公开(公告)号：US20170178797A1

公开(公告)日：2017-06-22

申请号：US14977141

申请日：2015-12-21

Applicant: Infineon Technologies Austria AG

Inventor： Emil Todorov

IPC: H01F27/29 ,  H05K3/30 ,  H01F30/12 ,  H05K1/18

CPC classification number: H01F27/292 ,  H01F17/06 ,  H01F27/2847 ,  H01F2017/065 ,  H05K1/181 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10818 ,  Y02P70/611

Abstract: An electrical conductor of a surface mount inductor includes a first section extending along a first side face of the magnetic core, a second section extending along a second side face of the magnetic core, and a third section connecting the first and second sections and extending through the magnetic core. A first straight lead extends downwards from the first section beyond the bottom main face of the magnetic core, and has an unbent distal end configured for surface mounting to a circuit board. A second straight lead extends downwards from the second section beyond the bottom main face, and has an unbent distal end configured for surface mounting to the circuit board. The straight leads each have a height and a width which allows for mounting of a power stage to the circuit board at least partly under the magnetic core.

公开(公告)号：US09629245B2

公开(公告)日：2017-04-18

申请号：US14405094

申请日：2013-05-23

Applicant: SAGEMCOM BROADBAND SAS

Inventor： Stephane Kohn

IPC: F16B37/06 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K1/11

CPC classification number: H05K1/14 ,  H05K1/11 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10409 ,  H05K2201/10803 ,  H05K2201/1081 ,  H05K2201/10818 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/2036

Abstract: The invention provides a spacer for soldering comprising an elongate body having one end provided with a tapped hole and an opposite end provided with a transverse bearing surface having a smooth centering peg projecting therefrom, the peg has a longitudinal outer passage extending over at least a fraction of its length as far as the transverse bearing surface to enable molten solder to penetrate by capillarity as far as the transverse bearing surface. The invention also provides a module including such a spacer.

公开(公告)号：US20160262268A1

公开(公告)日：2016-09-08

申请号：US14639789

申请日：2015-03-05

Applicant: Invensas Corporation

Inventor： Reynaldo CO ,  Grant VILLAVICENCIO ,  Wael ZOHNI

IPC: H05K3/10 ,  H05K1/02 ,  H05K3/00 ,  B29C45/14

CPC classification number: H05K3/103 ,  B29C45/14065 ,  B29C45/14221 ,  B29C45/14655 ,  B29C45/14754 ,  B29C2045/1477 ,  B29L2031/3425 ,  H01L21/566 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0296 ,  H05K3/0014 ,  H05K2201/10757 ,  H05K2201/10818 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: In a method for forming a microelectronic device, a substrate is loaded into a mold press. The substrate has a first surface and a second surface. The second surface is placed on an interior lower surface of the mold press. The substrate has a plurality of wire bond wires extending from the first surface toward an interior upper surface of the mold press. An upper surface of a mold film is indexed to the interior upper surface of the mold press. A lower surface of the mold film is punctured with tips of the plurality of wire bond wires for having the tips of the plurality of wire bond wires extending above the lower surface of the mold film into the mold film. The tips of the plurality of wire bond wires are pressed down toward the lower surface of the mold film to bend the tips over.

Abstract translation: 在形成微电子器件的方法中，将基底装载到模压机中。 基板具有第一表面和第二表面。 第二表面放置在模压机的内下表面上。 衬底具有从第一表面延伸到模压机的内部上表面的多个引线接合线。 模具膜的上表面被分配到模压机的内部上表面。 模具薄膜的下表面被多根线接合线的尖端刺穿，使得多个线接合线的顶端在模具薄膜的下表面上延伸到模制薄膜中。 多个线接合线的尖端朝向模制薄膜的下表面压下以使尖端弯曲。

