公开(公告)号：US09774117B1

公开(公告)日：2017-09-26

申请号：US15076752

申请日：2016-03-22

Applicant: Northrop Grumman Systems Corporation

Inventor： Charles M. Jackson ,  Elizabeth T. Kunkee

IPC: H01R12/00 ,  H01R12/71 ,  H01R12/91 ,  H01R12/70 ,  B33Y10/00 ,  B33Y80/00

CPC classification number: H01R12/714 ,  B33Y10/00 ,  B33Y80/00 ,  H01L21/4853 ,  H01L23/49811 ,  H01R12/52 ,  H01R12/7005 ,  H01R12/91 ,  H01R13/2428 ,  H05K1/144 ,  H05K3/4007 ,  H05K2201/042 ,  H05K2201/09754

Abstract: An exemplary miniature support has upper and lower spaced-apart engagement surfaces each having at least a portion that are parallel to each other. Two supports each with an end supporting the upper engagement surface and another end supporting the lower engagement surface. The two supports have a spring-like property so that the upper and lower engagement surfaces can repeatedly move between an uncompressed state when not engaged to provide an interconnection and a compressed state when engaged between two opposing boards to provide an interconnection between the boards. The connector is preferably made using 3-D printing and may be integrally made as part of a board also made using the same 3-D printing. The support may have upper and lower engagement surfaces and at least one of the at least two supports that are conductive to establish connectivity between the upper and lower engagement surfaces.

公开(公告)号：US20170242454A1

公开(公告)日：2017-08-24

申请号：US15589552

申请日：2017-05-08

Applicant: Manufacturing Resources International, Inc.

Inventor： William Dunn ,  David Williams ,  Ware Bedell

IPC: G06F1/16 ,  G06F1/18

CPC classification number: G06F1/1601 ,  G06F1/181 ,  G06F2200/1612 ,  H01L23/3107 ,  H01L23/32 ,  H01R12/7076 ,  H01R12/73 ,  H01R23/70 ,  H01R23/7005 ,  H04N5/63 ,  H04N5/64 ,  H04N5/655 ,  H05K1/117 ,  H05K2201/044 ,  H05K2201/09754 ,  H05K2201/0999 ,  H05K2201/1034

Abstract: An electronic display where various electrical components may be removed from a housing of the display and serviced or replaced without having to demount the display. The electronic display may include an electronic image-producing assembly in electrical communication with a backplane. Various electrical components (e.g., electronic assemblies) may be removably connected to the backplane using self-guiding electrical connectors. An access opening through a wall of the housing may be provided to facilitate removal of an electrical assembly through the housing while the display remains mounted to a vertical surface.

公开(公告)号：US09722336B2

公开(公告)日：2017-08-01

申请号：US14672494

申请日：2015-03-30

Applicant: Hamilton Sundstrand Corporation

Inventor： Robert C. Cooney ,  John A. Dickey ,  Christian Miller ,  Kevin Case Fritz

IPC: H01R12/70 ,  H01R13/52 ,  H01R43/20 ,  H05K3/32

CPC classification number: H01R12/7076 ,  H01R13/5202 ,  H01R43/205 ,  H05K1/181 ,  H05K3/326 ,  H05K2201/0314 ,  H05K2201/09754 ,  H05K2201/10189 ,  H05K2201/10287

Abstract: A circuit board has a socket with at least one plated through-hole. A connector includes a housing that has first and second connector interfaces with, respectively, at least first and second connector contacts. The first connector interface opens into an interior of the housing such that there is a vapor path through the first connector interface and the interior of the housing to the second connector contact at the second connector interface. A resilient seal is located at the first connector interface. The first connector contact extends through the resilient seal and into the plated through-hole. The resilient seal intimately seals around the first connector contact and provides a barrier at the first connector interface into the vapor path.

公开(公告)号：US09648270B2

公开(公告)日：2017-05-09

申请号：US12684608

申请日：2010-01-08

Applicant: David Williams ,  Ware Bedell ,  William Dunn

Inventor： David Williams ,  Ware Bedell ,  William Dunn

IPC: H05K7/00 ,  H04N5/64 ,  G06F1/16 ,  G06F1/18 ,  H05K5/00 ,  H01R12/50 ,  H01L23/31 ,  H01L23/32 ,  H04N5/63

CPC classification number: G06F1/1601 ,  G06F1/181 ,  G06F2200/1612 ,  H01L23/3107 ,  H01L23/32 ,  H01R12/7076 ,  H01R12/73 ,  H01R23/70 ,  H01R23/7005 ,  H04N5/63 ,  H04N5/64 ,  H04N5/655 ,  H05K1/117 ,  H05K2201/044 ,  H05K2201/09754 ,  H05K2201/0999 ,  H05K2201/1034

Abstract: An electronic display assembly where the components can be removed and serviced or replaced without having to remove the display from its position. A backplane may be in electrical communication with the image producing assembly and may contain a plurality of blind mate connectors. Various electronic assemblies may be connected to the blind mate connectors. An access panel may provide access to the electronic assemblies so that they can be removed from the housing. N+1 power supplies may be used so that if one fails the unit would continue to operate until the failed power supply could be replaced. The electronic assemblies may be removed from the left side, right side, top, or bottom surfaces of the display housing. Any flat panel electronic display may be used.

