公开(公告)号：US06208525B1

公开(公告)日：2001-03-27

申请号：US09048054

申请日：1998-03-26

Applicant: Satoshi Imasu ,  Ikuo Yoshida ,  Tetsuya Hayashida ,  Akira Yamagiwa ,  Shinobu Takeura

Inventor： Satoshi Imasu ,  Ikuo Yoshida ,  Tetsuya Hayashida ,  Akira Yamagiwa ,  Shinobu Takeura

IPC: H01L2314

CPC classification number: H05K1/111 ,  H01L21/563 ,  H01L23/13 ,  H01L23/24 ,  H01L23/49811 ,  H01L23/5383 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2225/1023 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/091 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/10674 ,  H05K2203/1581 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/00

Abstract: An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.

公开(公告)号：US6032357A

公开(公告)日：2000-03-07

申请号：US98155

申请日：1998-06-16

Applicant: Albert Wojewnik

Inventor： Albert Wojewnik

IPC: B60R16/02 ,  H05K1/00 ,  H05K3/00 ,  H05K3/02

CPC classification number: H05K1/0283 ,  B60R16/0207 ,  H05K3/0014 ,  H05K2201/057 ,  H05K2201/09018 ,  H05K2201/091 ,  H05K2203/0271 ,  H05K2203/1105 ,  H05K2203/302 ,  Y10T156/1039 ,  Y10T156/1041 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: The present invention comprises a printed circuit having a three-dimensional surface capable of conforming to a contoured surface of a vehicle trim panel. Printed circuit comprises a plurality of electrical conductors and connectors secured to a polymeric substrate. A convoluted region of the printed circuit permits formation of the three-dimensional surface in the printed circuit. The present invention further comprises a method a producing three-dimensional surface and the printed circuit by either thermoforming the printed circuit or mechanically stretching the printed circuit to produce the three-dimensional surface.

Abstract translation: 本发明包括具有能够符合车辆装饰板的轮廓表面的三维表面的印刷电路。 印刷电路包括固定到聚合物基底上的多个电导体和连接器。 印刷电路的卷积区域允许在印刷电路中形成三维表面。 本发明还包括通过热成型印刷电路或机械拉伸印刷电路以产生三维表面来制造三维表面和印刷电路的方法。

公开(公告)号：US5982626A

公开(公告)日：1999-11-09

申请号：US868256

申请日：1997-06-03

Applicant: Masahiro Kodama

Inventor： Masahiro Kodama

IPC: H05K1/02 ,  H05K1/00 ,  H05K1/11 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36 ,  H01R9/09

CPC classification number: H01R12/61 ,  H05K1/118 ,  H05K3/363 ,  H05K1/0393 ,  H05K1/14 ,  H05K2201/048 ,  H05K2201/091 ,  H05K2201/09181 ,  H05K2201/0939 ,  H05K2203/167

Abstract: A flexible printed circuit board assembly comprising a first flexible printed circuit board and a second flexible printed circuit board, wherein each of the first and second flexible printed circuit boards is provided with a position fixing coupling to determine the position of the second flexible printed circuit board relative to the first flexible printed circuit board.

Abstract translation: 一种柔性印刷电路板组件，包括第一柔性印刷电路板和第二柔性印刷电路板，其中第一和第二柔性印刷电路板中的每一个设置有位置固定联接器，以确定第二柔性印刷电路板的位置 相对于第一柔性印刷电路板。

公开(公告)号：US5842275A

公开(公告)日：1998-12-01

申请号：US524097

申请日：1995-09-05

Applicant: Richard Keith McMillan, II ,  Vivek Amir Jairazbhoy ,  Robert Joseph Gordon ,  George Albert Garfinkel

Inventor： Richard Keith McMillan, II ,  Vivek Amir Jairazbhoy ,  Robert Joseph Gordon ,  George Albert Garfinkel

