公开(公告)号：US20170117670A1

公开(公告)日：2017-04-27

申请号：US15398793

申请日：2017-01-05

Applicant: CommScope, Inc of North Carolina

Inventor： Richard A. Schumacher ,  Amid I. Hashim ,  Brian J. Fitzpatrick ,  Bryan S. Moffitt ,  Wayne D. Larsen

IPC: H01R13/6469 ,  H01R24/28 ,  H01R12/53 ,  H01R24/64 ,  H01R13/6466

CPC classification number: H01R13/6469 ,  H01R12/53 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6658 ,  H01R23/005 ,  H01R24/28 ,  H01R24/64 ,  H01R2107/00 ,  H01R2201/04 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/117 ,  H05K1/162 ,  H05K2201/09181 ,  H05K2201/0949 ,  H05K2201/1034 ,  H05K2201/10356

Abstract: Patch cords are provided that include a communications cable that has at least first through fourth conductors and a plug that is attached to the cable. The plug includes a housing that receives the cable, a printed circuit board, first through fourth plug contacts, and first through fourth conductive paths that connect the first through fourth conductors to the respective first through fourth plug contacts. The first and second conductors, conductive paths, and plug contacts form a first differential transmission line, and the third and fourth conductors, conductive paths, and plug contacts form a second differential transmission line. Each of the first through fourth plug contacts has a first segment that extends longitudinally along a first surface of the printed circuit board, and the signal current injection point into the first segment of at least some of the first through fourth plug contacts is into middle portions of their respective first segments.

公开(公告)号：US09572294B2

公开(公告)日：2017-02-14

申请号：US13882952

申请日：2011-10-12

Applicant: Nobuhisa Onai ,  Masami Motegi

Inventor： Nobuhisa Onai ,  Masami Motegi

IPC: H05K13/04 ,  H05K1/02 ,  H01L21/56 ,  H01L23/14 ,  H01L23/31 ,  H01L23/36 ,  H01L23/433 ,  H01L23/00 ,  H01L25/00 ,  H05K3/34 ,  H01L25/18

CPC classification number: H05K13/0465 ,  H01L21/563 ,  H01L23/142 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/4334 ,  H01L24/27 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0298 ,  H05K3/341 ,  H05K3/3484 ,  H05K2201/10166 ,  H05K2201/1034 ,  H05K2201/10969 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/1476 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/2076

Abstract: Provided are: a circuit device which has improved connection reliability in a solder joint portion by suppressing the occurrence of sink of solder; and a method for manufacturing the circuit device. In a method for manufacturing a circuit device of the present invention, a plurality of solders (19), which are apart from each other, are firstly formed on the upper surface of a pad (18A), and a chip component (14B) and a transistor (14C) are affixed at the same time. After that, a solder paste (31) is supplied to the upper surface of the pad (18A) using a syringe (30), a heatsink (14D) is mounted on top of the solder paste (31), and melting is caused by a reflow process. There is little risk of sinking of the solders (19) in the present invention since the solders (19) are discretely arranged on the upper surface of the pad (18A).

Abstract translation: 提供：通过抑制焊料凹陷的发生，提高焊接部的连接可靠性的电路装置; 以及电路装置的制造方法。 在本发明的电路装置的制造方法中，首先在焊盘（18A）的上表面上形成有彼此分离的多个焊料（19），芯片部件（14B）和 同时固定晶体管（14C）。 之后，使用注射器（30）将焊膏（31）供给到焊盘（18A）的上表面，将散热器（14D）安装在焊膏（31）的顶部，并且由 回流过程。 由于焊料（19）离散地布置在焊盘（18A）的上表面上，所以本发明中焊料（19）的沉没风险很小。

公开(公告)号：US20170040762A1

公开(公告)日：2017-02-09

申请号：US15333228

申请日：2016-10-25

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher ,  Scott Lynn Michaelis

IPC: H01R24/64 ,  H01R13/6466 ,  H05K1/11 ,  H01R13/66 ,  H01R24/28 ,  H01R12/53 ,  H01R13/6469

CPC classification number: H01R24/64 ,  H01R12/53 ,  H01R13/6466 ,  H01R13/6469 ,  H01R13/665 ,  H01R13/6658 ,  H01R23/005 ,  H01R24/28 ,  H01R2107/00 ,  H01R2201/04 ,  H05K1/0245 ,  H05K1/115 ,  H05K1/117 ,  H05K2201/04 ,  H05K2201/0949 ,  H05K2201/09845 ,  H05K2201/1034 ,  H05K2201/10356 ,  Y10T29/49124

