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    MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD
    101.
    发明申请
    MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD 有权
    多层微波校正印刷电路板及方法

    公开(公告)号：US20130319732A1

    公开(公告)日：2013-12-05

    申请号：US13865730

    申请日：2013-04-18

    Applicant: RAYTHEON COMPANY

    Inventor： Clifton Quan ,  Hee Kyung Kim ,  Fangchou Yang ,  Kevin C. Rolston ,  Edward Marsh Jackson

    IPC: H05K1/02

    CPC classification number: H05K1/028 ,  H05K1/024 ,  H05K1/144 ,  H05K1/147 ,  H05K3/361 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4635 ,  H05K2201/055 ,  H05K2201/058 ,  H05K2201/09109 ,  H05K2201/09318 ,  H05K2201/10378 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49155

    Abstract: A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, an interconnect assembly includes a first flat flexible layer having a signal conductor and a ground conductor forming a first microstripline or microstrip transmission line, a second folded flexible layer having a signal conductor and a ground conductor forming a second microstripline or microstrip transmission line, the bottom surface of the second folded flexible layer having ridge portions, a non-conductive adhesive layer disposed between the top surface of the first flat flexible layer and the ridge portions of the second folded flexible layer, a signal through-hole extending through the non-conductive adhesive layer and the first flat flexible layer, and two ground through-holes extending through the non-conductive adhesive layer and the second folded flexible layer, wherein the two ground through-holes are disposed on opposite sides of the signal through-hole.

    Abstract translation: 提供多层微波波纹印刷电路板。 在一个实施例中，互连组件包括具有信号导体和形成第一微带或微带传输线的接地导体的第一扁平柔性层，具有信号导体的第二折叠柔性层和形成第二微带或微带传输的接地导体 具有脊部的第二折叠柔性层的底面，设置在第一平面柔性层的顶面与第二折叠柔性层的隆起部之间的非导电性粘合剂层，延伸穿过的信号通孔 非导电粘合剂层和第一平坦柔性层，以及延伸穿过非导电粘合剂层和第二折叠柔性层的两个接地通孔，其中两个接地通孔设置在信号通过的相对侧上 -孔。

    Flexible printed circuit, image pickup device, and electronic equipment
    102.
    发明授权
    Flexible printed circuit, image pickup device, and electronic equipment 有权
    柔性印刷电路，图像拾取装置和电子设备

    公开(公告)号：US08169722B2

    公开(公告)日：2012-05-01

    申请号：US12027560

    申请日：2008-02-07

    Applicant: Atsushi Hasegawa ,  Takumi Kuwahara ,  Manabu Kobayashi ,  Fumio Shinano

    Inventor： Atsushi Hasegawa ,  Takumi Kuwahara ,  Manabu Kobayashi ,  Fumio Shinano

    IPC: G02B7/02

    CPC classification number: H05K1/0256 ,  G02B7/102 ,  H05K1/189 ,  H05K3/363 ,  H05K2201/055 ,  H05K2201/058

    Abstract: A flexible printed circuit according to the present invention is anchored to a holding member disposed within electronic equipment, and comprises: a main body portion 70 that includes electrical lines; a first connection portion 71 disposed in the main body portion 70 and to which an electric component or another flexible printed circuit is connected; and a first cover portion 72 formed as part of the main body portion 70 and disposed so as to cover the first connection portion. Part of the first cover portion is held by a lens holder 6. According to this configuration, an insulated state can be reliably maintained by using a configuration in which soldered connection portions are covered by part of the FPC and the covering portion is held by the housing.

    Abstract translation: 根据本发明的柔性印刷电路被固定到设置在电子设备内的保持构件，并且包括：主体部分70，其包括电线; 第一连接部分71，设置在主体部分70中，电气部件或另一个柔性印刷电路连接到该第一连接部分71; 以及形成为主体部70的一部分并且被设置为覆盖第一连接部的第一盖部72。 第一覆盖部分的一部分由透镜保持器6保持。根据该结构，通过使用焊接连接部分被FPC的一部分覆盖并且覆盖部分被保持的结构可以可靠地保持绝缘状态 住房。

    MULTILAYER CIRCUIT BOARD
    104.
    发明申请
    MULTILAYER CIRCUIT BOARD 审中-公开
    多层电路板

    公开(公告)号：US20110080245A1

    公开(公告)日：2011-04-07

    申请号：US12889582

    申请日：2010-09-24

    Applicant: Tsuneo Suzuki ,  Rolf Dupper

    Inventor： Tsuneo Suzuki ,  Rolf Dupper

    IPC: H01F5/00 ,  H05K1/11 ,  H05K3/10 ,  B23K1/002

    CPC classification number: H05K3/363 ,  G11B7/0935 ,  H01L2224/48247 ,  H01L2224/48472 ,  H05K1/144 ,  H05K1/165 ,  H05K3/3494 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/058 ,  H05K2203/101 ,  Y10T29/49155 ,  H01L2924/00