公开(公告)号：US20150144387A1

公开(公告)日：2015-05-28

申请号：US14407402

申请日：2013-06-09

Applicant: SCHNEIDER TOSHIBA INVERTER EUROPE SAS

Inventor： Jing Chen

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/181 ,  H01G2/06 ,  H01G2/065 ,  H05K1/111 ,  H05K3/301 ,  H05K3/325 ,  H05K3/4015 ,  H05K5/0239 ,  H05K7/1432 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/06 ,  H05K2201/10015 ,  H05K2201/10287 ,  H05K2201/10325 ,  H05K2201/10409 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/1081 ,  H05K2201/10818 ,  H05K2201/2018 ,  H05K2201/2036

Abstract: An electrical apparatus, comprising a circuit board, and a capacitor installed on the circuit board; the capacitor is detachably installed on the circuit board. The capacitor can be conveniently detached from the circuit board; therefore, a damaged capacitor can be easily replaced with a new capacitor, saving cost by avoiding the problem in the prior art that the entire electrical apparatus is discarded or causes downtime for repairs due to a damaged capacitor.

Abstract translation: 一种电气设备，包括电路板和安装在电路板上的电容器; 电容器可拆卸地安装在电路板上。 电容器可以方便地从电路板上拆下; 因此，可以容易地用新的电容器替换损坏的电容器，通过避免现有技术中的问题，整个电气设备被丢弃或由于损坏的电容器导致维修停机，从而节省成本。

公开(公告)号：US08884167B2

公开(公告)日：2014-11-11

申请号：US13346085

申请日：2012-01-09

Applicant: Kazuya Miyasaka ,  Kouji Kobayashi ,  Akihito Fukuzawa

Inventor： Kazuya Miyasaka ,  Kouji Kobayashi ,  Akihito Fukuzawa

IPC: H05K1/11 ,  H05K3/34

CPC classification number: H05K3/3447 ,  H05K2201/10295 ,  H05K2201/10787 ,  H05K2201/10818 ,  H05K2201/1084

Abstract: A printed circuit board unit includes: a printed circuit board including a through hole including first and second inner surfaces opposite to each other; a terminal pin including an insertion portion inserted into the through hole; solder filled into the through hole, and joining the printed circuit board with the terminal pin, wherein the insertion portion includes a base portion abutting the first inner surface, and a protruding portion including: a projection surface projecting from the base portion to the second inner surface and abutting the second inner surface; and a recess surface located at a rear side of the projection surface and spaced apart from the first inner surface, and a length of the protruding portion in a thickness direction of the printed circuit board is greater than a thickness of the printed circuit board.

Abstract translation: 印刷电路板单元包括：印刷电路板，包括具有彼此相对的第一和第二内表面的通孔; 终端销，其包括插入到所述通孔中的插入部; 焊料填充到通孔中，并且将印刷电路板与端子销接合，其中插入部分包括抵靠第一内表面的基部，以及突出部分，包括：从基部突出到第二内部的突出表面 表面并邻接第二内表面; 以及位于所述突起表面的后侧并与所述第一内表面间隔开的凹部表面，并且所述突出部分在所述印刷电路板的厚度方向上的长度大于所述印刷电路板的厚度。

公开(公告)号：US08481862B2

公开(公告)日：2013-07-09

申请号：US11350276

申请日：2006-02-09

Applicant: Deepak K. Pai ,  Melvin Eric Graf

Inventor： Deepak K. Pai ,  Melvin Eric Graf

IPC: H05K1/16

CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L24/72 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/351 ,  H05K2201/0373 ,  H05K2201/10727 ,  H05K2201/10818 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

Abstract: The present invention relates to a connector system for resiliently attaching and electrically connecting an integrated circuit chip to a circuit board using a plurality of leads. Each of the plurality of leads are sized and arranged to form a curved body having a first leg and a second leg with a curved portion between the first leg and the second leg. The curved body of the leads may be C-shaped in accordance with the present invention. The plurality of leads may be formed from strips of copper foil or copper mesh folded to form the curved body. The plurality of leads may also be sized and arranged to support the integrated circuit chip in a generally flat arrangement relative to the circuit board with a maximum separation of about 0.016 inches or less between the integrated circuit chip and the circuit board.

