公开(公告)号：US3314128A

公开(公告)日：1967-04-18

申请号：US22520362

申请日：1962-09-21

Applicant: TELEFUNKEN PATENT

Inventor： JURGEN SCHUTZE HANS ,  WILHELM EHLBECK HEINZ ,  MANFRED DRESSLER

IPC: H01L49/02 ,  H01R9/16 ,  H01R12/04 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K3/4092 ,  H01L49/02 ,  H01R9/16 ,  H05K3/3405 ,  H05K3/403 ,  H05K2201/0376 ,  H05K2201/09181 ,  H05K2201/09754 ,  H05K2201/1034 ,  Y10T29/49149

公开(公告)号：US3311791A

公开(公告)日：1967-03-28

申请号：US38744464

申请日：1964-08-04

Applicant: SPRAGUE ELECTRIC CO

Inventor： LARSON WARREN A ,  ALFRED WHITMAN

IPC: H01L23/057 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01L23/057 ,  H01L2924/0002 ,  H05K3/3405 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/1034 ,  H01L2924/00

公开(公告)号：US2980878A

公开(公告)日：1961-04-18

申请号：US63946157

申请日：1957-02-11

Applicant: AMP INC

Inventor： SWENGEL ROBERT C

IPC: H01R4/18 ,  H01R9/26 ,  H01R12/72 ,  H01R13/11 ,  H01R13/115 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01R13/113 ,  H01R12/728 ,  H01R13/115 ,  H05K1/117 ,  H05K3/325 ,  H05K3/3405 ,  H05K3/4046 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/1034 ,  H05K2201/10386

公开(公告)号：US2905744A

公开(公告)日：1959-09-22

申请号：US63093956

申请日：1956-12-27

Applicant: ACF IND INC

Inventor： RAYBURN CHARLES C ,  BLACK JR JAMES G

IPC: H05K3/34 ,  H05K3/40

CPC classification number: H05K3/3405 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/1034

公开(公告)号：US20240196531A1

公开(公告)日：2024-06-13

申请号：US18586336

申请日：2024-02-23

Applicant: DexCom, Inc.

Inventor： Sean Frick ,  Louis Jung ,  David Lari

IPC: H05K1/11 ,  A61B5/00 ,  A61B5/145 ,  A61B5/1468 ,  G01N27/327 ,  H01L21/768 ,  H01L23/48 ,  H05K1/02 ,  H05K1/14 ,  H05K3/40

CPC classification number: H05K1/112 ,  A61B5/6802 ,  H01L21/768 ,  H01L23/481 ,  H05K1/0262 ,  H05K3/403 ,  A61B5/14532 ,  A61B5/14546 ,  A61B5/1468 ,  A61B5/6848 ,  G01N27/327 ,  H05K1/0219 ,  H05K1/141 ,  H05K2201/0394 ,  H05K2201/049 ,  H05K2201/0792 ,  H05K2201/09063 ,  H05K2201/09181 ,  H05K2201/10151 ,  H05K2201/10378

Abstract: An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation between the first and second electrical contacts.

公开(公告)号：US20230170128A1

公开(公告)日：2023-06-01

申请号：US17922888

申请日：2021-04-23

Applicant: MBDA FRANCE

Inventor： Charlotte GAZZANO ,  Guilhem RAFRAY

IPC: H01F27/24 ,  H05K1/14 ,  H01F27/29

CPC classification number: H01F27/24 ,  H05K1/144 ,  H05K1/141 ,  H01F27/292 ,  H05K2201/086 ,  H05K2201/041 ,  H05K2201/09181 ,  H05K2201/1003

Abstract: Disclosed is a motherboard comprising at least one printed circuit board (PCB), referred to as the motherboard PCB, at least one planar transformer, which is mounted on the motherboard PCB, and a plurality of electronic components, which are also mounted on the motherboard PCB. The planar transformer comprises at least one printed circuit board with windings and a connection interface, a magnetic core arranged on the printed circuit board so as to interact with the windings, and at least one electronic component mounted on the printed circuit board.

