公开(公告)号：US20100201462A1

公开(公告)日：2010-08-12

申请号：US12762168

申请日：2010-04-16

Applicant: James Leroy Blair ,  Oswin M. Schreiber ,  Jeffrey Thomas Smith

Inventor： James Leroy Blair ,  Oswin M. Schreiber ,  Jeffrey Thomas Smith

IPC: H01P3/08

CPC classification number: H05K1/0219 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01P3/006 ,  H01P3/08 ,  H05K1/0237 ,  H05K1/0393 ,  H05K1/147 ,  H05K3/222 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2201/09618 ,  H05K2201/09727 ,  H05K2201/10492 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.

Abstract translation: 用于电子组件的高速柔性互连电缆包括多个导电层和多个电介质层。 位于导电层上的导电信号迹线与电介质层结合形成一个或多个高速电传输线结构。 电缆可以使用各种连接技术耦合到电子元件。 电缆也可以用任何数量的已知或标准的连接器封装端接。

公开(公告)号：US20100201459A1

公开(公告)日：2010-08-12

申请号：US12671304

申请日：2008-08-01

Applicant: Toshiyuki Kawaguchi ,  Kazutoki Tahara ,  Tsutomu Saga

Inventor： Toshiyuki Kawaguchi ,  Kazutoki Tahara ,  Tsutomu Saga

IPC: H01P1/20

CPC classification number: H01P3/08 ,  H05K1/0234 ,  H05K1/167 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2201/09336 ,  H05K2201/09672

Abstract: The invention provides a transmission noise suppressing structure and a wiring board capable of suppressing a transmission noise transferred through a power supply line, stabilizing a power supply voltage, and reducing signal transmission line cross talk transmitted through the power supply line or a ground layer without being affected by a resistive layer. A transmission noise suppressing structure includes a power supply line and a signal transmission line arranged apart from each other on the same surface; a ground layer arranged apart from the power supply line and the signal transmission line; and a resistive layer arranged apart from the power supply line and the ground layer. The resistive layer has an area (I) which faces the power supply line and an area (II) which does not face the power supply line. The resistive layer and the signal transmission line are apart from each other.

Abstract translation: 本发明提供一种传输噪声抑制结构和布线板，其能够抑制通过电源线传输的传输噪声，稳定电源电压，以及减少通过电源线或接地层传输的信号传输线串扰，而不会 受电阻层影响。 传输噪声抑制结构包括在同一表面上彼此分开布置的电源线和信号传输线; 与电源线和信号传输线分开设置的接地层; 以及与电源线和接地层分开布置的电阻层。 电阻层具有面向电源线的区域（I）和不面向电源线的区域（II）。 电阻层和信号传输线彼此分开。

公开(公告)号：US20100193807A1

公开(公告)日：2010-08-05

申请号：US12671179

申请日：2008-08-11

Applicant: Jun Seok Park

Inventor： Jun Seok Park

IPC: H01L33/62 ,  H01L33/64

CPC classification number: H01L33/641 ,  H01L33/642 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2924/00011 ,  H05K1/0206 ,  H05K1/0209 ,  H05K2201/0209 ,  H05K2201/09318 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049

Abstract: A light emitting device is provided. The light emitting device comprises a substrate, a first lead frame and a second lead frame on the substrate, a first light emitting diode, a heat conductor on the substrate, and a heat transfer pad. The first light emitting diode on the first lead frame is electrically connected to the first lead frame and the second lead frame. The heat conductor is electrically separated from the first lead frame. The heat transfer pad contacts the first lead frame and the heat conductor thermally to connect the first lead frame to the heat conductor.

Abstract translation: 提供了一种发光器件。 发光器件包括衬底，衬底上的第一引线框和第二引线框，第一发光二极管，衬底上的导热体和传热垫。 第一引线框架上的第一发光二极管电连接到第一引线框架和第二引线框架。 热导体与第一引线框架电分离。 传热垫与第一引线框架和热导体热接触，以将第一引线框架连接到热导体。

公开(公告)号：US07710045B2

公开(公告)日：2010-05-04

申请号：US11276901

申请日：2006-03-17

Applicant: John C. Schultz ,  Nelson B. O'Bryan

Inventor： John C. Schultz ,  Nelson B. O'Bryan

IPC: H05B41/16

CPC classification number: H05K1/0204 ,  F21K9/00 ,  G02F2001/133628 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/0209 ,  H05K1/0373 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/0209 ,  H05K2201/09318 ,  H05K2201/09363 ,  H05K2201/10106 ,  H05K2203/1189 ,  H01L2924/00 ,  H01L2224/4554

Abstract: Illumination assemblies include a substrate having a first and second electrically conductive layer separated by an electrically insulating layer. The insulating layer includes a polymer material loaded with thermally conductive particles. At least a portion of the thermally conductive particles simultaneously contact both the first and second electrically conductive layers. A plurality of light sources such as LEDs or other miniature light sources are preferably disposed on the first conductive layer.

