公开(公告)号：US20160204532A1

公开(公告)日：2016-07-14

申请号：US14915826

申请日：2014-09-04

Applicant: FUJIKURA LTD. ,  DDK LTD.

Inventor： Yuki ISHIDA ,  Masayuki SUZUKI ,  Yuki NAKANO ,  Harunori URAI ,  Norifumi NAGAE

IPC: H01R12/73 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01R12/732 ,  H01R12/592 ,  H01R12/77 ,  H01R12/772 ,  H01R12/88 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/115 ,  H05K1/117 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/09709

Abstract: A printed wiring board (1) includes: a base substrate (3); a plurality of pads (15a, 17a) for electrical connection that are disposed at one surface side of the base substrate (3) and at a connection end portion (13) to be connected with another electronic component (50); wirings (9, 11) that are connected with the pads (15a, 17a); and engageable parts (28, 29) that are formed at side edge parts of the connection end portion (13) and are to be engaged with engagement parts (58) of the other electronic component (50) in the direction of disconnection. The wirings (9, 11) are disposed at the other surface side of the base substrate (3). The flexible printed wiring board (1) further includes reinforcement layers (31, 32) that are disposed at the one surface side of the base substrate (3) and at a frontward side with respect to the engageable parts (28, 29) when viewed in the direction of connection with the other electronic component, and that are formed integrally with the pads (15a).

Abstract translation: 印刷电路板（1）包括：基底（3）; 多个用于电连接的焊盘（15a，17a），其设置在所述基底基板（3）的一个表面侧和连接端部（13）处以与另一个电子部件（50）连接; 与焊盘（15a，17a）连接的布线（9,11）; 以及形成在连接端部（13）的侧边缘部分处并且沿着断开方向与另一个电子部件（50）的接合部分（58）接合的可接合部分（28,29）。 布线（9,11）设置在基底（3）的另一个表面侧。 柔性印刷电路板（1）还包括加强层（31,32），其被设置在基底基板（3）的一个表面侧，并且当观察时相对于可接合部分（28,29）在前侧 在与其他电子部件连接的方向上，与焊盘（15a）一体地形成。

公开(公告)号：US09389374B2

公开(公告)日：2016-07-12

申请号：US13906701

申请日：2013-05-31

Applicant: Corning Cable Systems LLC

Inventor： John Phillip Ertel

IPC: G02B6/42 ,  G02B6/32 ,  H05K1/02 ,  H05K1/18

CPC classification number: G02B6/4214 ,  G02B6/32 ,  G02B6/4249 ,  G02B6/4257 ,  G02B6/428 ,  H05K1/0274 ,  H05K1/182 ,  H05K2201/09063 ,  H05K2201/10121 ,  H05K2203/167 ,  Y10T29/49124

Abstract: A fiber optic sub-assembly includes a printed circuit and a TIR sub-assembly supported by the printed circuit board. The printed circuit board includes opposed first and second surfaces and has a printed circuit board height defined by the distance between the first and second surfaces. The TIR sub-assembly has a nominal height between lowermost and uppermost portions thereof. The TIR sub-assembly is at least partially integrated into the printed circuit board so that an overall stack height of the printed circuit board and TIR sub-assembly is less than the sum of the printed circuit board height and nominal height of the TIR sub-assembly.

Abstract translation: 光纤子组件包括由印刷电路板支撑的印刷电路和TIR子组件。 印刷电路板包括相对的第一和第二表面，并且具有由第一和第二表面之间的距离限定的印刷电路板高度。 TIR子组件在其最下部和最上部之间具有标称高度。 TIR子组件至少部分地集成到印刷电路板中，使得印刷电路板和TIR子组件的整体堆叠高度小于印刷电路板高度和TIR子组件的标称高度之和， 部件。

公开(公告)号：US20160150635A1

公开(公告)日：2016-05-26

申请号：US14927888

申请日：2015-10-30

Applicant: HongQiSheng Precision Electronics (QinHuanDao) Co., Ltd. ,  FuKui Precision Component (Shenzhen) Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

