Printed circuit board having arrays of lands arranged inside and outside of each other having a reduced terminal-pitch
    122.
    发明授权
    Printed circuit board having arrays of lands arranged inside and outside of each other having a reduced terminal-pitch 失效
    具有布置在彼此内部和外部的具有减小的端子间距的平台阵列的印刷电路板

    公开(公告)号:US06218630B1

    公开(公告)日:2001-04-17

    申请号:US09107478

    申请日:1998-06-30

    Inventor: Kotaro Takigami

    Abstract: A printed circuit board includes a plurality of lands thereon. The size D2 of the outer land 3 in the direction along the outside array is less than the size D1 of the inner land 1 in the direction along the inside array. Therefore, it is possible to pass the pattern 4 with enough clearance against the outer land 3. The outer lands 3 are formed with an oval, elliptical or oblong shape. Namely, the size D3 of the outer land 3 in the direction perpendicular to the direction of the outside array is greater than the size D2. Then, it is possible to ensure a sufficient reliability of a soldered part. Preferably, the connected area 5 between the inner land 1 and the pattern 4 and the connected area 7 between the outer land 3 and the pattern 6 are formed as a shape of a tear-drop. Then, the patterns 4, 6 cannot be easily cut by a thermal stock or a heat cycle. The solder resist 8 is coated, around the outer land 3, from an outer area to an inner area of the outer land 3, except for the central area 3A. The resist 8 is further coated, around the inner land 1, from an outer area to an inner area of the inner land 1, except for the central area 1A. Then, each area 5, 7 is reinforced by the resist 8. Further, since a clearance between exposed areas 1A and a clearance between exposed areas 3A are widened, a bridge of solder does not easily occur.

    Abstract translation: 印刷电路板包括多个焊盘。 沿着外部阵列的方向的外部焊盘3的尺寸D2小于沿着内部阵列的方向的内部焊盘1的尺寸D1。 因此,可以使图案4以足够的间隙通过外缘3。外缘3形成为椭圆形,椭圆形或椭圆形。 也就是说,在与外部阵列的方向垂直的方向上的外部焊盘3的尺寸D3大于尺寸D2。 然后,可以确保焊接部件的足够的可靠性。 优选地,内部平台1和图案4之间的连接区域5和外部凸台3与图案6之间的连接区域7形成为泪滴形状。 然后,图案4,6不能容易地被热料或热循环切断。 除了中心区域3A之外,阻焊剂8围绕外部焊盘3从外部区域外围区域涂覆到外部区域3的内部区域。 除了中心区域1A之外,抗蚀剂8从内部区域1的外部区域到内部区域1的内部区域进一步被涂覆在内部区域1周围。 然后,每个区域5,7由抗蚀剂8加强。此外,由于暴露区域1A之间的间隙和暴露区域3A之间的间隙变宽,所以焊接桥不容易发生。

    Clover-leaf solder mask opening
    123.
    发明授权
    Clover-leaf solder mask opening 失效
    三叶草焊盘开口

    公开(公告)号:US6150061A

    公开(公告)日:2000-11-21

    申请号:US483851

    申请日:2000-01-17

    Abstract: A solder mask having a clover-leaf shaped opening around a PTH for enhanced performance. The solder mask resides on a surface of a printed circuit board comprising lands and PTH's. The opening around the PTH is configured to maintain a minimum channel width between the PTH and an adjacent land while maximizing the opening around the PTH, thereby decreasing the likelihood that the solder mask material will be inadvertently drawn into the PTH.

    Abstract translation: 焊接掩模,具有围绕PTH的三叶草叶形开口,以提高性能。 焊接掩模位于包括焊盘和PTH的印刷电路板的表面上。 围绕PTH的开口被配置为在PTH和相邻区域之间保持最小通道宽度,同时最大化围绕PTH的开口,从而降低焊料掩模材料将被无意地吸入PTH的可能性。

    Beveled edge circuit board with channeled connector pads
    124.
    发明授权
    Beveled edge circuit board with channeled connector pads 失效
    斜边缘电路板,​​带有通道连接器焊盘

    公开(公告)号:US5486657A

    公开(公告)日:1996-01-23

    申请号:US257755

    申请日:1994-06-09

    Abstract: A printed circuit board is provided having a beveled edge for ease of insertion into a receptor. The beveled edge is extended onto the solder mask to present a contiguous beveled surface. Moreover, the PCB includes bonding pads which can be surface mounted with pins extending from the receptor. Each bonding pad includes a forward portion and a rearward portion. The forward portion is covered with the solder mask layer to present a smooth surface channeled inward in a V-shaped configuration. The forward portion channels or directs the pin along a central axis near the apex of the V-shaped forward portion onto the upper surface of the bonding pad rearward portion. Accordingly, the pin is channeled to an area absent solder paste along the central axis such that during subsequent reflow operation the solder paste is reliably extended over and around the centrally placed pin.

    Abstract translation: 提供了一种印刷电路板,其具有倾斜边缘,以便于插入到受体中。 斜边缘延伸到焊接掩模上以呈现相邻的斜面。 此外,PCB包括可以从接收器延伸的针表面安装的接合焊盘。 每个焊盘包括前部和后部。 前面部分被焊接掩模层覆盖,以呈现呈V形构造向内的光滑表面。 前部部分将销钉沿着V形前部的顶点附近的中心轴线引导到接合垫后部的上表面上。 因此,引脚沿着中心轴被引导到没有焊膏的区域,使得在随后的回流操作期间,焊膏被可靠地延伸到中心放置的引脚上方和周围。

    Solder reflow mounting board
    126.
    发明授权
    Solder reflow mounting board 失效
    焊接回流安装板

    公开(公告)号:US5373113A

    公开(公告)日:1994-12-13

    申请号:US53699

    申请日:1993-04-29

    Applicant: Hideki Ishii

    Inventor: Hideki Ishii

    Abstract: A process for reflow mounting an electronic component includes coating a terminal electrode on a mounting board with a second solder having a second melting point higher than a reflow temperature, placing the mounting board with the electronic component on a mounting land on a conveyor which may be brought into contact with the second solder on the terminal electrode, and heating the mounting board to the reflow temperature. The terminal electrode may be coated with a solder repelling material at a selected dividing area effective for dividing the terminal electrode into a plurality of sections substantially isolated from each other in terms of solder flow. Alternatively, a mounting jig may be used for supporting the mounting board without bringing the second solder on the terminal electrode into contact with the mounting jig.

    Abstract translation: 一种用于回流焊安装电子部件的工艺包括:在具有第二熔点高于回流温度的第二焊料的安装板上涂覆端子电极,将具有电子部件的安装板放置在可以是 与端子电极上的第二焊料接触,并将安装板加热到回流温度。 端子电极可以在选择的分割区域涂覆有排斥材料,其有效地将端子电极分成在焊料流动方面彼此基本隔离的多个部分。 或者,可以使用安装夹具来支撑安装板,而不使端子电极上的第二焊料与安装夹具接触。

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