IPC: H01L21/60 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H05K3/42

CPC classification number: H01L24/81 ,  H05K1/0206 ,  H05K1/113 ,  H05K3/341 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/0272 ,  H05K2201/09036 ,  H05K2201/091 ,  H05K2201/0959 ,  H05K2201/10166 ,  H05K2201/10651 ,  H05K2201/10969 ,  H05K2203/0455 ,  H05K2203/1178 ,  H05K3/0061 ,  H05K3/0094 ,  H05K3/42 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Method of surface mounting an electronic component to a bonding pad on one side of a supporting insulating board carrying a planar printed circuit thereon, the pad being connected to one or more conductors on the board by use of solder material subject to one or more gas trapping through-hole vias, comprising: (a) creating at least one vent channel below the top plane of the printed circuit and extending from a location at or closely adjacent to one of said vias to a location essentially near a periphery of solder material to be placed thereover; (b) planting a deposit of solder material between the component and pad; (c) bringing the component, solder material and pad together to form an assembly; and (d) heating the assembly to momentarily reflow the solder material in place without shifting, skewing, or tilting of the component, any trapped air in said one vias being allowed to expand and migrate away through the channel to at least the periphery of the pad.

Abstract translation: 将电子部件表面安装在其上承载有平面印刷电路的支撑绝缘板的一侧上的接合焊盘的方法，该焊盘通过使用经受一个或多个气体捕获的焊料材料连接到板上的一个或多个导体 通孔通孔，包括：（a）在印刷电路的顶面下方形成至少一个通气通道，并且从位于或接近其中一个通孔的位置延伸到基本上接近焊料材料周边的位置， 放在其上 （b）在部件和焊盘之间种植焊料的沉积物; （c）使部件，焊料和焊盘一起形成组件; 和（d）加热组件以将焊料材料短暂地回流到位，而不会移动，倾斜或倾斜组件，允许所述一个通孔中的任何被捕获的空气膨胀并通过通道迁移至至少外围 垫。

公开(公告)号：US5801441A

公开(公告)日：1998-09-01

申请号：US440665

申请日：1995-05-15

Applicant: Thomas H. DiStefano ,  John W. Smith

Inventor： Thomas H. DiStefano ,  John W. Smith

IPC: H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L23/52 ,  H01R4/58 ,  H01R9/09

CPC classification number: H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158

Abstract: A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the sheet, from its terminal end to its tip end. The tip ends are attached to a second element, such as another dielectric sheet or a semiconductor wafer. The first and second elements are then moved relative to one another to advance the tip end of each lead vertically away from the dielectric sheet and deform the leads into a bent, vertically extensive configuration. The preferred structures provide semiconductor chip assemblies with a planar area array of contacts on the chip, an array of terminals on the sheet positioned so that each terminal is substantially over the corresponding contact, and an array of metal S-shaped ribbons connected between the terminals and contacts. A compliant dielectric material may be provided between the sheet and chip, substantially surrounding the S-shaped ribbons.

公开(公告)号：US5675888A

公开(公告)日：1997-10-14

申请号：US279643

申请日：1994-07-25

Applicant: Marvin Leroy Owen ,  Mark James Miller

Inventor： Marvin Leroy Owen ,  Mark James Miller

IPC: H01R43/20 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/00

CPC classification number: H01R43/205 ,  H05K1/119 ,  H05K3/326 ,  H01R12/79 ,  H05K1/184 ,  H05K2201/0191 ,  H05K2201/091 ,  H05K2201/09118 ,  H05K2201/10189 ,  H05K2201/1059 ,  Y10T29/49124 ,  Y10T29/49158

Abstract: An automotive instrument cluster case is molded of a resin material. A rigid rear wall of the case has a planar outer surface including a connector region having two adjacent flaps, each flap molded with a thin flexible section and a rigid terminal section. Printed circuit paths are applied to the plane outer surface including the flaps. Then the flaps are deformed into the case, with the flexible section being curved and the terminal sections being spaced apart with the circuit paths forming terminal strips facing one another to form a connector socket. Interlocking stop elements molded on the inner surface hold the flaps apart to receive a male connector.

