公开(公告)号：US20090205200A1

公开(公告)日：2009-08-20

申请号：US12062855

申请日：2008-04-04

Applicant: Michael N. Rosenblatt ,  Amir Salehi

Inventor： Michael N. Rosenblatt ,  Amir Salehi

IPC: H01R43/00

CPC classification number: H05K1/148 ,  H05K3/0052 ,  H05K3/007 ,  H05K3/323 ,  H05K3/341 ,  H05K3/3494 ,  H05K3/361 ,  H05K2201/058 ,  H05K2201/10393 ,  H05K2203/0152 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53265

Abstract: A process for assembling a rigid-flex printed circuit board (PCB) is presented. During operation, the process receives rigid-flex PCBs that are to be coupled together, wherein a rigid-flex PCB includes flexible PCBs coupled to rigid PCBs. The process then places the PCBs onto a carrier which is configured to: align the PCBs so that bond regions located on the flexible PCBs overlap with bond regions located on corresponding flexible PCBs, and apply pressure to the overlapped bond regions. The process then sends the carrier through a reflow oven which reflows solder on the PCBs so that the components become mechanically and electrically coupled to the PCBs. The temperature profile generated by the reflow oven and the pressure applied by the carrier cures and sets an anisotropic conductive film located in the bond regions so that the overlapped flexible PCBs become mechanically and electrically coupled together.

Abstract translation: 提出了一种用于组装刚性柔性印刷电路板（PCB）的工艺。 在操作过程中，该过程接收要耦合在一起的刚性柔性PCB，其中刚性柔性PCB包括耦合到刚性PCB的柔性PCB。 然后，该过程将PCB放置在载体上，该载体被配置为：对准PCB，使得位于柔性PCB上的结合区域与位于相应的柔性PCB上的结合区域重叠，并且向重叠的结合区域施加压力。 然后，该过程通过回流炉发送载体，该回流炉在PCB上重新焊接焊料，使得部件变得机械地和电耦合到PCB。 由回流炉产生的温度曲线和由载体施加的压力固化并设置位于接合区域中的各向异性导电膜，使得重叠的柔性PCB变得机械和电耦合在一起。

公开(公告)号：US07410362B2

公开(公告)日：2008-08-12

申请号：US11889878

申请日：2007-08-17

Applicant: Yung-Wei Chou

Inventor： Yung-Wei Chou

IPC: H01R12/00

CPC classification number: H01R12/00 ,  H01R4/027 ,  H01R12/7076 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/048 ,  H05K2201/058 ,  H05K2201/09081

Abstract: A connecting structure of a printed circuit board of a liquid crystal display (LCD) module includes a double side printed circuit board and a single side printed circuit board. With the design of the double side printed circuit board having a solder element with two solder surfaces with a plurality of plated through holes (PTHs), and the design of the opening neighboring the solder element, the conducting surface of the single side printed circuit board may easily accord with the structural requirements to select the corresponding solder surface for performing welding.

公开(公告)号：US07286370B2

公开(公告)日：2007-10-23

申请号：US11135511

申请日：2005-05-24

Applicant: Yasunari Ooyabu

Inventor： Yasunari Ooyabu

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/142 ,  H01R12/61 ,  H05K3/0058 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/058 ,  H05K2201/0969 ,  H05K2201/2009

Abstract: A wired circuit board is provided that is formed by connecting a first wired circuit board and a second wired circuit board, which include a first connection terminal and a second connection terminal, respectively. A solder bump is provided to continuously extend over surfaces of the first connection terminal and the second connection terminal to mechanically couple the first wired circuit board and the second wired circuit board. Consequently, the solder bump is not interposed between opposed surfaces of the first connection terminal and the second connection terminal, thereby allowing the electrical connection provided by the solder bump to be confirmed by visual observation.

Abstract translation: 提供一种布线电路板，其通过分别连接包括第一连接端子和第二连接端子的第一布线电路板和第二布线电路板而形成。 提供焊料凸块以连续地延伸到第一连接端子和第二连接端子的表面上以机械地耦合第一布线电路板和第二布线电路板。 因此，在第一连接端子和第二连接端子的相对面之间没有插入焊料凸块，从而通过目视观察来确认由焊料凸块提供的电连接。

公开(公告)号：US07202555B2

公开(公告)日：2007-04-10

申请号：US11074026

申请日：2005-03-08

Applicant: David L. Roper ,  James W. Cady ,  James Wilder ,  James Douglas Wehrly, Jr. ,  Jeff Buchle ,  Julian Dowden

Inventor： David L. Roper ,  James W. Cady ,  James Wilder ,  James Douglas Wehrly, Jr. ,  Jeff Buchle ,  Julian Dowden