Abstract translation: 照明组件包括具有由电绝缘层分隔开的第一和第二导电层的衬底。 绝缘层包括装载有导热颗粒的聚合物材料。 至少一部分导热颗粒同时接触第一和第二导电层。 诸如LED或其它微型光源的多个光源优选设置在第一导电层上。

公开(公告)号：US07699438B2

公开(公告)日：2010-04-20

申请号：US11426424

申请日：2006-06-26

Applicant: Tomoyuki Kubo

Inventor： Tomoyuki Kubo

IPC: B41J2/14

CPC classification number: B41J2/14201 ,  B41J2002/14491 ,  H05K3/281 ,  H05K3/363 ,  H05K2201/0394 ,  H05K2201/062 ,  H05K2201/093 ,  H05K2201/09318 ,  H05K2201/0969 ,  H05K2201/09727 ,  H05K2201/10477

Abstract: A plurality of land sections, each enclosed by two slits, are formed in a ground wire provided on a side of a flexible wiring board to which a piezoelectric element is connected. Since the ground wire and the land sections are connected by only a thin connection section, the solder deposited on the land sections does not flow to the ground wire.

Abstract translation: 在设置在连接有压电元件的柔性布线基板的一侧的接地线中形成有由两个狭缝围成的多个陆部。 由于接地线和接地部分仅通过薄的连接部分连接，所以沉积在接地部分上的焊料不会流到接地线。

公开(公告)号：US20100071942A1

公开(公告)日：2010-03-25

申请号：US12327950

申请日：2008-12-04

Applicant: MING-FENG LEE

Inventor： MING-FENG LEE

IPC: H05K1/18

CPC classification number: H05K1/0216 ,  H05K1/0243 ,  H05K2201/09318 ,  H05K2201/09972 ,  H05K2201/10083 ,  H05K2201/10371

Abstract: A circuit board includes an analog area and a digital area. The analog area includes an analog ground layer and an analog wiring layer formed on the analog ground layer. The digital area includes a digital ground layer and a digital wiring layer formed on the digital ground layer. The digital ground layer is connected with the analog ground layer to form a main ground layer. The digital wiring layer is separate from the analog wiring layer.

Abstract translation: 电路板包括模拟区域和数字区域。 模拟区域包括形成在模拟地层上的模拟接地层和模拟布线层。 数字区域包括形成在数字地层上的数字接地层和数字布线层。 数字接地层与模拟接地层连接形成主接地层。 数字布线层与模拟布线层分开。

公开(公告)号：US07615709B2

公开(公告)日：2009-11-10

申请号：US11978810

申请日：2007-10-30

Applicant: Joel R. Goergen

Inventor： Joel R. Goergen

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K3/4688 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/0243 ,  H05K1/0271 ,  H05K1/116 ,  H05K3/382 ,  H05K3/429 ,  H05K3/4626 ,  H05K3/4641 ,  H05K2201/0209 ,  H05K2201/044 ,  H05K2201/0723 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/09354 ,  H05K2201/09381 ,  H05K2201/09454 ,  H05K2201/09636 ,  H05K2201/09663 ,  H05K2201/09718 ,  H05K2201/09781 ,  H05K2203/061 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49163 ,  Y10T29/49165

Abstract: A circuit board comprises signaling through-holes that pass through a plurality of layers, including signal trace and digital ground plane layers, and power reference plane layers. Clearances are set to achieve a desired impedance characteristic for the through-holes. At a power reference plane layer, the clearance is defined around multiple neighboring through-holes.

