公开(公告)号：US20130334292A1

公开(公告)日：2013-12-19

申请号：US13947525

申请日：2013-07-22

Applicant: Frank Ferdinandi ,  Rodney Edward Smith ,  Mark Robson Humphries

Inventor： Frank Ferdinandi ,  Rodney Edward Smith ,  Mark Robson Humphries

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48647 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2224/81024 ,  H01L2224/81395 ,  H01L2224/81815 ,  H01L2224/83024 ,  H01L2224/83205 ,  H01L2224/83395 ,  H01L2224/83815 ,  H01L2224/85203 ,  H01L2224/85207 ,  H01L2224/85395 ,  H01L2224/85447 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/00 ,  H05K3/282 ,  H05K3/285 ,  H05K3/288 ,  H05K3/3484 ,  H05K3/3489 ,  H05K3/3494 ,  H05K2201/015 ,  H05K2201/0179 ,  H05K2203/092 ,  H05K2203/107 ,  H05K2203/1338 ,  H05K2203/1366 ,  H05K2203/1372 ,  H05K2203/1383 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A printed circuit board to which a localised solder connection is to be made, the surface of said printed circuit board having a continuous or non-continuous coating of a composition comprising a halo-hydrocarbon polymer at a thickness of from 1 nm to 10 μm.

Abstract translation: 印刷电路板将要制成局部焊接连接，所述印刷电路板的表面具有包含厚度为1nm至10μm的卤代烃聚合物的组合物的连续或非连续涂层。

公开(公告)号：US08479386B2

公开(公告)日：2013-07-09

申请号：US12944904

申请日：2010-11-12

Applicant: Takeshi Shioga ,  Kazuaki Kurihara ,  Kanae Nakagawa ,  Taiji Sakai ,  Masataka Mizukoshi

Inventor： Takeshi Shioga ,  Kazuaki Kurihara ,  Kanae Nakagawa ,  Taiji Sakai ,  Masataka Mizukoshi

IPC: H05K3/02

CPC classification number: H05K1/162 ,  H01L21/486 ,  H01L23/15 ,  H01L23/498 ,  H01L23/49827 ,  H01L23/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K1/112 ,  H05K3/4605 ,  H05K2201/0179 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/10378 ,  Y10T29/49002 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for manufacturing an interposer including forming a capacitor over a semiconductor substrate; forming a first resin layer with a first partial electrode buried in over the semiconductor substrate and the capacitor; cutting an upper part of the first partial electrode and the first resin layer with a cutting tool; forming a second resin layer with a second partial electrode buried in over a glass substrate with a through-electrode buried in; cutting an upper part of the second partial electrode and the second resin layer with the cutting tool; making thermal processing with the first resin layer and the second resin layer adhered to each other while connecting the first partial electrode and the second partial electrode to each other; removing the semiconductor substrate; forming a third resin layer over the glass substrate, covering the capacitor; and burying a third partial electrode in the third resin layer.

Abstract translation: 一种用于制造包括在半导体衬底上形成电容器的插入器的方法; 形成第一树脂层，其中第一部分电极埋在半导体衬底和电容器之上; 用切割工具切割第一部分电极和第一树脂层的上部; 形成具有埋在玻璃基板上的第二部分电极的第二树脂层，其中埋入有通孔; 用切割工具切割第二部分电极和第二树脂层的上部; 在使第一部分电极和第二部分电极彼此连接的同时，使第一树脂层和第二树脂层彼此粘合; 去除半导体衬底; 在玻璃基板上形成第三树脂层，覆盖电容器; 并在第三树脂层中埋设第三部分电极。

公开(公告)号：US08362367B2

公开(公告)日：2013-01-29

申请号：US12566742

申请日：2009-09-25

Applicant: Daiki Komatsu

Inventor： Daiki Komatsu

IPC: H05K1/11

CPC classification number: H05K3/4644 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0195 ,  Y10T29/49155

Abstract: A method for manufacturing a multilayer printed wiring board suitable for forming fine conductive circuits. A multilayer printed wiring board is formed with a first insulative material and a first conductive circuit formed on the first insulative material. A second insulative material is formed on the first insulative material and the first conductive circuit, and has an opening portion that reaches the first conductive circuit. A second conductive circuit is formed on the second insulative material and a via conductor is formed in the opening portion and connecting the first conductive circuit and the second conductive circuit. An insulative thin film is formed on at least part of the side surface of the first conductive circuit, and the via conductor is directly connected to the surface of the first conductive circuit exposed through the opening portion.

