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公开(公告)号：US20180054883A1
公开(公告)日：2018-02-22
申请号：US15238651
申请日：2016-08-16
Applicant: Chicony Electronics Co., Ltd.
Inventor： Liang-Chun YEH
CPC classification number: H05K1/028 , F21V19/001 , H01H13/83 , H05K1/0274 , H05K1/189 , H05K2201/052 , H05K2201/055 , H05K2201/10106
Abstract: A flexible printed circuit board of a light guide module and a cut-out structure thereof. The flexible printed circuit board is made by cutting an FPC material and is formed after folding and unfolding. The flexible printed circuit board includes two light emitting plates and an extension strip. The two light emitting plates each has a connection portion. The extension strip is integrally connected between the two connection portions. Two ends of the two light emitting plates and the extension strip have two fold lines respectively, so that the extension strip is disposed between the two light emitting plates along an extension direction to separate the two light emitting plates away from each other.
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公开(公告)号：US20170257938A1
公开(公告)日：2017-09-07
申请号：US15446727
申请日：2017-03-01
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor： HIROHIDE KOMIYAMA , HIDESHI TSUKAMOTO , YASUSHI YOSHIKAWA , MITSURU OGAWA
IPC: H05K1/02
CPC classification number: H05K1/028 , H05K1/0277 , H05K1/0281 , H05K1/0283 , H05K1/117 , H05K1/118 , H05K1/147 , H05K2201/052 , H05K2201/053 , H05K2201/055 , H05K2201/056 , H05K2201/09081 , H05K2201/09245 , H05K2201/09254 , H05K2201/09418
Abstract: A flexible printed circuit board (FPCB) is disclosed. The FPCB can be employed to connect an interface card having connectors with a two-stage configuration to a connection destination of a portable information equipment. The FPCB includes a bend line located between an upper-stage terminal group and a lower-stage terminal group. The FPCB can be bent along the bend line to allow the upper-stage terminal group and the lower-stage terminal group to be mutually superimposed over each other. In addition, the upper-stage terminal group of the FPCB is connected to the upper-stage-side connector terminal group of the interface card, and the lower-stage terminal group of the FPCB is connected to the lower-stage-side connector terminal group of the interface card.
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公开(公告)号：US20170194076A1
公开(公告)日：2017-07-06
申请号：US15465633
申请日：2017-03-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki YOSUI , Shingo ITO , Shuichi KEZUKA , Takahiro BABA
CPC classification number: H01B7/08 , H01P3/026 , H01P3/082 , H05K1/0219 , H05K1/0225 , H05K1/147 , H05K2201/052 , H05K2201/10037 , H05K2201/10189
Abstract: A transmission line includes, in a stacked insulator in which insulator layers are stacked, a first transmission line portion including a first ground conductor pattern, a second ground conductor pattern, and a first signal conductor pattern, and a second transmission line portion including a third ground conductor pattern, a fourth ground conductor pattern, and a second signal conductor pattern. The first signal conductor pattern extends along the second signal conductor pattern. The first ground conductor pattern and the third ground conductor pattern are provided on different insulator layers and at least partially overlap each other in a plan view.
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公开(公告)号：US09579436B2
公开(公告)日：2017-02-28
申请号：US14015630
申请日：2013-08-30
Applicant: Thoratec Corporation
Inventor： Mark McChrystal , Joseph C. Stark, III
IPC: G01B7/14 , G01B7/30 , G01R33/06 , H01L43/06 , A61M1/12 , G01B7/00 , H05K1/02 , H05K3/30 , A61M1/10 , F04D13/06 , H05K1/11 , H05K1/18 , F04D15/00 , G01R33/02 , H05K3/46
CPC classification number: A61M1/1086 , A61M1/101 , A61M1/1012 , A61M1/1015 , A61M1/1017 , A61M1/1031 , A61M1/1036 , A61M1/12 , A61M1/122 , A61M2205/3317 , A61M2205/3334 , A61M2205/3365 , A61M2207/00 , F04D13/064 , F04D15/0077 , G01B7/003 , G01B7/30 , G01D5/142 , G01R33/072 , H05K1/028 , H05K1/119 , H05K1/189 , H05K3/30 , H05K3/303 , H05K3/32 , H05K3/4691 , H05K2201/052 , H05K2201/10151 , Y10T29/49009 , Y10T29/49128
Abstract: Techniques for mounting a sensor are disclosed. In some implementations, a molded interconnect device carries a sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the Hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.
Abstract translation: 公开了安装传感器的技术。 在一些实施方案中，模制互连装置承载用于转换可植入血液泵的转子位置的传感器。 模制的互连装置包括一个或多个集成电子电路迹线，其被配置为将霍尔传感器与可植入血液泵的印刷电路板电连接，并且模制的互连装置被配置为安装到印刷电路板。
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105.发明申请公开(公告)号：US20170003801A1
公开(公告)日：2017-01-05
申请号：US15107294
申请日：2014-12-23
Applicant: KunShan Visionox Display Co., Ltd.
