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公开(公告)号:US20230221112A1
公开(公告)日:2023-07-13
申请号:US17574055
申请日:2022-01-12
Applicant: Applied Materials Israel Ltd.
Inventor: David Goldovsky , Ido Almog , Ronny Barnea
IPC: G01B15/04 , H01J37/28 , H01J37/244 , H01J37/285
CPC classification number: G01B15/04 , H01J37/28 , H01J37/244 , H01J37/285
Abstract: Disclosed herein is a system for profiling holes in non-opaque samples. The system includes: (i) an e-beam source configured to project an e-beam into an inspection hole in a sample, such that a wall of the inspection hole is struck and a localized electron cloud is produced; (ii) a light sensing infrastructure configured to sense cathodoluminescent light, generated by the electron cloud; and (iii) a computational module configured to analyze the measured signal to obtain the probed depth at which the wall was struck. A lateral offset, and/or orientation, of the e-beam is controllable, so as to allow generating localized electron clouds at each of a plurality of depths inside the inspection hole, and thereby obtain information at least about a two-dimensional geometry of the inspection hole.
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公开(公告)号:US11699567B2
公开(公告)日:2023-07-11
申请号:US17534865
申请日:2021-11-24
Applicant: JEOL Ltd.
Inventor: Takanori Murano
IPC: H01J37/28 , H01J37/244
CPC classification number: H01J37/28 , H01J37/244 , H01J2237/2446 , H01J2237/2801
Abstract: A mask member is provided at an entrance opening of a mirror unit. Of a first diffraction grating and a second diffraction grating, when the second diffraction grating is used, the mask member masks preceding mirrors. With this process, aberration caused by reflective X-ray is suppressed. When the first diffraction grating is used, the mask member does not function. Alternatively, the mask member and another mask member may be selectively used.
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公开(公告)号:US20230215686A1
公开(公告)日:2023-07-06
申请号:US18181395
申请日:2023-03-09
Applicant: Carl Zeiss MultiSEM GmbH
Inventor: Dirk Zeidler , Gregor Dellemann , Gunther Scheunert
IPC: H01J37/244 , H01J37/28
CPC classification number: H01J37/244 , H01J37/28 , H01J2237/2443 , H01J2237/2445 , H01J2237/2446 , H01J2237/24495 , H01J2237/24578
Abstract: A method for operating a multi-beam particle beam microscope includes: scanning a multiplicity of particle beams over an object; directing electron beams emanating from impingement locations of the particle beams at the object onto an electron converter; detecting first signals generated by impinging electrons in the electron converter via a plurality of detection elements of a first detection system during a first time period; detecting second signals generated by impinging electrons in the electron converter via a plurality of detection elements of a second detection system during a second time period; and assigning to the impingement locations the signals which were detected via the detection elements of the first detection system during the first time period, for example on the basis of the detection signals which were detected via the detection elements of the second detection system during the second time period.
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公开(公告)号:US20230207259A1
公开(公告)日:2023-06-29
申请号:US18088499
申请日:2022-12-23
Applicant: ASML Netherlands B.V.
Inventor: Erwin SLOT , Niels VERGEER , Vincent Sylvester KUIPER
IPC: H01J37/304 , H01J37/28
CPC classification number: H01J37/3045 , H01J37/28 , H01J2237/1501
Abstract: The present invention concerns a method of determining alignment of electron optical components in a charged particle apparatus. The charged particle apparatus comprising: an aperture array and a detector configured to detect charged particles corresponding to beamlets that pass through the corresponding apertures in the aperture array. The method comprises: scanning each beamlet in a plane of the aperture array over a portion of the aperture array in which a corresponding aperture of the aperture array is defined so that charged particles of each beamlet may pass through the corresponding aperture; detecting during the scan any charged particles corresponding to each beamlet that passes through the corresponding aperture; generating a detection pixel for each beamlet based on the detection of charged particles corresponding to each beamlet at intervals of the scan; and collecting information comprised in the detection pixel such as the intensity of charged particles.
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公开(公告)号:US20230170182A1
公开(公告)日:2023-06-01
申请号:US17921737
申请日:2020-04-28
Applicant: Hitachi High-Tech Corporation
Inventor: Kazufumi YACHI , Muneyuki FUKUDA , Ichiro TACHIBANA , Hiroya OHTA
IPC: H01J37/28 , H01J37/244 , H01J37/145
CPC classification number: H01J37/28 , H01J37/145 , H01J37/244 , H01J2237/057 , H01J2237/2806
Abstract: Proposed is a charged particle beam apparatus for the purpose of detecting a charged particle emitted from a sample in a specific direction by discriminating between the charged particle and a charged particle emitted in another direction. As one aspect of achieving the above purpose, proposed is a charged particle beam apparatus including an objective lens configured to focus a beam emitted from a charged particle source, a detector (8) configured to detect at least one of a first charged particle (23) emitted from a sample by irradiating the sample with the beam and a second charged particle emitted from a charged particle collided member by causing the first charged particle to collide with the charged particle collision member disposed on a trajectory of the first charged particle, and an electrostatic lens (12) including a plurality of electrodes disposed between the objective lens and the detector, in which the electrostatic lens is a Butler type.
