公开(公告)号：US20180177084A1

公开(公告)日：2018-06-21

申请号：US15380819

申请日：2016-12-15

Applicant: ARRIS Enterprises LLC

Inventor： Ti-Hsing Hsieh

IPC: H05K13/04 ,  H05K1/02 ,  F28F3/02 ,  F28D21/00

CPC classification number: H01L23/4093 ,  H05K1/0209 ,  H05K3/326 ,  H05K2201/066 ,  H05K2201/10265 ,  H05K2203/0165 ,  H05K2203/0195 ,  H05K2203/1509 ,  H05K2203/166

Abstract: A system is provided for installing a heatsink onto a circuit board. The heatsink has a base, a first hook and a second hook. The system includes a heatsink holder, a circuit board arm, a heatsink pusher, and a hook pusher. The heatsink holder is operable to receive the heatsink. The circuit board arm is operable to move the circuit board onto the heatsink received on the heatsink holder such that the bottom surface of the heatsink is adjacent to the circuit board. The heatsink pusher is operable to move the heatsink holder in a first direction so as to move the first hook relative to the first catch. The hook pusher is operable to push the first hook in a direction normal to the base from the top surface to the bottom surface.

公开(公告)号：US20180110121A1

公开(公告)日：2018-04-19

申请号：US15723375

申请日：2017-10-03

Applicant: IRISO ELECTRONICS CO., LTD.

Inventor： Yujiro Sugaya ,  Yuki Asanuma

IPC: H05K1/09 ,  H05K1/11 ,  H05K1/14 ,  H05K3/40 ,  H05K3/36

CPC classification number: H05K1/09 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49866 ,  H05K1/112 ,  H05K1/144 ,  H05K3/366 ,  H05K3/4038 ,  H05K2201/0338 ,  H05K2201/041 ,  H05K2201/09727 ,  H05K2201/098 ,  H05K2201/09827 ,  H05K2201/10265

Abstract: To provide a circuit board that is capable of establishing electrical connection, that is thinner, and that has a higher maintainability. A circuit board 100 includes a substrate 101 including a hole portion 110 that penetrates the substrate 101 in a plate thickness direction, and a connector region including a first conductor layer 202 that closes one side of the hole portion 110, liquid metal 210 disposed in a recess 201 formed by the hole portion 110 and the first conductor layer 202, and a sealing layer 212 that is the liquid metal 210 cured on a liquid surface side. The liquid metal 210 may be in contact with a second conductor layer 204 formed in the recess 201.

公开(公告)号：US20170351475A1

公开(公告)日：2017-12-07

申请号：US15537251

申请日：2016-01-05

Applicant: BARCO N.V.

Inventor： Karim MEERSMAN ,  Greet ADAMS

IPC: G06F3/14 ,  H05K1/02 ,  G09G3/32

CPC classification number: G06F3/1446 ,  G09G3/32 ,  G09G2300/026 ,  G09G2320/0233 ,  G09G2320/0242 ,  G09G2330/02 ,  G09G2380/02 ,  H05K1/028 ,  H05K3/365 ,  H05K2201/041 ,  H05K2201/10106 ,  H05K2201/10265 ,  H05K2201/10318

Abstract: A tiled display including discrete luminous sources distributed over at least two adjacent flexible display tiles, each of the flexible display tiles being configured to drive the discrete luminous sources on it when connected to a power supply and when receiving data and control signals. The power, data and control signals are provided to the tiles through conducting tracks formed on a carrier substrate, where an electrical connection between a first conductor on the carrier substrate and a second conductor on a tile is established by using a connecting element having a resilient means keeping it pressed and in contact with a surface of the first conductor or second conductor. Additionally, a carrier substrate and to a flexible display tile for use in such tiled displays.

公开(公告)号：US20170311451A1

公开(公告)日：2017-10-26

申请号：US15641057

申请日：2017-07-03

Applicant: Quartzdyne, Inc.

