公开(公告)号：US20090309679A1

公开(公告)日：2009-12-17

申请号：US12474531

申请日：2009-05-29

Applicant: Masato KIKUCHI ,  Shunsuke MOCHIZUKI ,  Masahiro YOSHIOKA ,  Ryosuke ARAKI ,  Masaki HANDA ,  Takashi NAKANISHI ,  Hiroshi ICHIKI ,  Tetsujiro KONDO

Inventor： Masato KIKUCHI ,  Shunsuke MOCHIZUKI ,  Masahiro YOSHIOKA ,  Ryosuke ARAKI ,  Masaki HANDA ,  Takashi NAKANISHI ,  Hiroshi ICHIKI ,  Tetsujiro KONDO

IPC: H01P3/08 ,  H05K1/11

CPC classification number: H05K1/0243 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01P3/003 ,  H01P3/026 ,  H01P3/081 ,  H01P3/085 ,  H01P5/028 ,  H05K1/0248 ,  H05K3/32 ,  H05K2201/09727 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2203/1469 ,  H01L2924/00014

Abstract: A connection method includes the step of connecting, using a line on a dielectric element, two points through which a signal flows, the two points having different heights and the widths of the line at the positions of the two points having been adjusted on the basis of the thickness of the dielectric element.

Abstract translation: 连接方法包括以下步骤：使用电介质元件上的线连接信号流过的两个点，具有不同高度的两个点，并且在两个点的位置处的线的宽度已经基于 介电元件的厚度。

公开(公告)号：US20090294296A1

公开(公告)日：2009-12-03

申请号：US12357909

申请日：2009-01-22

Applicant: Jungsup YUM ,  Dongki KO

Inventor： Jungsup YUM ,  Dongki KO

IPC: C25D5/54

CPC classification number: H05K3/426 ,  H05K1/0393 ,  H05K3/181 ,  H05K3/422 ,  H05K2201/0344 ,  H05K2201/09827

Abstract: A method of manufacturing a flexible film is disclosed. The method includes (a) forming at least one hole on an insulating film, (b) after the step (a), forming a first metal layer on a first surface corresponding to an inner circumferential surface of the hole, and at least one of a second surface corresponding to an upper surface of the insulating film and a third surface corresponding to a lower surface of the insulating film, and (c) forming a second metal layer on the first metal layer. A thickness of the first metal layer is smaller than a thickness of the second metal layer.

Abstract translation: 公开了制造柔性膜的方法。 该方法包括：（a）在绝缘膜上形成至少一个孔，（b）在步骤（a）之后，在对应于该孔的内周表面的第一表面上形成第一金属层，以及至少一个 与所述绝缘膜的上表面对应的第二表面和与所述绝缘膜的下表面对应的第三表面，以及（c）在所述第一金属层上形成第二金属层。 第一金属层的厚度小于第二金属层的厚度。

公开(公告)号：US20090284443A1

公开(公告)日：2009-11-19

申请号：US12357946

申请日：2009-01-22

Applicant: Jungsup Yum ,  Dongki Ko

Inventor： Jungsup Yum ,  Dongki Ko

IPC: G09G3/20 ,  B32B15/00 ,  B32B3/24 ,  B32B3/00

CPC classification number: H05K3/181 ,  H05K1/0393 ,  H05K3/422 ,  H05K3/426 ,  H05K2201/0338 ,  H05K2201/0344 ,  H05K2201/09827 ,  Y10T428/12375 ,  Y10T428/12396 ,  Y10T428/12472 ,  Y10T428/12493 ,  Y10T428/12569 ,  Y10T428/12771 ,  Y10T428/12847 ,  Y10T428/12889 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12944

Abstract: A flexible film and a display device including the same are disclosed. The flexible film includes an insulating film including at least one hole. The insulating film further includes a first surface corresponding to an inner circumferential surface of the hole, a second surface corresponding to an upper surface of the insulating film, and a third surface corresponding to a lower surface of the insulating film. The flexible film includes a first metal layer and a second metal layer that is positioned on the first surface and at least one of the second and third surfaces. A thickness of the first metal layer is smaller than a thickness of the second metal layer.