Abstract translation: 连接器系统技术领域本发明涉及一种使用多根引线将集成电路芯片弹性连接并电连接到电路板的连接器系统。 多个引线中的每一个的尺寸和布置成形成具有第一腿部和第二腿部的弯曲主体，第一腿部和第二腿部之间具有在第一腿部和第二腿部之间的弯曲部分。 根据本发明，引线的弯曲体可以是C形。 多个引线可以由折叠的铜箔或铜网的条形成，以形成弯曲体。 多个引线还可以被设计和布置成将集成电路芯片相对于电路板以大致平坦的布置支撑，在集成电路芯片和电路板之间具有大约0.016英寸或更小的最大间隔。

公开(公告)号：US08228143B2

公开(公告)日：2012-07-24

申请号：US12588955

申请日：2009-11-03

Applicant: Satoshi Takano

Inventor： Satoshi Takano

IPC: H01H51/22

CPC classification number: H01H50/047 ,  H01H50/14 ,  H01H2050/044 ,  H05K1/18 ,  H05K3/308 ,  H05K2201/10053 ,  H05K2201/10462 ,  H05K2201/10818

Abstract: An assembly including an electromagnetic relay and a circuit board. The electromagnetic relay includes a body having a lateral surface and a bottom surface, and a plurality of terminals protruding outward from the lateral surface of the body. The terminals respectively have distal portions extending beyond the bottom surface of the body. The circuit board is provided with a relay-mount surface. The electromagnetic relay is mounted on the relay-mount surface in an orientation such that the bottom surface of the body is opposed to the relay-mount surface, and the distal portions of the terminals being fixed to the circuit board. Each terminal is formed from a flat plate element and has a shape angled in a width direction of the flat plate element. The body has a height defined in a direction orthogonal to the relay-mount surface of the circuit board and corresponding to a length of a shortest edge of the lateral surface, the shortest edge being shorter than any of edges of the bottom surface.

Abstract translation: 包括电磁继电器和电路板的组件。 电磁继电器包括具有侧表面和底表面的主体，以及从主体的侧表面向外突出的多个端子。 端子分别具有延伸超出主体底表面的远端部分。 电路板设有继电器安装面。 电磁继电器以使得本体的底面与继电器安装面相对的方向安装在继电器安装面上，端子的前端部固定在电路基板上。 每个端子由平板元件形成，并且具有在平板元件的宽度方向上成角度的形状。 主体具有与电路板的继电器安装表面正交的方向上的高度，并且与侧表面的最短边缘的长度相对应，其最短边缘比底面的任何边缘短。

公开(公告)号：US08052317B2

公开(公告)日：2011-11-08

申请号：US13004666

申请日：2011-01-11

Applicant: Kyong Jun Kim

Inventor： Kyong Jun Kim

IPC: F21V7/04

CPC classification number: F21V23/00 ,  F21K9/00 ,  G02B6/0031 ,  G02B6/0068 ,  G02B6/0083 ,  G02B6/0085 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/281 ,  H05K3/3426 ,  H05K3/3452 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/2009 ,  H05K2203/0577 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A light emitting apparatus includes a light emitting diode including a body with a light emitting diode chip packaged therein and a plurality of lead electrodes contacted with one side of the body and a board including a plurality of electrode pads connected to lower surfaces of the lead electrodes of the light emitting diode. The lower surfaces of the lead electrodes of the light emitting diode correspond to top surfaces of electrode pads of the board with same shapes. The lower surfaces of the lead electrodes of the light emitting diode are disposed within a region of top surfaces of the electrode pads of the board, respectively.