IPC: H01L23/02

CPC classification number: H01L23/49816 ,  H01L23/3114 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/5386 ,  H01L23/5387 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16237 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/363 ,  H05K2201/056 ,  H05K2201/058 ,  H05K2201/10734 ,  H01L2924/0001

Abstract: The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two integrated circuits are connected with a pair of flexible circuit structures. Each of the pair of flexible circuit structures is partially wrapped about a respective opposite lateral edge of the lower integrated circuit of the module. The flex circuit pair connects the upper and lower integrated circuits and provides a thermal and electrical path connection path between the module and its application environment. The module has a bailout pattern with a different pitch and/or supplemental module contacts devised to allow combined signaling to the integrated circuits through contacts having a desired ballout footprint. The present invention may be employed to advantage in numerous configurations and combinations of integrated circuits in modules provided for high-density memories or high capacity computing.

Abstract translation: 本发明将集成电路堆叠成节省电路板表面积的模块。 在根据本发明的优选实施例设计的两高堆叠或模块中，堆叠一对集成电路，一个集成电路在另一个之上。 两个集成电路与一对柔性电路结构连接。 一对柔性电路结构中的每一个部分地缠绕在模块的下部集成电路的相应的相对侧边缘上。 柔性电路对连接上下集成电路，并在模块与其应用环境之间提供热和电路连接路径。 该模块具有一个具有不同间距和/或补充模块触点的救援模式，用于允许通过具有期望的展开足迹的触点对集成电路的组合信令。 本发明可以有利于提供用于高密度存储器或高容量计算的模块中的集成电路的多种配置和组合。

公开(公告)号：US20050190489A1

公开(公告)日：2005-09-01

申请号：US10893301

申请日：2004-07-19

Applicant: Mitsuhiro Izumi ,  Mitsuaki Yoshida ,  Hisashi Kaneko ,  Tsuneyori Ino ,  Yukihiro Komura ,  Shinji Fujimoto ,  Kei Funabashi

Inventor： Mitsuhiro Izumi ,  Mitsuaki Yoshida ,  Hisashi Kaneko ,  Tsuneyori Ino ,  Yukihiro Komura ,  Shinji Fujimoto ,  Kei Funabashi

IPC: G11B33/12 ,  G11B5/012 ,  G11B17/00 ,  G11B21/02 ,  G11B33/08 ,  G11B33/14 ,  H05K1/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/36 ,  H05K7/14

CPC classification number: G11B33/121 ,  G11B5/4846 ,  G11B33/08 ,  G11B33/122 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/281 ,  H05K3/363 ,  H05K2201/0133 ,  H05K2201/058 ,  H05K2201/09063 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/09918 ,  H05K2201/10386 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/2045 ,  H05K2203/0191 ,  H05K2203/166 ,  H05K2203/167

Abstract: A fixing member is spaced from a head actuator by a predetermined distance. A flexible printed circuit board extends at least from the head actuator to the fixing member. The flexible printed circuit board is superposed on the surface of the fixing member. A viscoelastic layer and a protecting layer are overlaid on the surface of the flexible printed circuit board. A clip clips all the fixing member, the flexible printed circuit board, the viscoelastic layer and the protecting layer together. When a head slider is positioned, the head actuator changes its attitude relative to a recording disk. The inertial force based on the rotation causes the first flexible printed circuit board to vibrate when the actuator block stops rotating. The viscoelastic layer serves to absorb this residual vibration of the first flexible printed circuit board. Vibration of the flexible printed circuit board can be suppressed.

Abstract translation: 固定构件与头致动器间隔预定距离。 柔性印刷电路板至少从头致动器延伸到固定构件。 柔性印刷电路板叠置在固定部件的表面上。 粘弹性层和保护层覆盖在柔性印刷电路板的表面上。 A夹将所有固定构件，柔性印刷电路板，粘弹性层和保护层夹在一起。 当头部滑块定位时，头部致动器相对于记录盘改变其姿态。 当致动器块停止转动时，基于旋转的惯性力使第一柔性印刷电路板振动。 粘弹性层用于吸收第一柔性印刷电路板的残余振动。 可以抑制柔性印刷电路板的振动。

公开(公告)号：US11690175B2

公开(公告)日：2023-06-27

申请号：US17331087

申请日：2021-05-26

Applicant: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Chang Liu

IPC: H05K1/14 ,  H05K1/18 ,  H01L25/18 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/147 ,  H01L25/18 ,  H05K1/189 ,  H05K1/0346 ,  H05K1/09 ,  H05K2201/0154 ,  H05K2201/049 ,  H05K2201/058 ,  H05K2201/10128 ,  H05K2201/10136

Abstract: A connection structure configured to connect a display panel and a circuit board, includes a flexible printed circuit, a first chip-on-film, and a second chip-on-film. The first chip-on-film and the second chip-on-film are coupled to one end of the flexible printed circuit. The first chip-on-film and the second chip-on-film are coupled to two surfaces of the flexible printed circuit that are opposite in a thickness direction of the flexible printed circuit.