Abstract translation: 一种适用于形成精细导电电路的多层印刷线路板的制造方法。 多层印刷线路板形成有形成在第一绝缘材料上的第一绝缘材料和第一导电电路。 在第一绝缘材料和第一导电电路上形成第二绝缘材料，并且具有到达第一导电电路的开口部分。 第二导电电路形成在第二绝缘材料上，并且通孔导体形成在开口部分中，并连接第一导电电路和第二导电电路。 绝缘薄膜形成在第一导电电路的侧表面的至少一部分上，通孔导体直接连接到通过开口部露出的第一导电电路的表面。

公开(公告)号：US20120305301A1

公开(公告)日：2012-12-06

申请号：US13399101

申请日：2012-02-17

Applicant: King-Lien Lee

Inventor： King-Lien Lee

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0209 ,  H05K2201/017 ,  H05K2201/0179 ,  H05K2201/10106

Abstract: The invention provides a circuit board with heat sink and a method of fabricating the same. The circuit board according to the invention includes a substrate, a lead layer and a ceramic layer. The lead layer is formed on an upper surface of the substrate, and includes two contact points corresponding to an electronic device. The ceramic layer is formed on the upper surface of the substrate, and particularly formed between such two contact points. The ceramic layer serves as a heat sink for the electronic device.

Abstract translation: 本发明提供一种具有散热器的电路板及其制造方法。 根据本发明的电路板包括基板，引线层和陶瓷层。 引线层形成在基板的上表面上，并且包括对应于电子设备的两个接触点。 陶瓷层形成在基板的上表面上，特别形成在这两个接触点之间。 陶瓷层用作电子设备的散热器。

公开(公告)号：US08273671B2

公开(公告)日：2012-09-25

申请号：US10514876

申请日：2003-05-23

Applicant: Jürgen Leib ,  Dietrich Mund

Inventor： Jürgen Leib ,  Dietrich Mund

IPC: C03C3/091

CPC classification number: H01L21/02263 ,  C03B19/00 ,  C03C3/083 ,  C03C3/089 ,  C03C4/12 ,  C03C14/006 ,  C03C15/00 ,  C03C17/02 ,  C03C17/34 ,  C03C2214/16 ,  C03C2217/21 ,  C03C2218/15 ,  C03C2218/32 ,  C03C2218/328 ,  C03C2218/33 ,  C03C2218/355 ,  C23C14/10 ,  H01L21/02129 ,  H01L21/02161 ,  H01L21/31616 ,  H01L21/31625 ,  H01L21/50 ,  H01L21/56 ,  H01L23/10 ,  H01L23/291 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/49894 ,  H01L23/66 ,  H01L24/97 ,  H01L51/5203 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5259 ,  H01L51/5262 ,  H01L2223/6627 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/1903 ,  H01L2924/19033 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  H01P3/003 ,  H01P11/003 ,  H05K3/28 ,  H05K3/467 ,  H05K2201/0179 ,  Y02P40/57 ,  Y10T428/24917 ,  H01L2924/00

Abstract: A glass material for producing insulation layers is provided. The glass material can improve the radio-frequency properties of radio-frequency substrates or radio-frequency conductor arrangements. In one embodiment, the glass material for producing insulation layers for radio-frequency substrates or radio-frequency conductor arrangements is an applied layer with a layer thickness in the range between 0.05 μm and 5″mm and has a loss factor tan δ of less than or equal to 70*10−4 in at least a frequency range above 1 GHz.