Abstract translation: 汽车仪表组合壳体由树脂材料模制而成。 壳体的刚性后壁具有包括具有两个相邻翼片的连接器区域的平面外表面，每个翼片模制有薄的柔性部分和刚性端子部分。 印刷电路路径被施加到包括翼片的平面外表面。 然后，翼片变形为壳体，柔性部分是弯曲的，并且端子部分与形成端子条的电路路径间隔开以形成连接器插座。 在内表面上模制的联锁止动元件将翼片分开以接收公连接器。

公开(公告)号：US5600179A

公开(公告)日：1997-02-04

申请号：US534316

申请日：1995-09-27

Applicant: Katsunobu Suzuki

Inventor： Katsunobu Suzuki

IPC: H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H05K1/05 ,  H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H01L23/48

CPC classification number: H01L23/3121 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/5387 ,  H05K3/363 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/16315 ,  H05K1/056 ,  H05K1/118 ,  H05K1/141 ,  H05K2201/055 ,  H05K2201/066 ,  H05K2201/091 ,  H05K2201/09709 ,  H05K2201/099 ,  H05K2201/10681 ,  H05K2201/10772 ,  H05K2203/302 ,  H05K3/0061 ,  H05K3/3452

Abstract: For packaging a semiconductor device, a metal plate is formed to include a central plate portion and a peripheral plate portion extending outwardly from the central plate portion. The central plate portion has a first surface for mounting the semiconductor device and has a second surface opposite to the first surface in a predetermined direction. The peripheral plate portion is bent to face the second surface of the central plate portion and extends substantially along a reference plane which is perpendicular to the predetermined direction. The peripheral plate portion has a particular portion projecting from the reference plane opposite the central plate portion. An insulator layer is deposited on the metal plate. In addition, a conductive pattern is formed on the insulator layer. The insulator layer extends along the metal plate from the first surface of the central plate portion to the peripheral plate portion to cover the particular portion. The conductive pattern extends along the insulator layer from the central plate portion to the particular portion.

Abstract translation: 为了封装半导体器件，金属板形成为包括中心板部分和从中心板部分向外延伸的周边板部分。 中心板部分具有用于安装半导体器件的第一表面，并且具有在预定方向上与第一表面相对的第二表面。 外围板部分被弯曲成面向中心板部分的第二表面并且基本上沿着与预定方向垂直的参考平面延伸。 外围板部分具有从与中心板部分相对的参考平面突出的特定部分。 绝缘体层沉积在金属板上。 此外，在绝缘体层上形成导电图案。 绝缘体层沿着金属板从中心板部分的第一表面延伸到外围板部分以覆盖特定部分。 导电图案沿着绝缘体层从中心板部分延伸到特定部分。

公开(公告)号：US5418691A

公开(公告)日：1995-05-23

申请号：US978043

申请日：1992-11-18

Applicant: Go Tokura

Inventor： Go Tokura

IPC: H05K3/36 ,  H05K1/11 ,  H01R9/09 ,  H01R29/00

CPC classification number: H01R12/62 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/091 ,  H05K2201/09781 ,  H05K2203/166 ,  H05K2203/167

Abstract: A printed circuit board device comprising at least two printed circuit boards in superposition to connect their interconnection patterns, and a positioning member for putting the two boards into registry when being superimposed, the positioning member including a hole provided in one of the boards, an extension provided on the other board and arranged to be inserted into the hole, and a pair of marks for position registry provided on the respective boards.

