K3/28 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/062 ,  H05K2201/09181 ,  H05K2201/09263 ,  H05K2201/09909 ,  Y02P70/613

Abstract: The present invention provides a surface-mounting type electronic circuit unit having no melting of solder attaching an electric part thereto and having high reliability. Therefore, the surface-mounting type electronic circuit unit of the present invention has a side electrode arranged on a side face; a circuit substrate having a wiring pattern arranged on an upper face in a state connected to this side electrode; and an electric part connected to the wiring pattern by soldering. A connecting conductor of the wiring pattern connecting the electric part arranged in a position very near the side electrode is formed in a bent state. Therefore, the connecting conductor between the side electrode and the electric part can be lengthened. Accordingly, solder heat due to the soldering of an electrically conductive pattern and the side electrode and the heat of a flux fall on the electric part side, and an influence on the solder attaching the electric part thereto is small so that this solder is not melted and the surface-mounting type electronic circuit unit of high reliability is obtained.

Abstract translation: 本发明提供一种表面安装型电子电路单元，其不具有附着电气部件的焊料的熔化并且具有高可靠性。 因此，本发明的表面安装型电子电路单元具有配置在侧面的侧面电极， 电路基板，其具有布置在与该侧电极连接的状态的上表面上的布线图案; 以及通过焊接连接到布线图案的电气部件。 连接布置在非常靠近侧面电极的位置的电气部件的布线图案的连接导体形成为弯曲状态。 因此，可以延长侧电极和电气部件之间的连接导体。 因此，由于导电图案和侧面电极的焊接以及焊剂的热量引起的焊料热量落在电气部分侧，并且对附着电气部件的焊料的影响小，使得该焊料不熔化 并且获得了高可靠性的表面安装型电子电路单元。

公开(公告)号：US06591495B2

公开(公告)日：2003-07-15

申请号：US09797916

申请日：2001-03-05

Applicant: Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H05K302

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin by a laser beam so that a via hole is formed. Copper foil, the thickness of which is reduced to 3 &mgr;m by etching to lower the thermal conductivity, is used as a conformal mask. Therefore, an opening is formed in the resin and the number of irradiation of pulse-shape laser beam is reduced. Thus, occurence of undercut of the resin, which forms an interlayer insulating resin layer, can be prevented and the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂中形成开口，从而形成通孔。 铜箔的厚度通过蚀刻减少到3μm，以降低导热率，被用作保形掩模。 因此，在树脂中形成开口，并且脉冲形状的激光束的照射次数减少。 因此，可以防止形成层间绝缘树脂层的树脂的底切的发生，并且可以提高通孔的连接的可靠性。

公开(公告)号：US20030128532A1

公开(公告)日：2003-07-10

申请号：US10338720

申请日：2003-01-09

Inventor： Junichi Somei

IPC: H05K007/02

CPC classification number: H05K1/0201 ,  H01Q1/247 ,  H01Q1/38 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/0271 ,  H05K1/116 ,  H05K3/42 ,  H05K3/4688 ,  H05K2201/062 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09681 ,  H05K2201/09718

Abstract: A printed circuit board has a substrate formed of an insulator, a strip line provided on a front surface of the substrate, and a ground metal layer provided on a rear surface of the substrate. An opening is provided in the ground metal layer to reach the substrate. A radio wave receiving converter and an antenna device each include the printed circuit board.

Abstract translation: 印刷电路板具有由绝缘体形成的基板，设置在基板的前表面上的带状线和设置在基板的后表面上的接地金属层。 在接地金属层中设置开口以到达基板。 无线电波接收转换器和天线装置各自包括印刷电路板。

公开(公告)号：US20030102151A1

公开(公告)日：2003-06-05

申请号：US10334062

申请日：2002-12-31

Inventor： Naohiro Hirose ,  Honjin En

IPC: H05K001/09

CPC classification number: H01L29/40 ,  H01L21/4763 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/03 ,  H05K3/064 ,  H05K3/244 ,  H05K3/382 ,  H05K3/403 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/062 ,  H05K2201/093 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09645 ,  H05K2201/09681 ,  H05K2203/1178

Abstract: Mesh holes 35a and 59a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50 are not lowered. Here, the diameter of each mesh hole is preferably 75 to 300 nullm. The reason is as follows. If the diameter of the mesh hole is less than 75 nullm, it is difficult to overlay the upper and lower mesh holes on one another. If the diameter exceeds 300 nullm, the insulating properties of the interlayer resin insulating layers deteriorate. In addition, the distance between the mesh holes is preferably 100 to 2000 nullm. The reason is as follows. If the distance is less than 100 nullm, the solid layer cannot function. If the distance exceeds 2000 nullm, the deterioration of the insulating properties of the interlayer resin insulating film occurs.