Inventor： XIAN-QIN HU ,  YAN-LU LI ,  LI-BO ZHANG

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/09 ,  H05K3/42

CPC classification number: H05K1/0251 ,  H05K1/115 ,  H05K3/4015 ,  H05K3/4623 ,  H05K3/4688 ,  H05K2201/09063 ,  H05K2201/09472 ,  H05K2201/09845 ,  H05K2201/10303 ,  H05K2203/061

Abstract: The flexible printed circuit board includes a base layer, a first circuit layer and a second circuit layer, the first circuit and the second circuit layer formed on both sides of the base layer; conducting holes extending through the base layer and the first copper layer, the conducting holes include annular copper ring embedded in the first circuit layer. A height difference between a surface of the annular copper ring and a surface of the first circuit layer is in a range from 0 to 3 micrometers. A method for manufacturing the flexible printed circuit board is also provided.

Abstract translation: 柔性印刷电路板包括基层，第一电路层和第二电路层，第一电路和第二电路层形成在基层的两侧; 导电孔延伸穿过基层和第一铜层，导电孔包括嵌入第一电路层的环形铜环。 环形铜环的表面与第一电路层的表面之间的高度差在0至3微米的范围内。 还提供了一种用于制造柔性印刷电路板的方法。

公开(公告)号：US20160150633A1

公开(公告)日：2016-05-26

申请号：US14947091

申请日：2015-11-20

Applicant: Amphenol Corporation

Inventor： Marc B. Cartier, JR.

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/40 ,  H05K1/11 ,  H01R43/20

CPC classification number: H05K1/0222 ,  H01R43/205 ,  H05K1/0216 ,  H05K1/0219 ,  H05K1/025 ,  H05K1/0251 ,  H05K1/0253 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/4038 ,  H05K3/429 ,  H05K2201/07 ,  H05K2201/09063 ,  H05K2201/09318 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2201/097 ,  H05K2201/09718 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/10189

Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns comprising: dual diameter first and second signal vias forming a differential signal pair, the first and second signal vias being configured to accept contact tails of signal conductors of a connector; dual diameter ground shadow vias adjacent to each of the first and second signal vias, wherein the dual diameter shadow ground vias have a reversed diameter configuration with respect to the dual diameter first and second signal vias; and ground vias configured to accept contact tails of ground conductors of the connector.

Abstract translation: 印刷电路板包括多个层，包括附着层和布线层; 以及形成在所述多个层中的通孔图案，所述通孔图案中的每一个包括：形成差分信号对的双直径第一和第二信号通孔，所述第一和第二信号通孔被配置为接纳连接器的信号导体的接触尾部; 与第一和第二信号通孔中的每一个相邻的双直径地面阴影通孔，其中双直径阴影接地通孔相对于双直径第一和第二信号通孔具有反向直径构型; 以及配置为接受连接器的接地导体的接触尾部的接地通孔。

公开(公告)号：US20160109664A1

公开(公告)日：2016-04-21

申请号：US14884772

申请日：2015-10-16

Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： CHUN-YI CHANG ,  JIA-HAU LIU

IPC: G02B6/42 ,  H05K1/18 ,  H05K1/02

CPC classification number: G02B6/428 ,  G02B6/4206 ,  H05K1/0209 ,  H05K1/0243 ,  H05K2201/09063 ,  H05K2201/10121 ,  H05K2201/10545 ,  H05K2203/167

Abstract: An optoelectronic assembly includes a printed circuit board (PCB) defining opposite upper and lower surfaces, and equipped, on the upper surface, with an active component and an Integrated Circuit (IC) linked to each other via the flip chip technology, a lens module located on the side of the lower surface and communicating with the active component through via holes in the PCB, and a fiber assembly located in the lens module to be optically coupled to the active component via said lens module.