Abstract: Communications plugs are provided which include a printed circuit board having a plurality of elongated conductive traces and a plurality of plug blades. Each plug blade has a first section that extends along a top surface of the printed circuit board and a second section that extends along a front edge of the printed circuit board. Additionally, each plug blade may have a thickness that is at least twice the thickness of the elongated conductive traces. The plug blades may be low profile plug blades that are manufactured separately from the printed circuit board.

Abstract translation: 提供了通信插头，其包括具有多个细长导电迹线和多个插头片的印刷电路板。 每个插头片具有沿着印刷电路板的顶表面延伸的第一部分和沿着印刷电路板的前边缘延伸的第二部分。 此外，每个插头刀片可以具有至少是细长导电迹线的厚度的两倍的厚度。 插头片可以是与印刷电路板分开制造的低剖面插头片。

公开(公告)号：US20170025319A1

公开(公告)日：2017-01-26

申请号：US15148144

申请日：2016-05-06

Applicant: Infineon Technologies Americas Corp.

Inventor： Wayne Partington

IPC: H01L23/057 ,  H01L23/00 ,  H01L25/07 ,  H01L23/498 ,  H01L25/065 ,  H01L23/24 ,  H01L23/367

CPC classification number: H01L23/057 ,  H01L23/24 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/49838 ,  H01L23/562 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/162 ,  H01L25/18 ,  H05K1/0216 ,  H05K1/117 ,  H05K2201/10295 ,  H05K2201/1034 ,  H05K2201/10371 ,  H05K2201/10424

Abstract: A semiconductor package includes a suspended substrate having one or more semiconductor devices thereon, a metallic case covering the suspended substrate, the suspended substrate being supported by a plurality of mechanical leads on opposing sides of the semiconductor package, at least one of the plurality of mechanical leads having a coefficient of thermal expansion (CTE) that substantially matches a CTE of the suspended substrate, where at least one of the plurality of mechanical leads is electrically connected to the suspended substrate, and where the plurality of mechanical leads absorb mechanical shocks so as to prevent damage to the semiconductor package. The semiconductor package also includes a thermal gel between the suspended substrate and the metallic case. The suspended substrate can be a printed circuit board. The metallic case includes mounting ears for transferring heat away from the semiconductor package.

Abstract translation: 半导体封装包括其上具有一个或多个半导体器件的悬置衬底，覆盖悬置衬底的金属壳体，悬置衬底由半导体封装相对侧上的多个机械引线支撑，多个机械 具有基本上与悬浮基板的CTE匹配的热膨胀系数（CTE）的引线，其中多个机械引线中的至少一个电连接到悬置的基板，并且其中多个机械引线吸收机械冲击，以便 以防止损坏半导体封装。 半导体封装还包括在悬置基板和金属外壳之间的热凝胶。 悬挂的基板可以是印刷电路板。 金属外壳包括用于将热量从半导体封装传递的安装耳。

公开(公告)号：US09538656B2

公开(公告)日：2017-01-03

申请号：US14364085

申请日：2013-01-25

Applicant: Electrolux Home Products Corporation N.V.

Inventor： Laurent Jeanneteau ,  Thibaut Rigolle ,  Alex Viroli ,  Andrea Fattorini

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/03 ,  H05K1/18 ,  H05K1/05 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K1/142 ,  H05K1/0306 ,  H05K1/056 ,  H05K1/14 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3421 ,  H05K3/4015 ,  H05K3/4046 ,  H05K2201/0183 ,  H05K2201/032 ,  H05K2201/041 ,  H05K2201/10295 ,  H05K2201/1034

Abstract: The present invention relates to an electric and/or electronic circuit including a printed circuit board (20), at least one separate circuit board (10) and at least one power connector (12) for said printed circuit board (20). The at least one power connector (12) is connected or connectable to a corresponding counterpart. A number of electric and/or electronic components (22) is sold at the separate circuit board (10). The at least one separate circuit board (10) is connected to the printed circuit board (20) by a number of solder joints (16). The solder joints (16) are connected to the separate circuit board (10) by a through-hole-technology. The solder joints (16) are connected to the printed circuit board (20) by SMD (surface mount device) technology. At least one power connector (12) is fastened at the separate circuit board (10) by the through-hole-technology.