公开(公告)号：US20160315403A1

公开(公告)日：2016-10-27

申请号：US15140428

申请日：2016-04-27

Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： XUE-YUAN XIAO ,  ZI-QIANG ZHU

IPC: H01R12/70 ,  H01R43/02

CPC classification number: H01R12/707 ,  H01R12/57 ,  H01R12/72 ,  H01R13/41 ,  H01R43/0256 ,  H05K1/182 ,  H05K1/184 ,  H05K2201/09754

Abstract: A connector (100) and assembly of the same, the connector comprises an insulative housing (1) and a plurality of contacts (2) assembled onto the insulative housing (1), the insulative housing (1) defining a mating surface (11) and a mounting surface (12) opposite to the mating surface (11). Each contact (2) including a contact portion (21) arranged in the insulative housing (1) and a mounting portion (22) locating at the mounting surface (12) and protruding sidewardly beyond said insulative housing, the mounting portion (22) defines a soldering surface (222) for being soldered onto to said printed circuit board (200), said soldering surface (222) face toward the mounting surface (12). Therefore, when the connector (100) assembled to the printed circuit board (200), we could make full use of the height space at the up and down direction of the printed circuit board (200), thus greatly reducing the height space occupied by the connector (100).

Abstract translation: 连接器（100）及其组件，连接器包括绝缘壳体（1）和组装在绝缘壳体（1）上的多个触头（2），绝缘壳体（1）限定配合表面（11） 和与配合表面（11）相对的安装表面（12）。 每个接触件（2）包括布置在绝缘壳体（1）中的接触部分（21）和位于安装表面（12）处并突出超过所述绝缘壳体的安装部分（22），安装部分（22）限定 用于焊接到所述印刷电路板（200）上的焊接表面（222），所述焊接表面（222）面向安装表面（12）。 因此，当连接器（100）组装到印刷电路板（200）上时，可以充分利用印刷电路板（200）的上下方向的高度空间，从而大大降低了由印刷电路板 连接器（100）。

公开(公告)号：US09386693B2

公开(公告)日：2016-07-05

申请号：US14269736

申请日：2014-05-05

Applicant: Tim Gruhl

Inventor： Tim Gruhl

IPC: H05K1/14 ,  H05K1/03 ,  H05K1/00 ,  H05K1/02 ,  H05K3/46 ,  B29C67/00 ,  H01L21/48 ,  H05K3/40 ,  B29L31/34 ,  H05K3/12

CPC classification number: H05K1/0284 ,  B29C64/106 ,  B29L2031/3425 ,  H01L21/4846 ,  H05K3/1241 ,  H05K3/4007 ,  H05K3/4084 ,  H05K3/46 ,  H05K3/4611 ,  H05K3/4664 ,  H05K2201/0382 ,  H05K2201/09036 ,  H05K2201/09754 ,  H05K2201/2009 ,  H05K2203/013

Abstract: In an embodiment, a method includes forming a printed circuit board by depositing a first plurality of layers and forming an interconnect integral to the printed circuit board by depositing a second plurality of layers on at least a portion of the first plurality of layers. The interconnect includes a stabilizing structure and a contact positioned within the stabilizing structure. The stabilizing structure includes a first material and the contact includes a second material that is different than the first material.

Abstract translation: 在一个实施例中，一种方法包括通过沉积第一多个层并通过在第一多个层的至少一部分上沉积第二多个层来形成与印刷电路板一体的互连来形成印刷电路板。 互连包括稳定结构和位于稳定结构内的接触。 所述稳定结构包括第一材料，并且所述触点包括不同于所述第一材料的第二材料。

公开(公告)号：US20160039267A1

公开(公告)日：2016-02-11

申请号：US14778642

申请日：2014-03-21

Applicant: VALEO SYSTEMS THERMIQUES

Inventor： Bertrand PUZENAT ,  Thierry ELBHAR ,  Jean-Baptiste AUDOYE ,  Alain RENARD

IPC: B60H1/22

CPC classification number: B60H1/2218 ,  F24H3/0429 ,  F24H9/2071 ,  H05K1/0201 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/09754 ,  H05K2201/10166

Abstract: The invention relates to a control module (13) for an electric appliance (10), comprising a printed circuit board (19) whereon electrical and electronic components (26) are mounted along with at least one power transistor (18) fixed to a first region (20) of the printed circuit board (19) and comprising a drain (D) connected to a first electrically conductive track (22) of said first region (20) and a source (S) connected to a second electroconductive track (23) of a second region (21) of the printed circuit board (19). At least one opening (27) forms a material discontinuity between the first and second regions (20, 21) of the printed circuit board (19), said opening (27) being arranged between the first and second conductive tracks (22, 23).