公开(公告)号：US09933120B2

公开(公告)日：2018-04-03

申请号：US14760315

申请日：2014-01-08

Applicant: Shuling Li

Inventor： Yi Lin

IPC: H05K3/32 ,  F21K99/00 ,  F21V23/00 ,  F21K9/90 ,  H05K1/18 ,  H05K3/40 ,  F21K9/20 ,  G09F9/33 ,  H05K3/34 ,  F21Y115/10

CPC classification number: F21K9/20 ,  F21K9/90 ,  F21V23/005 ,  F21Y2115/10 ,  G09F9/33 ,  H05K1/18 ,  H05K3/328 ,  H05K3/3405 ,  H05K3/403 ,  H05K2201/09163 ,  H05K2201/09181 ,  H05K2201/10106 ,  H05K2201/10446 ,  Y10T29/4913

Abstract: An LED screen display unit and production method therefor. The LED screen display unit comprises a circuit board (1), a driving IC (2) and LEDs (3); a first face of said circuit board (1) is provided with a contact pad matrix (41); the driving IC (2) is arranged on the circuit board (1) and is in electrical connection with contact pads (4) of said contact pad matrix (41); the pins (31) of the LEDs (3) are soldered to contact pads (4) of the contact pad matrix (41). The present display unit can ensure a higher permeability rate for LED display screens produced having high pixel density.

公开(公告)号：US20170374746A1

公开(公告)日：2017-12-28

申请号：US15676472

申请日：2017-08-14

Applicant: PI-CRYSTAL INCORPORATION

Inventor： Junichi TAKEYA ,  Seiichiro YAMAGUCHI ,  Masataka ITOH

IPC: H05K3/36 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H05K1/14

CPC classification number: H05K3/361 ,  H05K1/115 ,  H05K1/116 ,  H05K1/118 ,  H05K1/144 ,  H05K3/363 ,  H05K3/403 ,  H05K3/4038 ,  H05K3/4623 ,  H05K2201/041 ,  H05K2201/09181 ,  H05K2201/09845 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: Research on practical realization of various types of printable devices has progressed, and the realization of devices in which these printable devices are integrated on a flexible board is expected. However, there is the problem that, if a plurality of printable devices are simply integrated on the same board, the area of the integrated device increases, and the yield ratio greatly decreases. An integration technique that solves the problem of an increase in the area and a decrease in the yield ratio is in demand. Electronic devices to be integrated are formed on individual boards, the boards are laid to overlap each other in a predetermined relationship, and then through-vias are formed at predetermined positions. With this, the electronic devices are electrically connected to each other, and function as an integrated device.

公开(公告)号：US09788424B2

公开(公告)日：2017-10-10

申请号：US14234903

申请日：2012-07-25

Applicant: Masatsugu Iiyama

Inventor： Masatsugu Iiyama

IPC: H05K1/11 ,  H05K3/34 ,  H01L23/13 ,  H01L23/498

CPC classification number: H05K1/111 ,  H01L23/13 ,  H01L23/49805 ,  H01L2224/48227 ,  H01L2224/49175 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00

Abstract: A wiring substrate comprises an insulating substrate and an external electrode on the insulating substrate. The insulating substrate comprises a lateral surface comprising a cutout. The cutout extends to a lower surface of the insulating substrate. The external electrode extends from an inner surface of the cutout to the lower surface of the insulating substrate. The insulating substrate comprises a protrusion at a lower end portion of the inner surface of the cutout. The protrusion protrudes from the inner surface of the cutout toward the lateral surface of the insulating substrate.

公开(公告)号：US20170285666A1

公开(公告)日：2017-10-05

申请号：US15462417

申请日：2017-03-17

Applicant: HORIBA STEC, Co., Ltd.

Inventor： Katsuya Ohtani

IPC: G05D7/06 ,  H01R12/71 ,  H05K1/14 ,  H01R12/75 ,  H05K5/00 ,  H05K1/18

CPC classification number: H05K1/141 ,  H01R12/712 ,  H01R12/716 ,  H01R12/732 ,  H01R23/68 ,  H05K1/117 ,  H05K1/14 ,  H05K1/142 ,  H05K1/145 ,  H05K1/181 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/043 ,  H05K2201/048 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/09181 ,  H05K2201/10189 ,  H05K2201/10287 ,  Y02P70/611

Abstract: A fluid control apparatus is provided which makes it possible to effortlessly perform cable connection even when a plurality of the fluid control apparatuses are disposed adjacent to each other. The fluid control apparatus includes fluid control units to control a flow rate or pressure of a fluid, an electric circuit board to send and receive a signal to and from the fluid control units, a casing to accommodate therein the fluid control units and the electric circuit board, and an apparatus-side connector interposed between the electric circuit board and a cable electrically connected thereto. The fluid control apparatus further includes a connector board configured to mount thereon the apparatus-side connector. The connector board is secured to the electric circuit board with at least a part of the connector board in surface contact with the electric circuit board, or overlapping the electric circuit board with a clearance therebetween.