Abstract translation: 一种印刷电路板装置，包括至少两个重叠连接其互连图案的印刷电路板;以及定位构件，用于在叠置时将所述两个板放置在对准中，所述定位构件包括设置在一个所述板中的孔， 设置在另一个板上并布置成插入孔中，并且在各个板上设置一对位置登记标记。

公开(公告)号：US5193270A

公开(公告)日：1993-03-16

申请号：US788383

申请日：1991-11-06

Applicant: Horst Stade ,  Helmut Deringer

Inventor： Horst Stade ,  Helmut Deringer

IPC: H01R12/04 ,  B60T8/36 ,  H05K1/00 ,  H05K1/11 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K13/04

CPC classification number: B60T8/3675 ,  H05K13/0482 ,  H05K3/326 ,  H05K1/118 ,  H05K2201/091 ,  H05K2201/1003 ,  H05K2201/105 ,  H05K2201/1059 ,  H05K2203/0165 ,  H05K2203/1189 ,  H05K3/281 ,  H05K3/306 ,  H05K3/3447 ,  Y10S29/044 ,  Y10T29/49144 ,  Y10T29/53191 ,  Y10T29/53261 ,  Y10T83/748

Abstract: A method for attaining a tolerance-insensitive connection of a conductor track foil with contact pins of an electrical component. The conductor track foil includes two insulating layers with an intervening conducting layer with lands in the upper layer for soldering the conductive layer to the contact pins of the electrical component. The conductor track foil is lowered, positionally correctly, onto the electrical component by use of a mounting device. The bottom insulating layer and the conducting layer of the soldering lands, which are free of an insulating layer on the top, are pierced by the contact pins extending at right angles to the conductor track foil. The conductor track foil is released by the mounting apparatus. A soldered connection is made between the lands and the contact pins. As a result, an electrically reliably gap free conducting connection is attainable even if the contact pins are eccentrically associated with the soldering lands.

Abstract translation: 一种用于实现导体轨迹箔与电气部件的接触针的公差不敏感连接的方法。 导体轨道箔包括两个绝缘层，其中间导电层具有上层中的焊盘，用于将导电层焊接到电气部件的接触引脚上。 通过使用安装装置将导体轨迹箔位置正确地下降到电气部件上。 在顶部没有绝缘层的焊盘的底部绝缘层和导电层被与导体轨道箔成直角延伸的接触销刺穿。 导线轨道箔由安装装置释放。 在焊盘和接触针之间形成焊接连接​​。 结果，即使接触针偏心地与焊接区相关联，也可获得电气可靠的无间隙的导电连接。

公开(公告)号：US5035049A

公开(公告)日：1991-07-30

申请号：US438106

申请日：1989-11-16

Applicant: Dale K. Wheeler

Inventor： Dale K. Wheeler

IPC: B29C65/56 ,  B29C65/60 ,  H01R43/20 ,  H05K1/00 ,  H05K3/04 ,  H05K3/20 ,  H05K3/30 ,  H05K3/40

CPC classification number: H01R43/20 ,  B29C65/56 ,  B29C65/567 ,  B29C65/606 ,  B29C66/47 ,  B29C66/472 ,  B29C66/8322 ,  H05K3/041 ,  H05K3/4084 ,  H05K1/0284 ,  H05K2201/0397 ,  H05K2201/091 ,  H05K2201/2072 ,  H05K2203/0108 ,  H05K2203/0195 ,  H05K2203/063 ,  H05K2203/1572 ,  H05K2203/167 ,  H05K3/202 ,  H05K3/306 ,  H05K3/4092 ,  Y10T29/49151 ,  Y10T29/49153 ,  Y10T29/49915

Abstract: A method and apparatus is provided for forming a power distribution system during a punching operation. A planar member of conductive material is located proximate to the substrate upon which the power distribution system is to be formed. A punch used to form the conductors from the planar member and deposit the conductors on the substrate. The action of the punch causes mechanical interference between the conductor and the substrate thereby securing the conductor to the substrate.

Abstract translation: 提供了一种用于在冲压操作期间形成配电系统的方法和装置。 导电材料的平面构件位于要形成配电系统的基板附近。 用于从平面构件形成导体并将导体沉积在基底上的冲头。 冲头的作用导致导体和基板之间的机械干涉，从而将导体固定到基板上。