公开(公告)号：US20240040702A1

公开(公告)日：2024-02-01

申请号：US18268364

申请日：2021-09-30

Applicant: HITACHI,ASTEMO, LTD.

Inventor： Takeshi TOKUYAMA ,  Takahiro ARAKI ,  Shigehise AOYAGI

IPC: H05K1/18 ,  H01L25/18 ,  H02M7/00 ,  H01L23/495 ,  H02M7/537 ,  H01L23/00

CPC classification number: H05K1/186 ,  H01L25/18 ,  H02M7/003 ,  H05K2201/10787 ,  H05K2201/10931 ,  H05K2201/09072 ,  H05K2201/10901 ,  H01L2224/40225 ,  H01L23/49524 ,  H05K2201/10946 ,  H05K2201/10174 ,  H02M7/537 ,  H01L24/40 ,  H05K2201/10166

Abstract: A power semiconductor device includes: a circuit body having a pair of conductor parts and a power semiconductor element sandwiched between the pair of conductor parts; a substrate in which a through hole is formed; and a sealing material that seals at least a part of each of the circuit body and the substrate, in which the circuit body is inserted into the through hole and has first and second exposed surfaces exposed from the sealing material, and the substrate has, in the through hole, a first protrusion and a second protrusion that protrude toward a center of the through hole and are connected to the circuit body, the first protrusion and the second protrusion being formed at positions opposed to each other in the through hole, and at least one of the first protrusion and the second protrusion being a terminal that transmits power to the power semiconductor element.

公开(公告)号：US20180062290A1

公开(公告)日：2018-03-01

申请号：US15683051

申请日：2017-08-22

Applicant: Sumitomo Wiring Systems, Ltd.

Inventor： Hideki Goto

IPC: H01R12/71 ,  H01R12/70

CPC classification number: H01R12/718 ,  H01R4/02 ,  H01R12/526 ,  H01R12/585 ,  H01R12/7064 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10295 ,  H05K2201/1059 ,  H05K2201/10787 ,  H05K2201/10803

Abstract: Provided is a substrate terminal-equipped printed circuit board having configured to enable a substrate terminal to be fixed to a printed circuit board without using a pedestal, and to reduce the pressure and the insertion force applied to an inner surface of a through hole when the substrate terminal is press-fitted therein. A conducting portion of a substrate terminal includes: a press-fitted portion disposed at a proximal end portion thereof and is press-fitted into a through hole; and a loosely inserted portion that extends from the press-fitted portion to a distal end portion thereof, has a narrower width than the press-fitted portion, and is inserted into the through hole with a gap therebetween, and the press-fitted portion of the conducting portion is in pressure contact only with printed wiring provided on a surface layer of the printed circuit board and with an insulating layer located immediately below the printed wiring.

公开(公告)号：US09888558B2

公开(公告)日：2018-02-06

申请号：US13152419

申请日：2011-06-03

Applicant: Akira Harao ,  Mototatsu Matsunaga ,  Yasuhiro Sugiura ,  Minoru Kubota

Inventor： Akira Harao ,  Mototatsu Matsunaga ,  Yasuhiro Sugiura ,  Minoru Kubota

IPC: H05K1/03 ,  H05K1/02 ,  H01R12/72 ,  H05K3/36 ,  H05K1/11 ,  H05K3/10 ,  H01L23/498 ,  H05K7/10 ,  H05K1/05 ,  H05K3/20 ,  H05K3/34 ,  H05K1/14

CPC classification number: H05K1/0204 ,  H01L23/49861 ,  H01L2224/05571 ,  H01L2224/48091 ,  H01L2225/1094 ,  H01R12/728 ,  H05K1/0203 ,  H05K1/05 ,  H05K1/056 ,  H05K1/11 ,  H05K1/14 ,  H05K3/10 ,  H05K3/202 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/1046 ,  H05K2201/09009 ,  H05K2201/09063 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2203/025 ,  Y10T29/49147 ,  Y10T29/49155

Abstract: A wiring substrate 11A includes a high heat radiation substrate 21 which has a high thermal conductive layer in which at least one of a front surface and a rear surface thereof is a mounting surface 21a for a variety of components; a connection terminal 31 which is extended from the high heat radiation substrate 21 and bent in a direction perpendicular to a surface of the high heat radiation substrate 21; and a heat radiation piece section 35 which is integrally installed to the connection terminal 31.