Abstract translation: 公开了一种柔性膜和包括该柔性膜的显示装置。 柔性膜包括包括至少一个孔的绝缘膜。 绝缘膜还包括对应于孔的内周面的第一表面，对应于绝缘膜的上表面的第二表面和对应于绝缘膜的下表面的第三表面。 柔性膜包括第一金属层和位于第一表面上的第二金属层和第二表面和第三表面中的至少一个。 第一金属层的厚度小于第二金属层的厚度。

公开(公告)号：US20090233468A1

公开(公告)日：2009-09-17

申请号：US12285893

申请日：2008-10-16

Applicant: Shiro Yamashita ,  Hideto Yoshinari

Inventor： Shiro Yamashita ,  Hideto Yoshinari

IPC: H01R12/00

CPC classification number: H05K1/119 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/141 ,  H05K3/308 ,  H05K3/42 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K2201/10803 ,  Y10S439/941

Abstract: In a module, press-fit connection using a pin terminal including a connection part separated into two parts and a flat plane parallel to the lengthwise direction in the separation part and perpendicular to the separation direction of the pin terminal is performed. A through-hole of a board is structured so that an inner diameter of the through-hole at a middle part in the thickness direction of the board is smaller than that at obverse and reverse surfaces of the board and the length of the middle part of the through-hole connected to the pin terminal is shorter than the length of the flat plane of the pin terminal.

Abstract translation: 在模块中，使用包括分离成两部分的连接部分的引脚端子和在分离部分中与长度方向平行的平面并且垂直于引脚端子的分离方向的压配合连接。 板的通孔的结构使得板的厚度方向中间部分处的通孔的内径小于板的正面和反面以及中间部分的长度 连接到引脚端子的通孔比引脚端子的平面的长度短。

公开(公告)号：US07542301B1

公开(公告)日：2009-06-02

申请号：US11159574

申请日：2005-06-22

Applicant: Lily Liong ,  Kenneth D. Schatz ,  Gordon Craig ,  Mark A. Hadley ,  Eric Kanemoto

Inventor： Lily Liong ,  Kenneth D. Schatz ,  Gordon Craig ,  Mark A. Hadley ,  Eric Kanemoto

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H01L24/19 ,  H01L24/24 ,  H01L24/95 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24101 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K3/0014 ,  H05K3/321 ,  H05K3/368 ,  H05K2201/09036 ,  H05K2201/0949 ,  H05K2201/09827 ,  H05K2201/10674 ,  H05K2201/10727 ,  H05K2203/0108 ,  H05K2203/0143 ,  H05K2203/1545 ,  H01L2224/82 ,  H01L2924/00

Abstract: An embossing die, the die comprises one or more protruding features configured to create one or more corresponding recessed regions in a substrate; and a left side edge and a right side edge. Either the left side edge or the right side edge is a gradually sloping edge. The embossing die can be used to form an assembly. The assembly comprises a substrate including a more than one defined frames. Each of the defined frames comprises a plurality of recessed regions and a plurality of functional blocks, each functional block being deposited in one of the recessed regions. Each of the defined frames is separated from another frame by a region. The region can be a flattened region, a sloped region, or a plateau shaped region having a plateau top and two sloped sides, wherein each sloped side forms about 10-15 degree angle to a surface of the substrate.

Abstract translation: 压模包括一个或多个突出特征，其被配置为在基底中产生一个或多个相应的凹陷区域; 以及左侧边缘和右侧边缘。 左侧边缘或右侧边缘都是逐渐倾斜的边缘。 压花模具可用于形成组件。 组件包括包括多于一个定义的框架的基板。 每个定义的框架包括多个凹陷区域和多个功能块，每个功能块被沉积在一个凹进区域中。 每个定义的帧与另一个帧分开一个区域。 该区域可以是具有平台顶部和两个倾斜侧面的扁平区域，倾斜区域或平台形区域，其中每个倾斜侧面与基底的表面形成约10-15度的角度。

公开(公告)号：US07476814B2

公开(公告)日：2009-01-13

申请号：US11603239

申请日：2006-11-22

Applicant: Yoshiteru Ochi ,  Nobutaka Itoh

Inventor： Yoshiteru Ochi ,  Nobutaka Itoh

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K1/115 ,  H05K1/0271 ,  H05K3/4644 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09827

Abstract: A multilayer interconnection board includes a plurality of stacked insulation layers, wiring layers in the insulation layers, and via forming parts for interlayer connection, the via forming parts piercing the insulation layers. In the multilayer interconnection board, 0

Abstract translation: 多层互连板包括多个堆叠绝缘层，绝缘层中的布线层和用于层间连接的通孔形成部件，穿孔绝缘层的通孔形成部件。 在多层互连板中，设定0