Abstract translation: 光电组件包括限定相对的上表面和下表面的印刷电路板（PCB），并且在上表面上配备有通过倒装芯片技术相互连接的有源部件和集成电路（IC），透镜模块 位于下表面的侧面并通过PCB中的通孔与有源部件连通，以及位于透镜模块中的光纤组件，以通过所述透镜模块光学耦合到有源部件。

公开(公告)号：US09301387B2

公开(公告)日：2016-03-29

申请号：US13774655

申请日：2013-02-22

Applicant: LG INNOTEK CO., LTD.

Inventor： Chung Sang Ryou

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0266 ,  H05K1/02 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09918 ,  Y10T29/49117

Abstract: A PCB according to an exemplary embodiment of the present disclosure includes a plurality of unit PCBs arrayed on the PCB, and a sawing line formed among the plurality of unit PCBs. The sawing line disposed among the dummy unit PCBs is formed with a conductive pad including a first layer formed with a PSR (Photo Solder Resistor) and a second layer on which the PSR is removed to open the conductive pad. Burr generation on the unit PCBs during a sawing process is prevented and a dummy area can be reduced.

Abstract translation: 根据本公开的示例性实施例的PCB包括排列在PCB上的多个单元PCB以及在多个单元PCB之间形成的锯线。 设置在虚拟单元PCB之间的锯线形成有导电焊盘，该导电焊盘包括由PSR（光电焊料电阻器）形成的第一层和去除了PSR以打开导电焊盘的第二层。 在锯切过程中防止在单元PCB上的毛刺产生，并且可以减少虚拟区域。

公开(公告)号：US09279575B2

公开(公告)日：2016-03-08

申请号：US14158144

申请日：2014-01-17

Applicant: Toshiba Lighting & Technology Corporation ,  Kabushiki Kaisha Toshiba

Inventor： Takayoshi Moriyama ,  Kazunari Higuchi ,  Sumio Hashimoto ,  Shinichi Kumashiro

IPC: F21S4/00 ,  H05K1/05 ,  F21V29/00 ,  F21S8/02 ,  F21V19/00 ,  F21V21/00 ,  F21V17/12 ,  F21Y101/02 ,  H05K1/02

CPC classification number: F21V29/00 ,  F21S8/026 ,  F21V17/12 ,  F21V19/0035 ,  F21V19/0055 ,  F21V21/00 ,  F21V29/50 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2115/10 ,  H05K1/0206 ,  H05K1/0271 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: A substrate having a plurality of light-emitting elements mounted thereon is described. The substrate may be mounted in a lighting apparatus and may include a surface on which the plurality of light-emitting elements are mounted and one or more holes through which heat may be conducted from the first surface to another surface of the substrate. For example, a heat conductive and electrically non-conductive material may cover a surface of the one or more holes. According to some arrangements, the surface of the substrate may include an electrically non-conductive layer and an electrically conductive layer such that the electrically non-conductive layer is electrically isolated or separated from the electrically conductive layer.

Abstract translation: 描述了安装有多个发光元件的基板。 基板可以安装在照明装置中，并且可以包括其上安装有多个发光元件的表面和可以从基板的第一表面到另一个表面传导热量的一个或多个孔。 例如，导热和非导电材料可以覆盖一个或多个孔的表面。 根据一些布置，衬底的表面可以包括非导电层和导电层，使得非导电层与导电层电隔离或分离。

公开(公告)号：US20160064868A1

公开(公告)日：2016-03-03

申请号：US14935378

申请日：2015-11-07

Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： TERRANCE F. LITTLE ,  WEI-HAO SU

IPC: H01R13/6581 ,  H01R43/16

CPC classification number: H01R13/6215 ,  H01R13/6581 ,  H01R13/748 ,  H01R24/60 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/117 ,  H05K1/184 ,  H05K2201/09063 ,  H05K2201/10189

Abstract: A plug connector mateable with the receptacle connector, includes an insulative housing enclosed in a metallic shell, defining a receiving cavity to receive the mating tongue, and equipped with a plurality of contacts on opposite sides in the vertical direction. A latch forms a pair of locking heads extending into two opposite lateral sides of the receiving cavity to lock with a shielding plate embedded within a mating tongue of the complementary receptacle connector during mating. The plug connector is equipped with a pair of locking screws symmetrically located by two sides of the metallic shell and aligned with the pair of locking heads in the transverse direction, and the receptacle connector is equipped with a pair of screw holes to receive the pair of locking screws in a locked manner.