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公开(公告)号:US11664187B2
公开(公告)日:2023-05-30
申请号:US17344134
申请日:2021-06-10
Applicant: Intel Corporation
Inventor: Amir Raveh , Gideon Reisfeld , Patrick Pardy
IPC: H01J37/304 , H01J37/153 , H01J37/12 , H01J37/14 , G02B26/08 , H01J37/244 , H01J37/28 , H01J37/305 , H01J37/317
CPC classification number: H01J37/153 , G02B26/0816 , H01J37/12 , H01J37/14 , H01J37/244 , H01J37/304 , H01J37/28 , H01J37/3053 , H01J37/3174 , H01J2237/153 , H01J2237/24585
Abstract: An apparatus comprising a beam emitter to emit a beam comprising electrons, ions or laser-light photons toward a target substrate. A motion sensor to detect mechanical vibrations of the target substrate. The motion sensor is mechanically coupled to the target substrate, a processor coupled to an output of the motion sensor. The processor is to generate a vibration correction signal proportional to the mechanical vibrations detected by the motion sensor, and beam steering optics coupled to the processor. The beam steering optics are to deflect the beam according to the vibration correction signal to compensate for the mechanical vibrations of the target substrate.
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107.
公开(公告)号:US20230162944A1
公开(公告)日:2023-05-25
申请号:US17916785
申请日:2021-03-31
Applicant: ASML Netherlands B.V.
Inventor: Xiang WANG , Steffen MEYER , Mark O'MAHONY
CPC classification number: H01J37/222 , H01J37/28 , H01J2237/2817 , H01J2237/2809 , H01J2237/0044 , H01J2237/282
Abstract: An improved method and apparatus for enhancing an inspection image in a charged-particle beam inspection system. An improved method for enhancing an inspection image comprises acquiring a plurality of test images of a sample that are obtained at different landing energies, determining distortion levels for the plurality of test images, determining a landing energy level that enables the sample to be in a neutral charge condition during inspection based on the distortion levels, and acquiring an inspection image based on the determined landing energy level.
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公开(公告)号:US20230162943A1
公开(公告)日:2023-05-25
申请号:US17915034
申请日:2020-03-31
Applicant: Hitachi High-Tech Corporation
Inventor: U OH , Minoru YAMAZAKI , Yuko SASAKI
IPC: H01J37/22 , H01J37/28 , G01N23/2251 , G06F16/2455
CPC classification number: H01J37/222 , H01J37/28 , G01N23/2251 , G06F16/2455 , H01J2237/24564 , H01J2237/24521 , H01J2237/24578 , G01N2223/07 , G01N2223/418 , G01N2223/507 , G01N2223/6116
Abstract: The present invention provides a charged particle beam device with which optimal parameters for the device can be effectively derived in a short time period. This charged particle beam device comprises: an electron gun (1) that irradiates a sample (10) with an electron beam (2); an image processing unit (901) that acquires an image of the sample (10) from a signal (12) generated by the sample (10) due to the electron beam (2); a database (604) that holds correspondence between a first parameter that is an optical condition, a second parameter that is a value pertaining to device performance, and a third parameter that is information pertaining to the device configuration, and stores a plurality of analysis values and measurement values; and a learning machine (605) that searches the database (604) and derives a first parameter that satisfies a target value of the second parameter.
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公开(公告)号:US11650171B2
公开(公告)日:2023-05-16
申请号:US17357409
申请日:2021-06-24
Applicant: FEI Company
Inventor: Han Han , Libor Strakos , Thomas Hantschel , Tomas Vystavel , Clement Porret
IPC: H01J37/244 , G01N23/203 , H01J37/28
CPC classification number: G01N23/203 , H01J37/244 , H01J37/28 , G01N2223/6116
Abstract: Methods and apparatus determine offcut angle of a crystalline sample using electron channeling patterns (ECPs), wherein backscattered electron intensity exhibits angular variation dependent on crystal orientation. A zone axis normal to a given crystal plane follows a circle as the sample is azimuthally rotated. On an ECP image presented with tilt angles as axes, the radius of the circle is the offcut angle of the sample. Large offcut angles are determined by a tilt technique that brings the zone axis into the ECP field of view. ECPs are produced with a scanning electron beam and a monolithic backscattered electron detector; or alternatively with a stationary electron beam and a pixelated electron backscatter diffraction detector. Applications include strain engineering, process monitoring, detecting spatial variations, and incoming wafer inspection. Methods are 40× faster than X-ray diffraction. 0.01-0.1° accuracy enables semiconductor applications.
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110.
公开(公告)号:US11645740B2
公开(公告)日:2023-05-09
申请号:US17192637
申请日:2021-03-04
Applicant: Carl Zeiss MultiSEM GmbH
Inventor: Dirk Zeidler , Michael Behnke , Stefan Schubert , Christof Riedesel
CPC classification number: G06T5/009 , G06T5/40 , G06T5/50 , H01J37/244 , H01J37/28 , G06T2207/10061 , H01J2237/2443 , H01J2237/24445 , H01J2237/2811
Abstract: A method for detector equalization during the imaging of objects with a multi-beam particle microscope includes performing an equalization on the basis of individual images in or on the basis of overlap regions. For detector equalization, contrast values and/or brightness values are used and iterative methods can be employed.
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