Abstract translation: 提供一种用于制造绝缘层的玻璃材料。 玻璃材料可以改善射频基板或射频导体布置的射频特性。 在一个实施例中，用于制造用于射频基板或射频导体布置的绝缘层的玻璃材料是层厚度在0.05μm和5“之间的层的施加层，并且具有小于 或至少在1GHz以上的频率范围内等于70×10-4。

公开(公告)号：US08134083B2

公开(公告)日：2012-03-13

申请号：US12314086

申请日：2008-12-03

Applicant: Bernd Haegele

Inventor： Bernd Haegele

IPC: H05K1/16

CPC classification number: H05K1/053 ,  C03C3/064 ,  C23C4/18 ,  H05K1/092 ,  H05K2201/0116 ,  H05K2201/017 ,  H05K2201/0179 ,  H05K2203/1147 ,  H05K2203/1366 ,  Y10T29/49126 ,  Y10T29/49146

Abstract: A circuit carrier having a metal support layer, at least some portions of which are covered by a dielectric layer, the dielectric layer having a plurality of pores, with the pores being sealed by glass at least on the opposite side of the dielectric layer to the support layer.

Abstract translation: 一种具有金属支撑层的电路载体，其至少一些部分被电介质层覆盖，所述电介质层具有多个孔，所述电介质层至少在电介质层的相对侧上被玻璃密封， 支持层。

公开(公告)号：US08115113B2

公开(公告)日：2012-02-14

申请号：US12216747

申请日：2008-07-10

Applicant: Hironori Tanaka

Inventor： Hironori Tanaka

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/162 ,  H05K1/0269 ,  H05K1/112 ,  H05K3/205 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/09763 ,  H05K2201/09918 ,  H05K2203/166

Abstract: A multilayer printed wiring board including a layered capacitor section provided on a first interlayer resin insulation layer and a high dielectric layer and first and second layered electrodes that sandwich the high dielectric layer. A second interlayer resin insulation layer is provided on the first insulation layer and the capacitor section, and a metal thin-film layer is provided over the capacitor section and on the second insulation layer. An outermost interlayer resin insulation layer is provided on the second insulation layer and the metal thin-film layer. A mounting section is provided on the outermost insulation layer and has first and second external terminals to mount a semiconductor element. Multiple via conductors penetrate each insulation layer. The via conductors include first via conductors that electrically connect the first layered electrode to the first external terminals. Second via conductors electrically connect the second layered electrode to the second external terminals.

Abstract translation: 一种多层印刷线路板，包括设置在第一层间树脂绝缘层和高电介质层上的层状电容器部分和夹着高电介质层的第一和第二层状电极。 在第一绝缘层和电容器部分上设置第二层间树脂绝缘层，并且在电容器部分和第二绝缘层上设置金属薄膜层。 在第二绝缘层和金属薄膜层上设置最外层的层间树脂绝缘层。 安装部分设置在最外层绝缘层上，并且具有安装半导体元件的第一和第二外部端子。 多个通孔导体穿过每个绝缘层。 通孔导体包括将第一层状电极电连接到第一外部端子的第一通孔导体。 第二通孔导体将第二层状电极电连接到第二外部端子。

公开(公告)号：US08049117B2

公开(公告)日：2011-11-01

申请号：US12466841

申请日：2009-05-15

Applicant: Jung Won Lee ,  Yul Kyo Chung ,  In Hyung Lee

Inventor： Jung Won Lee ,  Yul Kyo Chung ,  In Hyung Lee

IPC: H05K1/16

CPC classification number: H05K1/162 ,  H01G4/33 ,  H01G13/00 ,  H01L21/4857 ,  H01L23/50 ,  H01L2924/0002 ,  H05K2201/0108 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2203/016 ,  H05K2203/107 ,  Y10T29/43 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A method for manufacturing a printed circuit board with a capacitor embedded therein which has a dielectric film using laser lift off, and a capacitor manufactured thereby. In the method, a dielectric film is formed on a transparent substrate and heat-treated. A first conductive layer is formed on the heat-treated dielectric film. A laser beam is irradiated onto a stack formed, from below the transparent substrate, to separate the transparent substrate from the stack. After the transparent substrate is separated from the stack, a second conductive layer is formed with a predetermined pattern on the dielectric film. Also, an insulating layer and a third conductive layer are formed on the first and second conductive layers to alternate with each other in a predetermined number.