Abstract translation: 本发明涉及包括印刷电路板（20），至少一个单独的电路板（10）和用于所述印刷电路板（20）的至少一个电力连接器（12）的电气和/或电子电路。 所述至少一个电源连接器（12）被连接或连接到相应的对应物。 在单独的电路板（10）处销售许多电和/或电子部件（22）。 所述至少一个单独的电路板（10）通过多个焊点（16）连接到所述印刷电路板（20）。 焊点（16）通过通孔技术连接到单独的电路板（10）。 焊接接头（16）通过SMD（表面安装器件）技术连接到印刷电路板（20）。 至少一个电源连接器（12）通过通孔技术紧固在单独的电路板（10）处。

公开(公告)号：US20160344128A1

公开(公告)日：2016-11-24

申请号：US15160773

申请日：2016-05-20

Applicant: Uber Technologies, Inc.

Inventor： Tyler Jon Back ,  Irving M.D. Hu ,  Adrian Timothy Fox ,  James Matthew Collins

IPC: H01R13/24 ,  H01R12/71 ,  H01R13/62 ,  H05K1/11

CPC classification number: H05K1/11 ,  H01R12/718 ,  H01R13/2442 ,  H01R13/4538 ,  H01R13/6205 ,  H01R2107/00 ,  H05K1/117 ,  H05K2201/10151 ,  H05K2201/1034

Abstract: A device is described having a body and a connector assembly. The connector assembly is positioned at one end of the body and includes a set of contacts and a cover having a façade. The cover also has a set of openings to enable at least a portion of the set of contacts to be exposed on the façade. The cover is at least partially moveable inwards towards the set of contacts when force is applied to the façade.

Abstract translation: 描述了一种具有主体和连接器组件的装置。 连接器组件位于主体的一端，并且包括一组触点和具有外墙的盖。 盖子还具有一组开口，以使该组触点的至少一部分露出在外墙上。 当向外墙施加力时，该盖至少部分地朝向该组触点向内移动。

公开(公告)号：US09465467B2

公开(公告)日：2016-10-11

申请号：US14564335

申请日：2014-12-09

Applicant: LG Display Co., Ltd.

Inventor： Sunghoon Lee

IPC: G06F3/041 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: G06F3/041 ,  G06F3/044 ,  G06F2203/04102 ,  H05K1/0281 ,  H05K1/118 ,  H05K1/148 ,  H05K3/361 ,  H05K2201/052 ,  H05K2201/058 ,  H05K2201/09781 ,  H05K2201/1034 ,  H05K2201/10356 ,  H05K2201/2009

Abstract: A flexible printed circuit board having enhanced peeling force and a touch panel including the same are provided. The flexible printed circuit board (FPCB) includes a first bonding portion and a second bonding portion respectively bonded to a first circuit unit and a second circuit unit. The first bonding portion includes a pad corresponding portion corresponding to pads of the first circuit unit and dummy portions outwardly extending from both end portions of the pad corresponding portion. An FPCB wiring formation portion includes FPCB wirings respectively connected to the pads and extending from the first bonding portion to the second bonding portion and concave portions respectively disposed to be adjacent to the dummy portions and having a curved surface.

Abstract translation: 提供了具有增强的剥离力的柔性印刷电路板和包括其的触摸面板。 柔性印刷电路板（FPCB）包括分别接合到第一电路单元和第二电路单元的第一接合部分和第二接合部分。 第一接合部分包括对应于第一电路单元的焊盘的焊盘对应部分和从焊盘对应部分的两个端部向外延伸的虚拟部分。 FPCB布线形成部分包括分别连接到焊盘并且从第一接合部分延伸到第二接合部分的FPCB布线和分别设置成与虚设部分相邻并且具有弯曲表面的凹部。