Abstract translation: 电路板包括通过多个层的信令通孔，包括信号迹线和数字接地层以及功率参考平面层。 设定间隙以实现通孔所需的阻抗特性。 在功率参考平面层上，间隙围绕多个相邻的通孔限定。

公开(公告)号：US20090195997A1

公开(公告)日：2009-08-06

申请号：US12356099

申请日：2009-01-20

Applicant: Yasuto Ishimaru ,  Hirofumi Ebe

Inventor： Yasuto Ishimaru ,  Hirofumi Ebe

IPC: H05K1/18 ,  H05K3/10

CPC classification number: H05K1/0209 ,  H01L23/3735 ,  H01L23/562 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/189 ,  H05K2201/09318 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10674 ,  Y10T29/49162

Abstract: A mounting region is provided at an approximately center of one surface of an insulating layer. A conductive trace is formed so as to outwardly extend from inside of the mounting region. A cover insulating layer is formed in the periphery of the mounting region so as to cover the conductive trace. A terminal of the conductive trace is arranged in the mounting region, and a bump of an electronic component is bonded to the terminal. A metal layer made of copper, for example, is provided on the other surface of the insulating layer. A slit is formed in the metal layer so as to cross a region being opposite to the electronic component and to divide the metal layer.

Abstract translation: 安装区域设置在绝缘层的一个表面的大致中心处。 导电迹线形成为从安装区域的内部向外延伸。 在安装区域的周围形成覆盖绝缘层以覆盖导电迹线。 导电迹线的端子布置在安装区域中，并且电子部件的凸块接合到端子。 例如，在绝缘层的另一个表面上设置由铜构成的金属层。 在金属层中形成狭缝，以跨越与电子部件相对的区域并分割金属层。

公开(公告)号：US07541678B2

公开(公告)日：2009-06-02

申请号：US11144717

申请日：2005-06-06

Applicant: Yoshihiro Nishida

Inventor： Yoshihiro Nishida

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K1/025 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/09236 ,  H05K2201/09318

Abstract: Disclosed is a printed wiring board comprising an insulating layer having a rectangular flat shape and provided with fibers in the layer, the direction of the fiber in the layer being almost parallel to any side of the rectangle, a reference potential layer disposed on one surface side of the insulating layer, a plurality of wiring patterns for signal transmission disposed on the other surface side of the insulating layer so as to have nearly similar angles respectively with respect to the direction of the fiber in the insulating layer, and a pad portion to mount a semiconductor device, disposed on the other surface side of the insulating layer to conduct the plurality of wiring patterns.

Abstract translation: 公开了一种印刷电路板，其包括具有矩形平面形状并且在该层中设置有纤维的绝缘层，该层中的光纤的方向几乎平行于矩形的任何一侧，基准电位层设置在一个表面侧 绝缘层的多个用于信号传输的布线图案设置在绝缘层的另一个表面侧上，以分别相对于绝缘层中的光纤的方向具有几乎相似的角度;以及焊盘部分，用于安装 半导体器件，设置在绝缘层的另一表面侧，以导通多个布线图案。

公开(公告)号：US20090102580A1

公开(公告)日：2009-04-23

申请号：US12256332

申请日：2008-10-22

Applicant: Sergey V. Uchaykin

Inventor： Sergey V. Uchaykin

IPC: H03H7/00

CPC classification number: H01P1/2039 ,  H01P1/227 ,  H05K1/0224 ,  H05K1/0234 ,  H05K1/09 ,  H05K1/165 ,  H05K2201/09263 ,  H05K2201/09318 ,  H05K2201/09663

Abstract: An electronic filtering device includes continuous trace on a dielectric substrate and a dissipation layer communicatively coupled to the trace. The dissipation layer may include disconnected metal particles, which may be embedded in a substrate, for example in an epoxy. The continuous trace may be meandering, for example crenulated, coil or spiral signal path. At least a second continuous trace may be spaced from the first by the substrate, and conductively coupled by a via. The electronic filtering device may be used in one or more printed circuit boards (PCBs) that form stages of an input/output system.

Abstract translation: 电子滤波装置包括电介质基底上的连续迹线和与迹线通信耦合的耗散层。 耗散层可以包括分离的金属颗粒，其可以嵌入在基底中，例如环氧树脂中。 连续的迹线可能是曲折的，例如曲线，线圈或螺旋信号路径。 至少第二连续迹线可以与第一连续迹线间隔开，并且由通孔导电耦合。 电子滤波装置可以用于形成输入/输出系统阶段的一个或多个印刷电路板（PCB）中。