Inventor： Weiwei LIU , Yao HONG
CPC classification number: G06F3/0416 , G06F3/044 , G06F2203/04102 , H05K1/028 , H05K1/147 , H05K1/189 , H05K2201/052 , H05K2201/055 , H05K2201/10128 , H05K2201/10681
Abstract: An FPC of a capacitive touchscreen and a method for mounting the FPC. The FPC comprises a sensing circuit and a driving circuit which respectively matches with a sensing circuit layer and a driving circuit layer of a capacitive touchscreen panel and have several contacts for matching the sensing circuit layer and the driving circuit layer for corresponding connection; an IC driving chip, disposed between the sensing circuit and the driving circuit. The sensing circuit and the driving circuit are disposed in parallel or on the same line. The sensing circuit or the driving circuit is provided with a bending area, and the sensing circuit or the driving circuit is able to be turned towards the driving circuit or the sensing circuit, so as to allow the sensing circuit to match the sensing circuit layer and allow the driving circuit to match the driving circuit layer. According to the present invention, the FPCs of the capacitive touchscreen can be compactly arranged on a substrate, so that the utilization rate of the substrate is greatly increased and the cost is reduced.
Abstract translation: 电容式触摸屏的FPC和FPC的安装方法。 FPC包括感测电路和驱动电路，其分别与电容式触摸屏面板的感测电路层和驱动电路层匹配，并且具有用于匹配感测电路层和驱动电路层的多个触点用于相应的连接; 设置在感测电路和驱动电路之间的IC驱动芯片。 感测电路和驱动电路并联或同一线路设置。 感测电路或驱动电路设有弯曲区域，感测电路或驱动电路能够转向驱动电路或感测电路，以便使感测电路匹配感测电路层和 允许驱动电路匹配驱动电路层。 根据本发明，可以将电容式触摸屏的FPC紧凑地布置在基板上，从而大大增加了基板的利用率并降低了成本。
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Patent Agency Ranking
公开(公告)号：US09492599B2
公开(公告)日：2016-11-15
申请号：US14015542
申请日：2013-08-30
Applicant: Thoratec Corporation
Inventor： Samuel Schimpf , Mark McChrystal , Joseph C. Stark, III , Andre Siebenhaar
IPC: A61M1/10 , A61M1/12 , G01B7/00 , H05K1/02 , H05K3/30 , F04D13/06 , G01B7/30 , H05K1/11 , H05K1/18 , F04D15/00 , H05K3/46
CPC classification number: A61M1/1086 , A61M1/101 , A61M1/1012 , A61M1/1015 , A61M1/1017 , A61M1/1031 , A61M1/1036 , A61M1/12 , A61M1/122 , A61M2205/3317 , A61M2205/3334 , A61M2205/3365 , A61M2207/00 , F04D13/064 , F04D15/0077 , G01B7/003 , G01B7/30 , G01D5/142 , G01R33/072 , H05K1/028 , H05K1/119 , H05K1/189 , H05K3/30 , H05K3/303 , H05K3/32 , H05K3/4691 , H05K2201/052 , H05K2201/10151 , Y10T29/49009 , Y10T29/49128
Abstract: A molded interconnect device can carry a Hall sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.
Abstract translation: 模制的互连装置可以携带用于转换可植入血液泵的转子位置的霍尔传感器。 模制的互连装置包括一个或多个集成电子电路迹线，其被配置为将霍尔传感器与可植入血液泵的印刷电路板电连接，并且模制的互连装置被配置为安装到印刷电路板。
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公开(公告)号：US20160329903A1
公开(公告)日：2016-11-10
申请号：US15109857
申请日：2015-01-26
Applicant: Kazuhiko ADACHI , Kazuhiro HARASAKA , Akihiro ITOH
Inventor： Kazuhiko ADACHI , Kazuhiro HARASAKA , Akihiro ITOH
CPC classification number: H03L7/26 , G04F5/14 , H01L23/345 , H01L2224/45144 , H01L2224/48091 , H01S5/005 , H01S5/02248 , H01S5/02453 , H01S5/183 , H05K1/028 , H05K1/0296 , H05K1/11 , H05K1/189 , H05K3/0052 , H05K2201/052 , H05K2201/055 , H05K2201/056 , H05K2201/09063 , H05K2201/10075 , H05K2201/10174 , H05K2201/2018 , H01L2924/00014 , H01L2924/00
Abstract: An atomic oscillator includes a gas cell and a plurality of components. The plurality of components includes a temperature control device for the gas cell; an excitation light source that emits excitation light to excite atoms enclosed in the gas cell; a temperature control device for the excitation light source; and a light receiving element that detects the excitation light that passes through the gas cell. The plurality of components is mounted on an insulating film having wiring.