公开(公告)号：US20030006061A1

公开(公告)日：2003-01-09

申请号：US09885614

申请日：2001-06-20

Applicant: International Business Machines Corporation

Inventor： Mark R. Brinthaupt III ,  Lisa J. Jimarez ,  William F. Wildey

IPC: H05K001/03

CPC classification number: H05K1/116 ,  H05K1/0201 ,  H05K3/3415 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/0969 ,  H05K2201/10189 ,  H05K2201/10659

Abstract: A multi-layer circuit board is disclosed. The circuit board comprises a plurality of conductive planes; a plurality of plated through hole sets, each set comprising one or more plated through holes, none to all of the plated through holes of each set contacting at least one the conductive plane; a thermal break formed around each plated through hole in each conductive plane to which the plated through hole is connected; and one or more thermal vents, in the vicinity of each plated through hole in each conductive plane to which the plated through hole is connected. Additionally, surface mount technology pads are provided on a top surface of the circuit board.

Abstract translation: 公开了一种多层电路板。 电路板包括多个导电平面; 多个电镀通孔组，每组包括一个或多个电镀通孔，每组的电镀通孔中的至少一个接触至少一个导电平面; 在连接有电镀通孔的每个导电平面中的每个电镀通孔周围形成热断裂; 以及一个或多个热通风口，在每个电镀通孔附近，电镀通孔所连接的每个导电平面中。 此外，表面贴装技术垫设置在电路板的顶表面上。

公开(公告)号：US06469248B1

公开(公告)日：2002-10-22

申请号：US09581620

申请日：2000-08-23

Applicant: Karl Rehnelt ,  Frank Templin ,  Ingo Skuras

Inventor： Karl Rehnelt ,  Frank Templin ,  Ingo Skuras

IPC: H05K720

CPC classification number: H05K3/366 ,  H01L23/36 ,  H01L23/49811 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K3/3421 ,  H05K2201/062 ,  H05K2201/10386 ,  H01L2924/00

Abstract: A hybrid circuit with a heat dissipation system includes a terminal arrangement wherein at least one of the connecting pins (5) to solder the hybrid circuit (1) on a printed board has a heat transition resistance to the hybrid circuit (1), which is greater in relation to the other connecting pins (2) in such a way that the connecting pin (5) does not reach the melting temperature of the solder used at a given power level.

Abstract translation: 具有散热系统的混合电路包括端子装置，其中在印刷电路板上焊接混合电路（1）的连接引脚（5）中的至少一个具有对混合电路（1）的耐热转变性，即， 相对于其他连接销（2）的连接销（5）的连接销（5）不会达到在给定功率水平下使用的焊料的熔化温度。

公开(公告)号：US20020149074A1

公开(公告)日：2002-10-17

申请号：US09901480

申请日：2001-07-09

Inventor： Chiaki Imaeda

IPC: H01L031/0232

CPC classification number: H05K3/363 ,  G02F1/1333 ,  G02F1/13452 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/3463 ,  H05K3/3494 ,  H05K3/4084 ,  H05K2201/0394 ,  H05K2201/062 ,  H05K2201/10477 ,  H05K2201/10681 ,  H05K2203/0195

Abstract: A liquid crystal device 100 includes a liquid crystal panel 110, a plastic frame 120 arranged to overlap with the liquid crystal panel 110, a light diffusing layer 130 arranged to overlap with the frame 120, a flexible wiring substrate 140 mounted on the liquid crystal panel 110, and a circuit wiring substrate 150 arranged to be connected to the flexible wiring substrate 140 and overlap with the light diffusing layer 130. The light diffusing layer 130 is made of a material having good heat insulating property to prevent thermal deformation or thermal deterioration of the frame due to the heat produced during connection of the flexible wiring substrate 140 and the circuit wiring substrate 150

Abstract translation: 液晶装置100包括液晶面板110，与液晶面板110重叠配置的塑料框架120，与框架120重叠配置的光漫射层130，安装在液晶面板上的柔性布线基板140 110以及布置成连接到柔性布线基板140并与光漫射层130重叠的电路布线基板150.光漫射层130由具有良好隔热性的材料制成，以防止热变形或热劣化 由于在柔性布线基板140和电路布线基板150的连接期间产生的热量引起的框架