Inventor： Mark Hahn

IPC: H05K3/10 ,  B23K9/09 ,  B23K9/167 ,  H05K1/18 ,  B23K26/21 ,  B23K26/0622 ,  H05K3/32 ,  H01L23/00

CPC classification number: H05K3/103 ,  B23K9/0043 ,  B23K9/091 ,  B23K9/092 ,  B23K9/167 ,  B23K9/23 ,  B23K26/0622 ,  B23K26/21 ,  B23K26/22 ,  B23K26/32 ,  B23K2101/38 ,  B23K2103/00 ,  H01L23/49811 ,  H01L24/02 ,  H01L24/05 ,  H01L24/07 ,  H01L24/08 ,  H01L24/09 ,  H01L24/42 ,  H01L24/44 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/02163 ,  H01L2224/02185 ,  H01L2224/04042 ,  H01L2224/45147 ,  H01L2224/45639 ,  H01L2224/48476 ,  H01L2224/80007 ,  H01L2224/80009 ,  H01L2224/8019 ,  H01L2224/8034 ,  H01L2924/00014 ,  H05K1/18 ,  H05K3/328 ,  H05K2201/10242 ,  H05K2201/10265 ,  H05K2201/10287 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A method of forming a microelectronic device structure comprises coiling a portion of a wire up and around at least one sidewall of a structure protruding from a substrate. At least one interface between an upper region of the structure and an upper region of the coiled portion of the wire is welded to form a fused region between the structure and the wire.

公开(公告)号：US09799975B2

公开(公告)日：2017-10-24

申请号：US15164198

申请日：2016-05-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Juneseok Park

IPC: H01R13/60 ,  H01R12/79 ,  H05K3/32 ,  H01R12/77 ,  H01R12/71 ,  H01R13/24 ,  H01R13/62

CPC classification number: H01R12/79 ,  H01R12/714 ,  H01R12/771 ,  H01R13/24 ,  H01R13/6205 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/1031 ,  H05K2203/104 ,  Y02P70/611

Abstract: An electronic device may include: a printed circuit board (PCB); a plurality of electronic components electrically connected to the PCB; and a connection member comprising a first portion fixed to one of the PCB and an electronic component and a second portion magnetically connected to the other one of the PCB and the electronic component. The second portion of the connection member may be moveably connected to the first portion. The connection member may further include a stopper, and may be designed to minimize the repulsive force provided by the connection member when excessive pressure is applied to the electronic device.

公开(公告)号：US09705216B2

公开(公告)日：2017-07-11

申请号：US15350239

申请日：2016-11-14

Applicant: GE Aviation Systems Limited

Inventor： Denis Vaughan Weale ,  Julian Peter Mayes

IPC: H01R12/00 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H01R13/658 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01R12/7088 ,  H01R12/718 ,  H01R13/2414 ,  H01R13/658 ,  H05K1/0216 ,  H05K1/0263 ,  H05K1/181 ,  H05K3/4015 ,  H05K2201/0314 ,  H05K2201/10265 ,  H05K2201/10272 ,  H05K2201/1031 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/10757 ,  H05K2201/2036 ,  Y02P70/611

Abstract: The present embodiments relate to providing electrical connectivity to electric-powered components mounted in parallel on a wiring board. An electrical apparatus is provided in which electricity is conducted from an electrically conductive member onto first and second electrically conductive pathways, of a wiring board through the use of first and second resiliently-deformable electrically conductive connectors. First and second electric-powered components are mounted to the respective first and second electrically conductive pathways. The first and second resiliently-deformable electrically conductive connectors are compressed between the electrically conductive member and the wiring board such that the first connector provides an electrical connection between the conductive member and the first electrically conductive pathway, and the second connector provides an electrical connection between the conductive member and the second electrically conductive pathway.

公开(公告)号：US20170094780A1

公开(公告)日：2017-03-30

申请号：US15230596

申请日：2016-08-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dae-woong CHO ,  Dong-keun KIM ,  Sung-woo KIM ,  Hyeong-gwon KIM ,  Ji-hoon PARK

IPC: H05K1/02 ,  H01F27/29 ,  H01F27/28 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0216 ,  H01F17/02 ,  H01F27/2804 ,  H01F27/2823 ,  H01F27/2828 ,  H01F27/292 ,  H01F27/324 ,  H01F2027/2809 ,  H05K1/0225 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/049 ,  H05K2201/1003 ,  H05K2201/10265

Abstract: A circuit board for a power supply, an electronic apparatus including the same, and an inductor device are provided. The circuit board includes a first pattern arranged on a first layer of the circuit board and including a first terminal coupled to a coil, a first layer region arranged on the first layer, the coil being disposed on the first layer region, and a second pattern arranged on a second layer of the circuit board, below the first layer. The second pattern includes a first blank region located below the first layer region, and has no conductive material arranged thereon.

公开(公告)号：US09445491B2

公开(公告)日：2016-09-13

申请号：US14231372

申请日：2014-03-31

Applicant: Apple Inc.