    Abstract: A multilayer circuit board includes a first dielectric layer, a second dielectric layer, a first conductor path, a second conductor path and a soldered joint. The first dielectric layer has a first side and a second side. The second dielectric layer has a first side and a second side, where the first side of the second dielectric layer facing towards the first side of the first dielectric layer. The first conductor path is disposed on the first side of the first dielectric layer. The second conductor path is disposed on the first side of the second dielectric layer. The soldered joint is disposed between the first dielectric layer and the second dielectric layer, where the soldered joint electrically connects the first conductor path to the second conductor path. The first dielectric layer extends continuously through an area surrounding the soldered joint.

    Abstract translation: 多层电路板包括第一电介质层，第二电介质层，第一导体路径，第二导体路径和焊接接头。 第一电介质层具有第一侧和第二侧。 第二电介质层具有第一侧和第二侧，其中第二电介质层的第一侧面向第一介电层的第一侧。 第一导体路径设置在第一介电层的第一侧上。 第二导体路径设置在第二电介质层的第一侧上。 焊接接头设置在第一介电层和第二介电层之间，焊接接头将第一导体路径电连接到第二导体路径。 第一电介质层连续延伸穿过焊接接头周围的区域。

    HEAD GIMBAL ASSEMBLY AND DISK DRIVE PROVIDED WITH THE SAME
    105.
    发明申请
    HEAD GIMBAL ASSEMBLY AND DISK DRIVE PROVIDED WITH THE SAME 有权
    HEAD GIMBAL组装和磁盘驱动器

    公开(公告)号：US20100296195A1

    公开(公告)日：2010-11-25

    申请号：US12693340

    申请日：2010-01-25

    Applicant: Takafumi Kikuchi ,  Yasutaka Sasaki

    Inventor： Takafumi Kikuchi ,  Yasutaka Sasaki

    IPC: G11B5/48

    CPC classification number: G11B5/4846 ,  G11B5/486 ,  H05K1/0259 ,  H05K1/056 ,  H05K3/363 ,  H05K2201/058 ,  H05K2201/09781 ,  H05K2201/2009

    Abstract: According to one embodiment, a head gimbal assembly of a disk drive includes an arm and a suspension extending from the arm, a head supported by the suspension, and a flexure on the arm and the suspension. One end portion of the flexure is electrically connected to the head, and the other end portion thereof includes a terminal area. The flexure includes a base insulating layer, a conductor pattern formed on the base insulating layer and having a plurality of connection terminals, and a cover insulating layer formed on the base insulating layer so as to cover the conductor pattern. The connection terminals are exposed to the inside of an opening in the base and cover insulating layers with a protective insulating layer and a thin metal plate overlaid on one surface of each of the connection terminals.

    Abstract translation: 根据一个实施例，磁盘驱动器的磁头万向架组件包括臂和从臂延伸的悬架，由悬架支撑的磁头以及臂和悬架上的挠曲件。 挠曲件的一端部与头部电连接，另一端部包括端子区域。 该挠曲件包括基底绝缘层，形成在基底绝缘层上并具有多个连接端子的导体图案，以及形成在基底绝缘层上以覆盖导体图案的覆盖绝缘层。 连接端子通过保护绝缘层和覆盖在每个连接端子的一个表面上的薄金属板暴露于基部的开口的内部并覆盖绝缘层。

    TECHNIQUE FOR REDUCING WASTED MATERIAL ON A PRINTED CIRCUIT BOARD PANEL
    106.
    发明申请
    TECHNIQUE FOR REDUCING WASTED MATERIAL ON A PRINTED CIRCUIT BOARD PANEL 失效
    打印电路板面板上减少材料的技术

    公开(公告)号：US20100139085A1

    公开(公告)日：2010-06-10

    申请号：US12707412

    申请日：2010-02-17

    Applicant: Michael N. Rosenblatt ,  Amir Salehi

    Inventor： Michael N. Rosenblatt ,  Amir Salehi

    IPC: H05K3/30 ,  H05K3/36

    CPC classification number: H05K1/148 ,  H05K3/0052 ,  H05K3/007 ,  H05K3/323 ,  H05K3/341 ,  H05K3/3494 ,  H05K3/361 ,  H05K2201/058 ,  H05K2201/10393 ,  H05K2203/0152 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53265