Abstract translation: 原子振荡器包括气室和多个部件。 多个部件包括用于气室的温度控制装置; 激发光源，其发射激发光以激发包围在气室中的原子; 用于激发光源的温度控制装置; 以及检测通过气室的激发光的受光元件。 多个部件安装在具有布线的绝缘膜上。
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公开(公告)号：US20160316577A1
公开(公告)日：2016-10-27
申请号：US15134476
申请日：2016-04-21
Applicant: NLT TECHNOLOGIES, LTD.
Inventor： Atsushi YAMAMOTO
CPC classification number: H05K1/0296 , G09G5/006 , G09G2300/0421 , H05K1/028 , H05K1/0283 , H05K1/147 , H05K2201/052 , H05K2201/09036 , H05K2201/09272 , H05K2201/10136
Abstract: A common substrate for connection 10 capable for display apparatuses having different sizes or numbers of pixels is provided. In some cases, a common signal processing board 40 also provided. There is provided a substrate for connection 10 electrically connecting a display panel 30 and a signal processing board 40 which includes a circuit to control the display panel 30. The display panel 30 is provided with a driver circuit 32 to drive the display panel 30, the substrate for connection 10 is integrally formed, and the substrate for connection 10 comprises a variable part 16 configured to change a distance between connection terminal blocks 11 in a connection terminal pitch direction, between the connection terminal blocks 11 in which no connection terminal is disposed.
Abstract translation: 提供了能够用于具有不同尺寸或数量的像素的显示装置的用于连接10的通用基板。 在一些情况下，还提供了公共信号处理板40。 提供了用于将显示面板30和包括用于控制显示面板30的电路的信号处理板40电连接的连接用基板10.显示面板30设置有驱动电路32以驱动显示面板30， 连接用基板10一体形成，连接用基板10包括可变部16，该可变部16构成为在不具有连接端子的连接端子块11之间改变连接端子间距方向上的连接端子块11之间的距离。
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公开(公告)号：US09465467B2
公开(公告)日：2016-10-11
申请号：US14564335
申请日：2014-12-09
Applicant: LG Display Co., Ltd.
Inventor： Sunghoon Lee
CPC classification number: G06F3/041 , G06F3/044 , G06F2203/04102 , H05K1/0281 , H05K1/118 , H05K1/148 , H05K3/361 , H05K2201/052 , H05K2201/058 , H05K2201/09781 , H05K2201/1034 , H05K2201/10356 , H05K2201/2009
Abstract: A flexible printed circuit board having enhanced peeling force and a touch panel including the same are provided. The flexible printed circuit board (FPCB) includes a first bonding portion and a second bonding portion respectively bonded to a first circuit unit and a second circuit unit. The first bonding portion includes a pad corresponding portion corresponding to pads of the first circuit unit and dummy portions outwardly extending from both end portions of the pad corresponding portion. An FPCB wiring formation portion includes FPCB wirings respectively connected to the pads and extending from the first bonding portion to the second bonding portion and concave portions respectively disposed to be adjacent to the dummy portions and having a curved surface.
Abstract translation: 提供了具有增强的剥离力的柔性印刷电路板和包括其的触摸面板。 柔性印刷电路板（FPCB）包括分别接合到第一电路单元和第二电路单元的第一接合部分和第二接合部分。 第一接合部分包括对应于第一电路单元的焊盘的焊盘对应部分和从焊盘对应部分的两个端部向外延伸的虚拟部分。 FPCB布线形成部分包括分别连接到焊盘并且从第一接合部分延伸到第二接合部分的FPCB布线和分别设置成与虚设部分相邻并且具有弯曲表面的凹部。
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110.发明授权Wiring material, method for fabricating the same, and secondary battery device and electronic equipment using the same 有权接线材料及其制造方法以及二次电池装置及使用其的电子设备公开(公告)号：US09462684B2
公开(公告)日：2016-10-04
申请号：US14077865
申请日：2013-11-12
Applicant: Hitachi Metals, Ltd.
Inventor： Kotaro Tanaka , Toshiyuki Horikoshi , Takumi Sato , Kenichi Murakami
IPC: H01B7/08 , H05K1/02 , H01B13/012 , H05K1/18
CPC classification number: H05K1/028 , H01B13/01254 , H05K1/189 , H05K2201/052 , H05K2201/10037 , Y10T29/49117
Abstract: A wiring material includes conductors, each of which has a cross section having a thickness and a width not less than the thickness, a trunk portion in which the conductors are spaced parallel in a direction of the width thereof, a branch portion in which each conductor is bent and branched from the trunk portion in the direction of the width or in a direction that intersects the direction of the width, and a covering member for covering the trunk portion and the branch portion to expose both ends of the conductors.
Abstract translation: 布线材料包括导体，每个导体的横截面具有不小于厚度的厚度和宽度，导体沿其宽度方向间隔开的主干部分，其中每个导体 在宽度方向或与宽度方向相交的方向上从躯干部分弯曲和分支;以及覆盖部件，用于覆盖主干部分和分支部分以露出导体的两端。
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