公开(公告)号：US20170318684A1

公开(公告)日：2017-11-02

申请号：US15652337

申请日：2017-07-18

Applicant: OLYMPUS CORPORATION

Inventor： Jumpei YONEYAMA

IPC: H05K3/40 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K3/40 ,  H05K1/11 ,  H05K3/3405 ,  H05K3/368 ,  H05K3/4092 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09827 ,  H05K2201/1075 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10931

Abstract: A method of manufacturing a wiring board includes a stacking process in which N (N is an integer equal to or greater than 2) wiring layers, end portions of which include linear conductor patterns, are stacked, with the end portions superimposed, via substrates (insulating layers) provided among the wiring layers and a laminated plate is manufactured and a removing process in which the insulating layers around the end portions of the conductor patterns of the laminated plate are removed to machine the end portions into N flying leads projecting from an end face.

公开(公告)号：US09505613B2

公开(公告)日：2016-11-29

申请号：US14494716

申请日：2014-09-24

Applicant: Nuvotronics, LLC

Inventor： David W. Sherrer ,  James R. Reid

IPC: B05D5/12 ,  B81C1/00 ,  H01L23/00 ,  H05K1/11 ,  H05K3/40 ,  H05K3/34 ,  H05K3/32

CPC classification number: H05K3/341 ,  B81C1/00357 ,  B81C2201/019 ,  H01L24/26 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/3015 ,  H01L2224/32227 ,  H01L2224/83191 ,  H01L2224/83815 ,  H01L2924/12042 ,  H05K1/111 ,  H05K1/181 ,  H05K3/321 ,  H05K3/34 ,  H05K3/4007 ,  H05K2201/10674 ,  H05K2201/10787 ,  H05K2201/10984 ,  H05K2203/0465 ,  H05K2203/1173 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

Abstract: Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.

Abstract translation: 提供了用于控制电子和/或电磁装置中焊料或其它可流动的导电材料的扩散的结构，材料和方法。

公开(公告)号：US09480142B2

公开(公告)日：2016-10-25

申请号：US14289401

申请日：2014-05-28

Applicant: YAZAKI CORPORATION

Inventor： Akira Harao ,  Mototatsu Matsunaga ,  Yasuhiro Sugiura ,  Minoru Kubota

IPC: H01R9/00 ,  H05K1/02 ,  H01R12/72 ,  H05K3/36 ,  H05K1/11 ,  H05K3/10 ,  H01L23/498 ,  H05K7/10 ,  H05K1/05 ,  H05K3/20 ,  H05K3/34 ,  H05K1/14

CPC classification number: H05K1/0204 ,  H01L23/49861 ,  H01L2224/05571 ,  H01L2224/48091 ,  H01L2225/1094 ,  H01R12/728 ,  H05K1/0203 ,  H05K1/05 ,  H05K1/056 ,  H05K1/11 ,  H05K1/14 ,  H05K3/10 ,  H05K3/202 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/1046 ,  H05K2201/09009 ,  H05K2201/09063 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2203/025 ,  Y10T29/49147 ,  Y10T29/49155

Abstract: Disclosed is wiring substrate and method of manufacturing thereof, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.

Abstract translation: 公开了布线基板及其制造方法，所述布线基板包括具有高导热层的基板，其中所述基板的前表面和后表面中的至少一个是用于各种部件的安装表面; 形成在所述基板中的窗部; 以及从所述窗部的内表面部分延伸并在垂直于所述基板的表面的方向上弯曲的连接端子。

公开(公告)号：US20160286642A1

公开(公告)日：2016-09-29

申请号：US15005589

申请日：2016-01-25

Applicant: Intel Corporation

Inventor： Tsung-Yu Chen ,  Rebecca Shia

IPC: H05K1/11 ,  H01L23/498 ,  H01L23/373 ,  H05K3/40

CPC classification number: H05K1/11 ,  H01L21/4853 ,  H01L21/4885 ,  H01L23/373 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01R13/04 ,  H05K3/103 ,  H05K3/3426 ,  H05K3/4015 ,  H05K5/0069 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10787 ,  H05K2201/10795 ,  H05K2201/1081 ,  H05K2203/1178 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces.

