Abstract:
A scanning electron microscope has an electron gun producing the electron beam, an objective lens for sharply focusing the beam onto the specimen, a tilting mechanism for tilting the specimen relative to the beam, and a power supply for applying the negative voltage to the specimen. This microscope further includes a cylindrical shield electrode mounted to surround the electron beam path between the objective lens and specimen. A front-end electrode is insulatively mounted to the front-end portion of the shield electrode that is on the specimen side. An electric potential substantially identical to the electric potential at the polepieces of the objective lens is applied to the shield electrode. An electric potential substantially identical to the potential at the specimen is applied to the front-end electrode.
Abstract:
An ion-implanting apparatus and method that can dynamically control a beam current value with time and does not change energy. This ion-implanting apparatus controls a dynamic change in beam current value with time by giving feedback on the beam current value measured with a beam current measuring means.
Abstract:
An ion beam current density profiler includes a pair of counter-rotating cylindrical masks each featuring a helical slot. The intersection of the slots forms an aperture that scans the width of a ribbon ion beam to allow discrete portions of the beam to impact an inner, concentric current collecting cylinder.
Abstract:
A charged particle beam apparatus includes: a charged particle beam generator which generates a charged particle beam; a projection optical system which generates a lens field to focus the charged particle beam on an external substrate; and deflectors arranged so as to surround an optical axis of the charged particle beam; the deflectors generating a deflection field which is superposed on the lens field to deflect the charged particle beam and to control a position to irradiate the substrate, and being configured so that intensity of the deflection field in a direction of the optical axis is changed in accordance with an angle with which the charged particle beam should fall onto the substrate.
Abstract:
A charged beam apparatus of this invention comprises a sample table on which a sample is placed, a column for irradiating a charged beam on a surface of the sample, a gas supply mechanism having a gas supply opening for injecting a gas to an irradiated position of the charged beam, and a driving mechanism for moving the gas supply opening parallel to the surface of the sample in order to position the gas supply opening, and moving the gas supply opening perpendicularly to the surface of the sample in order to set a distance from the gas supply opening to a processing position. This allows the gas pressure to be stably held with a high accuracy at the processing position. Accordingly, desired deposition or etching can be performed with a high accuracy, and this further improves the quality of the mask.
Abstract:
An electron image projector for projecting mask patterns with unity magnification onto a semiconductor slice comprises a cathode from which emitted electrons are accelerated by a uniform electric field and focussed by a uniform magnetic field onto a target. To reduce the dependency of electron trajectories on the local shape and disposition of the target, the uniform electric field is applied by an accelerating voltage between the cathode and a grid electrode acting as the anode between the cathode and target. The grid is positioned at a first magnetic focus, and the target is positioned at a second magnetic focus of the uniform magnetic field. A small voltage much less than the accelerating voltage may be applied between the grid and the target to obtain correct focussing. Structure is also provided to move the grid parallel to the target during exposure in order to prevent the grid pattern from being reproduced on the target. A backscattered electron detector positioned adjacent the field-free region between the grid and the target may be used to control alignment of the projected image with the target.
Abstract:
A multi-beam apparatus for observing a sample with high resolution and high throughput is proposed. In the apparatus, a source-conversion unit forms plural and parallel images of one single electron source by deflecting plural beamlets of a parallel primary-electron beam therefrom, and one objective lens focuses the plural deflected beamlets onto a sample surface and forms plural probe spots thereon. A movable condenser lens is used to collimate the primary-electron beam and vary the currents of the plural probe spots, a pre-beamlet-forming means weakens the Coulomb effect of the primary-electron beam, and the source-conversion unit minimizes the sizes of the plural probe spots by minimizing and compensating the off-axis aberrations of the objective lens and condenser lens.
Abstract:
The invention relates to charged particle beam generator comprising a charged particle source for generating a charged particle beam, a collimator system comprising a collimator structure with a plurality of collimator electrodes for collimating the charged particle beam, a beam source vacuum chamber comprising the charged particle source, and a generator vacuum chamber comprising the collimator structure and the beam source vacuum chamber within a vacuum, wherein the collimator system is positioned outside the beam source vacuum chamber. Each of the beam source vacuum chamber and the generator vacuum chamber may be provided with a vacuum pump.
Abstract:
The present invention relates to a hybrid chamber, and more specifically, to a hybrid chamber capable of performing both a gas phase etching (GPE) process for removing oxide from a substrate and a radical dry cleaning (RDC) process for removing nitride from the substrate in one chamber.
Abstract:
A deposition apparatus including: a processing chamber; a rotary table provided in the processing chamber; a first processing region provided at a predetermined position in a circumferential direction of the rotary table; a second processing region provided downstream of the first processing region in the circumferential direction of the rotary table; a third processing region provided downstream of the second processing region in the circumferential direction of the rotary table; a first heater provided above the rotary table in the second processing region; and a plasma generator. The plasma generator includes: a protrusion having a longitudinally elongated shape in a planar view extending along a radius of the rotary table in a portion of an upper surface of the processing chamber, and protruding upward from the upper surface; and a coil wound along a side surface of the protrusion and has a longitudinally elongated shape in a planar view.