Abstract translation: 与插座连接器配合的插头连接器包括封闭在金属外壳中的绝缘壳体，其限定接收腔以接纳配合舌片，并且在垂直方向的相对侧上配备有多个触点。 闩锁形成一对锁定头，其延伸到接收腔的两个相对的横向侧面，以在配合期间嵌入嵌入在互补插座连接器的配合舌片内的屏蔽板。 插头连接器配备有一对锁定螺钉，对称地位于金属外壳的两侧并沿着横向与一对锁定头对准，并且插座连接器配备有一对螺孔，用于接收一对 锁定螺丝锁定。

公开(公告)号：US09271392B2

公开(公告)日：2016-02-23

申请号：US14039068

申请日：2013-09-27

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Gwun-Jin Lin

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0237 ,  H05K1/0218 ,  H05K1/0245 ,  H05K1/025 ,  H05K3/4691 ,  H05K2201/09063

Abstract: A rigid-flexible circuit board includes at least one flexible circuit board and at least one rigid circuit board. The flexible circuit board includes a flexible-board substrate, a plurality of flexible circuit board differential mode signal lines, at least one flexible circuit board grounding line, a flexible circuit board insulation layer formed on the upper surface of the flexible-board substrate and covering the flexible circuit board differential mode signal lines and the flexible circuit board grounding line. The rigid circuit board is stacked on the stacking section of the flexible circuit board. A shielding layer is formed on the flexible circuit board insulation layer of the flexible circuit board and corresponds to the extension section of the flexible circuit board. The shielding layer further extends from the extension section to the stacking section. An impedance control structure is formed on the shielding layer to control the impedance of the flexible circuit board differential mode signal lines.

Abstract translation: 刚性柔性电路板包括至少一个柔性电路板和至少一个刚性电路板。 柔性电路板包括柔性电路板基板，多个柔性电路板差模信号线，至少一个柔性电路板接地线，柔性电路板绝缘层，形成在柔性基板基板的上表面和覆盖层 柔性电路板差分信号线和柔性电路板接地线。 刚性电路板堆叠在柔性电路板的堆叠部分上。 屏蔽层形成在柔性电路板的柔性电路板绝缘层上，对应于柔性电路板的延伸部分。 屏蔽层从延伸部分进一步延伸到堆叠部分。 在屏蔽层上形成阻抗控制结构，以控制柔性电路板差模信号线的阻抗。

公开(公告)号：US20160039266A1

公开(公告)日：2016-02-11

申请号：US14778632

申请日：2014-03-20

Applicant: VALEO SYSTEMES THERMIQUES

Inventor： Stéphane DE SOUZA

IPC: B60H1/22 ,  B23P19/04

CPC classification number: B60H1/2218 ,  B23P19/04 ,  F24H3/0429 ,  F24H3/0441 ,  F24H9/2071 ,  H05K1/0201 ,  H05K1/184 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/10166 ,  H05K2201/10272 ,  H05K2201/1031 ,  H05K2201/10424 ,  Y02P70/611

Abstract: The invention relates to a control module (4) for an electric appliance (3), comprising: a printed circuit board (11), on which electrical and electronic components (12) are mounted; and an electronic power component (10) separated from the printed circuit board (11) and held in relation thereto by means of at least one electrical connection body (18a, 18b, 18c) fixed to the printed circuit board (11) and connected to one (D) of the terminals (S, D, G) of the electronic power component (10).

Abstract translation: 本发明涉及一种用于电器（3）的控制模块（4），包括：印刷电路板（11），电气和电子部件（12）安装在该印刷电路板上; 以及与印刷电路板（11）分离并且通过固定到印刷电路板（11）的至少一个电连接体（18a，18b，18c）相对于其保持的电子部件（10），并连接到 一个（D）电子功率部件（10）的端子（S，D，G）。