公开(公告)号：US20080237882A1

公开(公告)日：2008-10-02

申请号：US11731432

申请日：2007-03-30

Applicant: Islam Salama

Inventor： Islam Salama

IPC: H01L23/52 ,  H01L21/44

CPC classification number: H01L23/5226 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/0035 ,  H05K3/421 ,  H05K2201/09827 ,  H05K2201/09836 ,  H01L2924/00

Abstract: In some embodiments, annular via drilling (AVD) technology is presented. In this regard, an annular via is introduced comprising an inner wall and an outer wall, the inner wall and the outer wall coupled with a dielectric layer and extending linearly from a surface of a conductor to a top of the dielectric layer. Other embodiments are also disclosed and claimed.

Abstract translation: 在一些实施例中，呈现环形通孔钻孔（AVD）技术。 在这方面，引入环形通孔，其包括内壁和外壁，内壁和外壁与电介质层耦合并且从导体的表面线性地延伸到电介质层的顶部。 还公开并要求保护其他实施例。

公开(公告)号：US20080203420A1

公开(公告)日：2008-08-28

申请号：US10589747

申请日：2005-07-21

Applicant: Kenjiro Higaki ,  Daisuke Takagi ,  Sadamu Ishidu ,  Yasushi Tsuzuki

Inventor： Kenjiro Higaki ,  Daisuke Takagi ,  Sadamu Ishidu ,  Yasushi Tsuzuki

IPC: H01L33/00 ,  H01L23/14 ,  H01L31/0203 ,  H05K1/09

CPC classification number: H01L33/62 ,  H01L23/49827 ,  H01L24/97 ,  H01L31/02002 ,  H01L31/0203 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09827 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A collective substrate (1) is produced by firing a ceramic green sheet and forming through-holes (11) in the resulting substrate. The through-holes (11) each have an interior surface including taper surfaces (11b, 11c) which are tapered as having an opening size progressively decreasing from a main surface (21) and an external connection surface (22) toward a minimum size hole portion (11a). The taper surfaces (11b, 11c) respectively form obtuse angles θ1, θ2 with the main surface (21) and the external connection surface (22). A semiconductor element mount (BL) includes an insulative member (2) cut out of the collective substrate (1). An imaging device (PE2) includes an imaging element (PE1) mounted in a region surrounded by a frame (4) which is bonded to the main surface (21) of the insulative member (2) and closed by a cover (FL). A light emitting diode component (LE2) includes a light emitting element (LE1) mounted on the main surface (21) of the insulative member (2) with the minimum size hole portion (11a) of the through-hole being filled with an electrically conductive material (33a), the light emitting element being sealed with a fluorescent material and/or a protective resin (FR). A light emitting diode (LE3) includes the light emitting diode component (LE2) mounted in a package (7).

Abstract translation: 通过烧制陶瓷生片并在所得到的衬底中形成通孔（11）来制备集合衬底（1）。 通孔（11）各自具有包括锥形表面（11b，11c）的内表面，该锥形表面（11b，11c）从开口尺寸从主表面（21）和外部连接表面（22）逐渐减小到最小 大小孔部分（11a）。 锥形表面（11b，11c）分别与主表面（21）和外部连接表面（22）分别形成钝角θ1，θ2。 半导体元件安装件（BL）包括从集体基板（1）切出的绝缘构件（2）。 成像装置（PE2）包括安装在由框架（4）包围的区域中的成像元件（PE 1），该框架结合到绝缘构件（2）的主表面（21）并由盖（FL ）。 发光二极管部件（LE2）包括安装在绝缘部件（2）的主表面（21）上的发光元件（LE 1），其中填充有通孔的最小尺寸的孔部分（11a） 用导电材料（33a），发光元件用荧光材料和/或保护树脂（FR）密封。 发光二极管（LE 3）包括安装在封装（7）中的发光二极管部件（LE 2）。

公开(公告)号：US20080189943A1

公开(公告)日：2008-08-14

申请号：US12098582

申请日：2008-04-07

Applicant: Naohiro HIROSE ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro HIROSE ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H05K3/42 ,  H01L21/306

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口部20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US20080173473A1

公开(公告)日：2008-07-24

申请号：US11875486

申请日：2007-10-19

Applicant: Naohiro HIROSE ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro HIROSE ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H01R12/04

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口部20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。