公开(公告)号：US20160268740A1

公开(公告)日：2016-09-15

申请号：US15162875

申请日：2016-05-24

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher

IPC: H01R13/6477 ,  H01R4/02 ,  H01R24/64

CPC classification number: H01R13/6477 ,  H01R4/023 ,  H01R13/6461 ,  H01R13/6464 ,  H01R13/6469 ,  H01R24/64 ,  H01R2201/04 ,  H05K1/0228 ,  H05K1/024 ,  H05K1/025 ,  H05K1/0298 ,  H05K1/165 ,  H05K3/10 ,  H05K3/403 ,  H05K2201/0187 ,  H05K2201/09163 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/1034 ,  Y02P70/611 ,  Y10T29/49155

Abstract: Printed circuit boards for communications connectors are provided that include a dielectric substrate formed of a first insulative material having a first dielectric constant. First and second pairs of input terminals and first and second pairs of output terminals are provided on the dielectric substrate. A first differential transmission line electrically connect the first pair of input terminals to the first pair of output terminals, and a second differential transmission line electrically connect the second pair of input terminals to the second pair of output terminals. The dielectric substrate includes an opening that is positioned between the conductive paths of the first differential transmission line, the opening containing a second insulative material having a second dielectric constant.

公开(公告)号：US20150357733A1

公开(公告)日：2015-12-10

申请号：US14300855

申请日：2014-06-10

Applicant: Apple Inc.

Inventor： Emery A. Sanford ,  Tyson B. Manullang ,  David G. Havskjold ,  Tyler S. Bushnell ,  Eric S. Jol ,  Anthony S. Montevirgen ,  John Raff

IPC: H01R12/61

CPC classification number: H01R12/62 ,  H01R12/52 ,  H05K1/14 ,  H05K1/142 ,  H05K1/147 ,  H05K1/148 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/10325 ,  H05K2201/1034 ,  H05K2201/10681

Abstract: An electrical board-to-board connector including a flexible cable assembly having a low profile or dimensionally reduced configuration. The connector body of a cable assembly may be widened to provide the structural rigidity sufficient to support an array of solder lead connections. Other support elements may be omitted from the cable assembly, which results in a reduced height dimension. The flexible cable assembly may also include a cowling used to retain the cable assembly against a circuit board. The cowling may also be configured to reduce the dimensions or dimensional footprint of the connection.

Abstract translation: 一种电路板对板连接器，包括具有低轮廓或尺寸减小的构造的柔性电缆组件。 电缆组件的连接器主体可以被加宽以提供足以支持焊锡引线连接阵列的结构刚度。 可以从电缆组件中省略其它支撑元件，这导致减小的高度尺寸。 柔性电缆组件还可以包括用于将电缆组件保持抵靠电路板的整流罩。 整流罩也可以被配置成减小连接的尺寸或尺寸。

公开(公告)号：US09209569B2

公开(公告)日：2015-12-08

申请号：US14090073

申请日：2013-11-26

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher

IPC: H01P5/02 ,  H01R13/6473 ,  H01R13/6461 ,  H01R13/6466 ,  H01R24/64 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01R13/6473 ,  H01R13/6461 ,  H01R13/6466 ,  H01R24/64 ,  H05K1/0219 ,  H05K1/0228 ,  H05K1/024 ,  H05K1/0245 ,  H05K1/117 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/09672 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/1034 ,  H05K2201/10356

Abstract: Communications plugs are provided that include a housing that receives the conductors of the communication cable. A printed circuit board is mounted at least partially within the housing. A plurality of plug contacts are on the printed circuit board, and the printed circuit board includes a plurality of conductive paths that electrically connect respective ones of the conductors to respective ones of the plug contacts. First and second of the conductive paths are arranged as a first differential pair of conductive paths that comprise a portion of a first differential transmission line through the communications plug, where the first differential transmission line includes a first transition region where the impedance of the first differential transmission line changes by at least 20% and a second transition region impedance of the first differential transmission line changes by at least 20%.

Abstract translation: 提供通信插头，其包括容纳通信电缆的导体的壳体。 印刷电路板至少部分地安装在壳体内。 多个插头触点位于印刷电路板上，并且印刷电路板包括多个导电路径，其将相应的导体电连接到相应的插头触点。 第一和第二导电路径被布置为包括通过通信插头的第一差分传输线的一部分的导电路径的第一差分对，其中第一差分传输线包括第一过渡区，其中第一差分 传输线改变至少20％，第一差分传输线的第二过渡区阻抗改变至少20％。