Abstract translation: 发光装置包括：发光二极管，包括具有封装在其中的发光二极管芯片的主体和与本体的一侧接触的多个引线电极;以及板，包括连接到引线电极的下表面的多个电极焊盘 的发光二极管。 发光二极管的引线电极的下表面对应于具有相同形状的电路板的电极焊盘的顶表面。 发光二极管的引线电极的下表面分别设置在电路板的电极焊盘的顶表面的区域内。

公开(公告)号：US20110198663A1

公开(公告)日：2011-08-18

申请号：US13095059

申请日：2011-04-27

Applicant: Sheng-Jia Sheu ,  Chien-Chang Pei

Inventor： Sheng-Jia Sheu ,  Chien-Chang Pei

IPC: H01L33/62

CPC classification number: H05K3/326 ,  H01L33/62 ,  H01L2924/0002 ,  H05K3/202 ,  H05K2201/0382 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/1084 ,  Y10T29/41 ,  H01L2924/00

Abstract: A structure of a light emitting diode is provided. In one aspect, a light emitting diode structure comprises a light emitting diode, a conductive frame, and a substrate. The conductive frame is electrically connected to the light emitting diode and has a fixing hole connecting a first side of the conductive frame and a second side of the conductive frame opposite the first side. The fixing hole has a ladder-shaped inner sidewall with a first radius of the inner sidewall adjacent the first side smaller than a second radius of the inner sidewall adjacent the second side. The substrate has a conductive pillar that is received in the fixing hole by entering the fixing hole from the first side of the conductive frame and deformed such that the conductive pillar adheres to the ladder-shaped inner sidewall of the fixing hole.

Abstract translation: 提供发光二极管的结构。 在一个方面，发光二极管结构包括发光二极管，导电框架和基板。 导电框架电连接到发光二极管，并且具有连接导电框架的第一侧和导电框架与第一侧相对的第二侧的固定孔。 固定孔具有梯形内侧壁，其内侧壁的第一半径与第一侧相邻，小于邻近第二侧的内侧壁的第二半径。 衬底具有通过从导电框架的第一侧进入固定孔而被固定在固定孔中的导电柱，并使其导电柱粘附到固定孔的梯形内侧壁。

公开(公告)号：US20100109821A1

公开(公告)日：2010-05-06

申请号：US12588955

申请日：2009-11-03

Applicant: Satoshi Takano

Inventor： Satoshi Takano

IPC: H01H50/04

CPC classification number: H01H50/047 ,  H01H50/14 ,  H01H2050/044 ,  H05K1/18 ,  H05K3/308 ,  H05K2201/10053 ,  H05K2201/10462 ,  H05K2201/10818

Abstract: An assembly including an electromagnetic relay and a circuit board. The electromagnetic relay includes a body having a lateral surface and a bottom surface, and a plurality of terminals protruding outward from the lateral surface of the body. The terminals respectively have distal portions extending beyond the bottom surface of the body. The circuit board is provided with a relay-mount surface. The electromagnetic relay is mounted on the relay-mount surface in an orientation such that the bottom surface of the body is opposed to the relay-mount surface, and the distal portions of the terminals being fixed to the circuit board. Each terminal is formed from a flat plate element and has a shape angled in a width direction of the flat plate element. The body has a height defined in a direction orthogonal to the relay-mount surface of the circuit board and corresponding to a length of a shortest edge of the lateral surface, the shortest edge being shorter than any of edges of the bottom surface.

Abstract translation: 包括电磁继电器和电路板的组件。 电磁继电器包括具有侧表面和底表面的主体，以及从主体的侧表面向外突出的多个端子。 端子分别具有延伸超出主体底表面的远端部分。 电路板设有继电器安装面。 电磁继电器以使得本体的底面与继电器安装面相对的方向安装在继电器安装面上，端子的前端部固定在电路基板上。 每个端子由平板元件形成，并且具有在平板元件的宽度方向上成角度的形状。 主体具有与电路板的继电器安装表面正交的方向上的高度，并且与侧表面的最短边缘的长度相对应，其最短边缘比底面的任何边缘短。