    Abstract: A process for assembling a rigid-flex printed circuit board (PCB) is presented. During operation, the process receives rigid-flex PCBs that are to be coupled together, wherein a rigid-flex PCB includes flexible PCBs coupled to rigid PCBs. The process then places the PCBs onto a carrier which is configured to: align the PCBs so that bond regions located on the flexible PCBs overlap with bond regions located on corresponding flexible PCBs, and apply pressure to the overlapped bond regions. The process then sends the carrier through a reflow oven which reflows solder on the PCBs so that the components become mechanically and electrically coupled to the PCBs. The temperature profile generated by the reflow oven and the pressure applied by the carrier cures and sets an anisotropic conductive film located in the bond regions so that the overlapped flexible PCBs become mechanically and electrically coupled together.

    Abstract translation: 提出了一种用于组装刚性柔性印刷电路板（PCB）的工艺。 在操作过程中，该过程接收要耦合在一起的刚性柔性PCB，其中刚性柔性PCB包括耦合到刚性PCB的柔性PCB。 然后，该过程将PCB放置在载体上，该载体被配置为：对准PCB，使得位于柔性PCB上的结合区域与位于相应的柔性PCB上的结合区域重叠，并且向重叠的结合区域施加压力。 然后，该过程通过回流炉发送载体，该回流炉在PCB上重新焊接焊料，使得部件变得机械地和电耦合到PCB。 由回流炉产生的温度曲线和由载体施加的压力固化并设置位于接合区域中的各向异性导电膜，使得重叠的柔性PCB变得机械和电耦合在一起。

    FLAT PANEL DISPLAY
    109.
    发明申请
    FLAT PANEL DISPLAY 有权
    平板显示

    公开(公告)号：US20090289885A1

    公开(公告)日：2009-11-26

    申请号：US12203152

    申请日：2008-09-03

    Applicant: Chih-Chung Chao

    Inventor： Chih-Chung Chao

    IPC: G09G3/36

    CPC classification number: H05K3/363 ,  G09G3/20 ,  H05K1/147 ,  H05K2201/0397 ,  H05K2201/053 ,  H05K2201/058 ,  H05K2201/09063 ,  H05K2201/10128 ,  H05K2203/167

    Abstract: A flat panel display includes a display screen, a first flexible printed circuit, and a second flexible printed circuit. The second flexible printed circuit has a plurality of pads and is electrically connected to the display screen. The first flexible printed circuit is electrically connected between the display screen and the second flexible printed circuit and has a plurality of pins corresponding to the pads. The pins are divided into a plurality of groups, and each the group is respectively located at the different sides of the first flexible.

    Abstract translation: 平板显示器包括显示屏，第一柔性印刷电路和第二柔性印刷电路。 第二柔性印刷电路具有多个焊盘并电连接到显示屏。 第一柔性印刷电路电连接在显示屏和第二柔性印刷电路之间，并且具有对应于焊盘的多个引脚。 引脚被分成多个组，并且每个组分别位于第一柔性体的不同侧。

    THIN FILM CIRCUIT BOARD DEVICE
    110.
    发明申请
    THIN FILM CIRCUIT BOARD DEVICE 有权
    薄膜电路板设备

    公开(公告)号：US20090288871A1

    公开(公告)日：2009-11-26

    申请号：US12126588

    申请日：2008-05-23

    Applicant: Chih-Tsung Lin

    Inventor： Chih-Tsung Lin

    IPC: H05K1/00

    CPC classification number: H05K3/365 ,  H05K1/144 ,  H05K3/321 ,  H05K3/361 ,  H05K2201/055 ,  H05K2201/058 ,  H05K2201/09081 ,  H05K2203/063

    Abstract: A thin film circuit board device includes: a first thin film circuit board having a first protrusion provided with a first conductive contact; a second thin film circuit board having a second protrusion provided with a second conductive contact; and an insulator film disposed between the first and second thin film circuit boards. The first and second protrusions are disposed one above the other. The insulator film is free of a portion that extends between the first and second protrusions. The first and second protrusions are folded together in such a manner that the first and second conductive contacts are brought into contact with each other at the fold thereof.

    Abstract translation: 薄膜电路板装置包括：第一薄膜电路板，具有设置有第一导电接触的第一突起; 第二薄膜电路板，具有设置有第二导电触点的第二突起; 以及设置在第一和第二薄膜电路板之间的绝缘膜。 第一和第二突起一个在另一个之上。 绝缘膜不含在第一和第二突起之间延伸的部分。 第一和第二突起以这样的方式折叠在一起，使得第一和第二导电触点在其折叠处彼此接触。

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