Abstract translation: 本发明涉及一种用于电器（10）的控制模块（13），其包括印刷电路板（19），其中电气和电子部件（26）与至少一个功率晶体管（18）一起安装，固定到第一 （20），并且包括连接到所述第一区域（20）的第一导电轨道（22）的漏极（D）和连接到第二导电轨道（23）的源极（S） ）印刷电路板（19）的第二区域（21）。 至少一个开口（27）在印刷电路板（19）的第一和第二区域（20,21）之间形成材料不连续性，所述开口（27）布置在第一和第二导电轨道（22,23）之间， 。

公开(公告)号：US20140154899A1

公开(公告)日：2014-06-05

申请号：US14093726

申请日：2013-12-02

Applicant: Shyuan Yang ,  Ioannis Kymissis

Inventor： Shyuan Yang ,  Ioannis Kymissis

IPC: H01R12/77 ,  H05K3/32 ,  H01R43/20

CPC classification number: H05K3/32 ,  H01R12/721 ,  H01R12/79 ,  H05K1/028 ,  H05K1/118 ,  H05K3/326 ,  H05K2201/051 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/055 ,  H05K2201/09754 ,  Y10T29/4913

Abstract: An apparatus comprises a flexible circuit substrate that includes a body portion and at least one connector portion formed monolithically with the body portion. The connector portion is shaped by at least one of one or more bends of the flexible circuit substrate or one or more folds of the flexible circuit substrate, and the connector portion is configured to be received in a receptacle of a connector device. The apparatus also includes at least one electrode formed on the connector portion and configured to make electrical contact with an electrical conductor of the receptacle of the connector device, at least one electronic component on the flexible circuit substrate, and interconnect to provide electrical continuity from the electrode to the electronic component.

Abstract translation: 一种装置包括柔性电路基板，其包括主体部分和与主体部分整体形成的至少一个连接器部分。 连接器部分由柔性电路基板的一个或多个弯曲部分或柔性电路基板的一个或多个折叠中的至少一个成形，并且连接器部分构造成容纳在连接器装置的插座中。 该装置还包括至少一个电极，形成在连接器部分上并且被配置为与连接器装置的插座的电导体，柔性电路基板上的至少一个电子部件和互连件电连接，以提供从 电极到电子部件。

公开(公告)号：US08365397B2

公开(公告)日：2013-02-05

申请号：US12112805

申请日：2008-04-30

Applicant: Mark Garrison

Inventor： Mark Garrison

IPC: H03K3/42

CPC classification number: H05K3/4092 ,  H01L23/49861 ,  H01L24/97 ,  H01L2924/14 ,  H05K1/141 ,  H05K3/0052 ,  H05K3/42 ,  H05K3/4638 ,  H05K2201/09754 ,  H05K2201/1059 ,  H05K2201/10924 ,  H05K2203/063 ,  H05K2203/166 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A sub-component circuit board may be electrically and mechanically connected to a higher order circuit board using one or more leads extending from a lead frame embedded in the sub-component circuit board. The sub-component board is produced as a layered assembly with the embedded lead frame at the core. One or more dielectric layers and one or more circuitry layers are provided over the lead frame and then bonded using heat and pressure. Apertures in the dielectric and circuitry layers define a perimeter of the circuit board where the leads of the lead frame are exposed. The lead frame connects to the circuitry layer(s) using plated vias.

Abstract translation: 子部件电路板可以使用从嵌入在子部件电路板中的引线框架延伸的一个或多个引线电连接和机械地连接到高阶电路板。 子部件板作为分层组件制造，嵌入式引线框架在核心处。 一个或多个电介质层和一个或多个电路层设置在引线框架之上，然后使用热和压力进行接合。 电介质和电路层中的孔限定了电路板的周边，引线框架的引线被暴露。 引线框架使用电镀通孔连接到电路层。

公开(公告)号：US08232481B2

公开(公告)日：2012-07-31

申请号：US12326119

申请日：2008-12-02

Applicant: Daigo Matsubara

Inventor： Daigo Matsubara

IPC: H05K1/11 ,  H05K1/16

CPC classification number: H05K3/368 ,  H01L21/563 ,  H01L23/49811 ,  H01L2224/16225 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/141 ,  H05K1/144 ,  H05K3/284 ,  H05K3/3426 ,  H05K3/4007 ,  H05K3/4614 ,  H05K3/4629 ,  H05K2201/0367 ,  H05K2201/09754 ,  H05K2201/10424 ,  H05K2203/308

Abstract: A wiring board with a columnar conductor includes a wiring board defined by a multilayer ceramic board, a columnar conductor on an upper surface of the wiring board, and an insulating support portion arranged to support a side of the columnar conductor and having an external shape that expands from a tip of the columnar conductor toward the wiring board.

Abstract translation: 具有柱状导体的布线基板包括由多层陶瓷板限定的布线板，布线板的上表面上的柱状导体和布置成支撑柱状导体的侧面的绝缘支撑部分，并具有外部形状， 从柱状导体的尖端朝向布线板扩展。