公开(公告)号：US09437946B2

公开(公告)日：2016-09-06

申请号：US14573195

申请日：2014-12-17

Applicant: Lear Corporation

Inventor： Bert W. Eakins ,  George E. Fox ,  Steven F. Gawron

IPC: H01R12/58 ,  H05K1/14 ,  H01R43/20 ,  H01R13/428 ,  H05K1/18

CPC classification number: H01R12/585 ,  H01R13/112 ,  H01R13/428 ,  H01R43/205 ,  H05K1/14 ,  H05K1/18 ,  H05K3/308 ,  H05K2201/10295 ,  H05K2201/10787 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K2203/0195

Abstract: A printed circuit board includes a surface and having first and second adjacent apertures. First and second electrical terminals include respective ends disposed in the first and second apertures of the printed circuit board, respective shoulders adjacent to the ends of the first and second electrical terminals and engaged with the surface of the printed circuit board, and respective insertion tabs adjacent to the shoulders of the first and second electrical terminals and located respective first and second distances away from the surface of the printed circuit board. The first and second distances are different such that the first and second insertion tabs do not touch one another.

Abstract translation: 印刷电路板包括表面并具有第一和第二相邻的孔。 第一和第二电端子包括设置在印刷电路板的第一和第二孔中的相应端，相邻于第一和第二电端子的端部并与印刷电路板的表面接合的相应的肩部以及相邻的相应的插入片 连接到第一和第二电端子的肩部，并且位于相对于印刷电路板表面的第一和第二距离。 第一和第二距离是不同的，使得第一和第二插入片不相互接触。

公开(公告)号：US09247642B2

公开(公告)日：2016-01-26

申请号：US13533681

申请日：2012-06-26

Applicant: Tsung-Yu Chen ,  Rebecca Shia

Inventor： Tsung-Yu Chen ,  Rebecca Shia

IPC: H01L23/488 ,  H05K1/11 ,  H01L23/48 ,  H05K3/10 ,  H01L23/498 ,  H05K3/40 ,  H05K3/34

CPC classification number: H05K1/11 ,  H01L21/4853 ,  H01L21/4885 ,  H01L23/373 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01R13/04 ,  H05K3/103 ,  H05K3/3426 ,  H05K3/4015 ,  H05K5/0069 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10787 ,  H05K2201/10795 ,  H05K2201/1081 ,  H05K2203/1178 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces.

Abstract translation: 示出了引脚连接，电子设备和方法的实施例，其包括引脚配置以减少引脚连接操作期间的空隙和引脚倾斜以及其它问题，诸如附接到芯片封装引脚网格阵列。 引脚头被显示为包括诸如凸表面，多个腿和销头表面中的通道的特征。

公开(公告)号：US20150007939A1

公开(公告)日：2015-01-08

申请号：US14494716

申请日：2014-09-24

Applicant: Nuvotronics, LLC

Inventor： David W. Sherrer ,  James R. Reid

IPC: B81C1/00

CPC classification number: H05K3/341 ,  B81C1/00357 ,  B81C2201/019 ,  H01L24/26 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/3015 ,  H01L2224/32227 ,  H01L2224/83191 ,  H01L2224/83815 ,  H01L2924/12042 ,  H05K1/111 ,  H05K1/181 ,  H05K3/321 ,  H05K3/34 ,  H05K3/4007 ,  H05K2201/10674 ,  H05K2201/10787 ,  H05K2201/10984 ,  H05K2203/0465 ,  H05K2203/1173 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

Abstract: Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.

Abstract translation: 提供了用于控制电子和/或电磁装置中焊料或其它可流动的导电材料的扩散的结构，材料和方法。