公开(公告)号：US20180375235A1

公开(公告)日：2018-12-27

申请号：US15988653

申请日：2018-05-24

Applicant: JOLED INC.

Inventor： Yutaka NAKANO

IPC: H01R12/62 ,  H01R12/61 ,  H05K1/14 ,  H05K3/36

CPC classification number: H01R12/62 ,  H01R12/613 ,  H05K1/142 ,  H05K1/147 ,  H05K3/361 ,  H05K2201/049 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/058 ,  H05K2201/10128

Abstract: A first wiring plate is a flexible wiring plate to be directly connected to a display panel, and includes a first connector. The first connector is directly connected to a second connector included in a second wiring plate to be directly connected to the display panel.

公开(公告)号：US20180077808A1

公开(公告)日：2018-03-15

申请号：US15656491

申请日：2017-07-21

Applicant: Samsung Display Co., Ltd.

Inventor： Tae An SEO ,  Jung Hun LEE ,  Jin Hwan CHOI

IPC: H05K5/00 ,  G06F3/044 ,  H05K5/02 ,  H05K1/14 ,  H05K1/18

CPC classification number: H05K5/0017 ,  G06F1/1624 ,  G06F1/1643 ,  G06F1/1652 ,  G06F3/0416 ,  G06F3/044 ,  G06F2203/04102 ,  G09F9/301 ,  H05K1/144 ,  H05K1/147 ,  H05K1/189 ,  H05K5/0217 ,  H05K2201/051 ,  H05K2201/058 ,  H05K2201/10151

Abstract: A display device may include a support plate, a first display unit, a second display unit, a third display unit, a pad, and a circuit board. The first display unit overlaps the support plate. The second display unit is connected to the first display unit. A portion of the second display unit may move relative to the support plate. The third display unit is connected through the first display unit to the second display unit. A portion of the third display may move relative to the support plate. The pad includes a pad electrode that is electrically connected to the first display unit. The circuit board is electrically connected to the pad. A first section of the circuit board is bent relative to a second section of the circuit board and is oriented perpendicular or oblique with respect to the first display unit.

公开(公告)号：US09898056B2

公开(公告)日：2018-02-20

申请号：US13922136

申请日：2013-06-19

Applicant: SMART Storage Systems, Inc.

Inventor： David Lee Dean ,  Dennis Bennett ,  Robert W. Ellis

IPC: G06F1/20 ,  H05K7/20 ,  H05K1/14 ,  H05K5/00 ,  H05K1/11 ,  G06F1/18 ,  G01R31/20

CPC classification number: G06F1/20 ,  G01R31/20 ,  G06F1/186 ,  H05K1/118 ,  H05K1/14 ,  H05K1/144 ,  H05K1/148 ,  H05K5/0026 ,  H05K7/20 ,  H05K2201/042 ,  H05K2201/058 ,  Y10T29/49002

Abstract: An electronic assembly and method of manufacturing includes: an airflow bracket having a circular rail and an airflow tab, the airflow bracket electrically coupling the circular rail and the airflow tab; a top board attached to the circular rail for electrically coupling the top board and the circular rail; and a bottom board attached to the circular rail for electrically coupling the top board and the circular rail, the bottom board positioned to form a thermal channel between the top board and the bottom board for directing air through a vent opening of the circular rail.

公开(公告)号：US09888567B2

公开(公告)日：2018-02-06

申请号：US14989921

申请日：2016-01-07

Applicant: SK hynix Inc.

Inventor： Seung Yeop Lee ,  Joo Hyun Kang ,  Jong Hoon Kim ,  Han Jun Bae

IPC: H05K1/11 ,  H05K1/02 ,  H01L23/538 ,  H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H05K1/14

CPC classification number: H05K1/028 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5387 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/97 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/14 ,  H05K1/147 ,  H05K2201/0385 ,  H05K2201/05 ,  H05K2201/058 ,  H01L2924/00012

Abstract: A flexible device includes a first conductive pattern, a second conductive pattern, and a dielectric layer. The first conductive pattern includes a first sliding contact portion and a first extension portion. The second conductive pattern includes a second sliding contact portion overlapping with the first sliding contact portion and the second conductive pattern includes a second extension portion. The second sliding contact portion is in contact with the first sliding contact portion and is movable on the first sliding contact portion for a sliding motion. The first and second conductive patterns are embedded in the dielectric layer.