Inventor： Gregory N. Stephens ,  Matthew D. Hill ,  Scott A. Myers

IPC: H01R4/66 ,  H05K1/02 ,  H01R12/57 ,  H01R4/64

CPC classification number: H05K1/0215 ,  H01R4/64 ,  H01R12/57 ,  H01R2201/06 ,  H05K2201/10265 ,  Y10T29/4913

Abstract: The described embodiments relate generally to use of an electrically conductive member, such as a grounding spring, used to electrically ground components on a printed circuit board as well as provide mechanical protection to the components. More particularly, a method and apparatus for attaching a grounding spring to multiple locations on the printed circuit board are disclosed. In one embodiment, the grounding spring can act as both a ground and a mechanical protection element for other surface mounted components disposed on the printed circuit board.

Abstract translation: 所描述的实施例大体上涉及用于电气接地印刷电路板上的部件的导电部件，例如接地弹簧，以及为部件提供机械保护。 更具体地，公开了一种用于将接地弹簧连接到印刷电路板上的多个位置的方法和装置。 在一个实施例中，接地弹簧可以用作布置在印刷电路板上的其它表面安装部件的接地和机械保护元件。

公开(公告)号：US20160143125A1

公开(公告)日：2016-05-19

申请号：US14546494

申请日：2014-11-18

Applicant: Cisco Technology, Inc.

Inventor： Long Dang ,  Don Nguyen ,  Michael Brooks

IPC: H05K1/02 ,  F16B2/24 ,  H05K3/22

CPC classification number: H05K7/2039 ,  F16B2/248 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/181 ,  H05K3/22 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10265 ,  H05K2201/10393

Abstract: In one embodiment, a printed circuit board has a hole. The hole has a longest extent on a surface of the printed circuit board. A clip is held in the hole by feet of prongs. The feet are extensions each having a length that is more than half the longest extent of the hole. A heat sink is held, in part, relative to the printed circuit board by the clip. A part of the heat sink contacts a loop of the clip and applies a force on the clip directed away from the printed circuit board. The feet of the clip on an opposite side of the printed circuit board than the heat sink hold the clip to the printed circuit board to counteract the force. The prongs are configured to offset the feet such that the extensions overlap with the lengths extending along the longest extent of the hole by less than a sum of the lengths of the feet and less than the longest extent for insertion through the hole.

Abstract translation: 在一个实施例中，印刷电路板具有孔。 该孔在印刷电路板的表面上具有最长的程度。 夹子通过脚的脚插在孔中。 脚是具有长度超过孔的最长程度的一半的延伸部。 散热器部分地通过夹子相对于印刷电路板保持。 散热器的一部分接触夹子的环，并且将夹子施加在远离印刷电路板的夹子上。 印刷电路板相对于散热器的夹子的脚将夹子固定到印刷电路板上以抵抗力。 所述插脚构造成抵消所述脚，使得所述延伸部与沿着所述孔的最长延伸部分延伸的长度小于所述脚的长度的总和小于通过所述孔插入的最长程度。

公开(公告)号：US20160120024A1

公开(公告)日：2016-04-28

申请号：US14881567

申请日：2015-10-13

Applicant: IRISO ELECTRONICS CO., LTD.

Inventor： Jun Oguro

IPC: H05K1/02 ,  H01R4/48 ,  H01R12/55

CPC classification number: H05K1/0213 ,  H01R4/48 ,  H01R4/4818 ,  H01R12/515 ,  H01R12/55 ,  H01R12/57 ,  H01R13/111 ,  H05K1/184 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2201/10295

Abstract: A linear conductor connection terminal that is fixed to a substrate and that comes in contact in a conductive manner with a linear conductor that is inserted in a hole portion provided in the substrate. The linear conductor connection terminal includes a contact portion that is positioned inside the hole portion and that comes in contact in the hole portion with the linear conductor in a conductive manner; an elastic piece that elastically supports the contact portion; a top surface portion provided so as to be spaced apart from the contact portion in an insertion direction of the linear conductor, the top surface portion including an insertion hole to introduce the linear conductor to the contact portion; and a first leg portion and a second leg portion that support the top surface portion that is spaced apart from the contact portion.

Abstract translation: 一种线性导体连接端子，其固定到基板并且以导电方式与插入设置在基板中的孔部分中的线性导体接触。 线状导体连接端子包括位于孔部内部并以导电方式与线状导体接触的接触部， 弹性片，其弹性地支撑所述接触部; 所述顶表面部分设置成在所述线状导体的插入方向上与所述接触部分间隔开，所述顶表面部分包括用于将所述线性导体引入所述接触部分的插入孔; 以及第一腿部和第二腿部，其支撑与接触部分间隔开的顶表面部分。