Abstract translation: 一种制造其中嵌有电容器的印刷电路板的方法，其中具有使用激光剥离的电介质膜，以及由此制造的电容器。 在该方法中，在透明基板上形成电介质膜并进行热处理。 在热处理电介质膜上形成第一导电层。 将激光束照射到从透明基板的下方形成的堆叠上，以将透明基板与堆叠分离。 在将透明基板与堆叠体分离之后，在电介质膜上形成具有预定图案的第二导电层。 此外，绝缘层和第三导电层形成在第一和第二导电层上，以预定数量相互交替。

公开(公告)号：US08044427B2

公开(公告)日：2011-10-25

申请号：US12145395

申请日：2008-06-24

Applicant: Wen-Herng Su ,  Junying Lu ,  Ho-Shang Lee

Inventor： Wen-Herng Su ,  Junying Lu ,  Ho-Shang Lee

IPC: H01L33/00

CPC classification number: H01L33/483 ,  H01L33/005 ,  H01L33/60 ,  H01L2224/13 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/19107 ,  H05K1/053 ,  H05K1/162 ,  H05K1/183 ,  H05K2201/0116 ,  H05K2201/0179 ,  H05K2201/10106 ,  H05K2203/0315 ,  Y10S362/80 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/53113 ,  H01L2924/00014 ,  H01L2924/00

Abstract: This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described, for the packaging of high power LEDs. The LED submount provides high thermal conductivity while preserving electrical insulation. In particular, a process is described for anodizing a high thermal conductivity aluminum alloy sheet to form a porous aluminum oxide layer and a non-porous aluminum oxide layer. This anodized aluminum alloy sheet acts as a superior electrical insulator, and also provides surface morphology and mechanical properties that are useful for the fabrication of high-density and high-power multilevel electrical circuits.

Abstract translation: 本发明涉及发光二极管或LED电路的热管理，光提取和成本效益。 描述了集成电路LED基座，用于大功率LED的封装。 LED基座提供高导热性，同时保持电气绝缘。 特别地，描述了用于阳极氧化高导热性铝合金板以形成多孔氧化铝层和无孔氧化铝层的工艺。 该阳极氧化铝合金板作为优异的电绝缘体，并且还提供用于制造高密度和大功率多电平电路的表面形态和机械性能。

公开(公告)号：US07990228B2

公开(公告)日：2011-08-02

申请号：US12060941

申请日：2008-04-02

Applicant: Yutaka Uematsu ,  Hideki Osaka ,  Yoji Nishio ,  Eiichi Suzuki

Inventor： Yutaka Uematsu ,  Hideki Osaka ,  Yoji Nishio ,  Eiichi Suzuki

IPC: H04B3/28

CPC classification number: H05K1/162 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/111 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A technique capable of achieving both improvement of mounting density and noise reduction for a semiconductor device is provided. An LSI mounted on a printed wiring board comprises a grounding BGA ball and a power BGA ball to get power supply from the printed wiring board, and the grounding BGA ball and the power BGA ball are arranged closely to each other. A decoupling capacitor is mounted on the printed wiring board and has a first terminal and a second terminal. The grounding BGA ball and the first terminal are connected by a first metal electrode plate, and the power BGA ball and the second terminal are connected by a second metal electrode plate. The first metal electrode plate and the second metal electrode plate interpose a dielectric film having a thickness equal to or smaller than 1 μm therebetween.

Abstract translation: 提供了能够实现半导体器件的安装密度和噪声降低的改进的技术。 安装在印刷电路板上的LSI包括接地BGA球和电源BGA球，以从印刷线路板获得电源，并且接地BGA球和电源BGA球彼此靠近地布置。 去耦电容器安装在印刷电路板上，并具有第一端子和第二端子。 接地BGA球和第一端子通过第一金属电极板连接，电力BGA球和第二端子通过第二金属电极板连接。 第一金属电极板和第二金属电极板之间插入厚度等于或小于1μm的电介质膜。